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Notice
2025 International Conference on Electronics Packaging joined with iMAPS All Asia Conference (ICEP-IAAC 2025) from April 15 to 19, 2025 in Nagano, Japan.
The IAAC Special Session will be held on the afternoon of April 15th.
The theme will be "3D chiplet technologies for automotive/AI applications".
The abstract deadline has been extended until November 7.
We look forward to your contributions.
We are waiting for your abstract submission.
Call for Papers flyer: Download
ICEP 2025 abstract template and detail instructions: Download
The abstract submission deadline is October 31, 2024.
The abstract deadline has been extended until November 7, 2024.
We would like to ask you to prepare an abstract using the template. The abstract should contain about 1 page of text and 1 page for supporting figures and tables, with a total length of 2 pages at maximum. You must include the novel, original, and unpublished contents and state the purposes, methods, results, and conclusions clearly in the abstract.
Thank you very much for your contribution!