ICEP2017 Advance Program

April 19
A B C D E
12:30



13:10		 Award Ceremony
13:10



14:10		 Keynote Lecture
Reinventing the Technology Roadmap
William T. Chen, ASE Group
14:10



15:10		 Keynote Lecture
Organic LEDs for Displays and Lighting
Junji Kido, Yamagata University
15:10

16:10		 Poster Session / Break
16:10


17:10		 Keynote Lecture
3D-Integration and Wafer Bonding for MEMS Packaging: Overview and examples 
Joerg Froemel, Tohoku University
17:10


18:10		 Keynote Lecture
Converter-in-Package: Realising the Potential of Wide Band-Gap Power Electronics
C Mark Johnson, University of Nottingham
18:30

20:30		 Welcome Reception
Takinoyu Hotel


April 20
A B C D E
9:00 TA1: IMAPS Session: The New Shape of Electronics: Functional 3D Additive Manufacturing
TA1-1 <Session Invited>
Printed Electronics and Additive Packaging for Microwave Applications
Craig Armiento1,2, Susan Trulli2, Alkim Akyurtlu1, Elicia Harper1,2, Mahdi Haghzadeh1, Christopher Laighton2, 1University of Massachusetts Lowell,
2Raytheon Integrated Defense Systems / USA

 TB1: Advanced Packaging-1
TB1-1 <Session Invited>
Low Temperature Direct Cu Bonding for MEMS Packaging
Jenn-Ming Song1, Sin-Yong Liang1, Po-Hao Chiang1, Shang-Kun Huang2, Ying-Ta Chiu2, David Tarng2, Chih-Pin Hung2, Jing-Yuan Lin3, 1National Chung Hsing University, 2Advanced Semiconductor Engineering Group, 3Industrial Technology Research Institute / Taiwan		 TC1: Materials and Processes-1
TC1-1
Effect of Size and Shape of Ag Particles for Mechanical Properties of Sintered Ag Joints Evaluated by Micro-compression Test
Chuantong Chen1, Shijo Nagao1, Tohru Sugahara1, Hao Zhang1, Jinting Jiu1, Katsuaki Suganuma1, Tomohito Iwashige2, Kazuhiko Sugiura2, Kazuhiro Tsuruta2, 1Osaka University, 2DENSO / Japan
 TD1: Thermal Management-1
TD1-1
Improvement of Cooling Performance of Impinging Air by Intermittent Flow Control - relationship between nozzle diameter and cooling performance
Taiki Furusawa1, Takashi Fukue1, Hidemi Shirakawa2, Koichi Hirose1, 1Iwate University, 2National Institute of Technology / Japan

 TE1: RF
TE1-1 <Session Invited>
CMOS Class-E Power Amplifier Module with CPW Bonding Wires for 5GHz Application
Haruichi Kanaya, Kyushu University / Japan
TA1-2 <Session Invited>
The Next Generation EDA System for 3D Printing Technologies
Kazuhiro Kariya, Zuken / Japan		 TB1-2
Solder Joint Reliability Analysis for Large Size WLCSP
Meng-Kai Shih, Hsin-Chih Shih, Ying-Chih Lee, David Tarng, CP Hung, Advanced Semiconductor Engineering (ASE) / Taiwan		 TC1-2
Study on Influence of Under-fill Material Properties on the Reliability of FC-BGA
Kouji Hamaguchi, Hisato Takahashi, Naoya Suzuki, Hitachi Chemical / Japan		 TD1-2
Heat Transfer Performance of Uni-directional Porous Heat Sink for Cooling of Next Generation On-vehicle Inverter
Kio Takai, Kohei Yuki, Kazuhisa Yuki, Risako Kibushi, Noriyuki Unno,  Tokyo University of Science -Yamaguchi / Japan

 TE1-2
Transmission Line Signal Radiation Pattern by Near-Field Measurement
Min Chou, Kai-Wen Liang, Meng-Hua Tu, Sung-Mao Wu, National University of Kaohsiung / Taiwan
TA1-3 <Session Invited>
Functional Inkjet 3D Printing System for Customized Electronics
Kenji Tsukada, Akihiro Kawajiri, Yoshitaka Hashimoto, Katsuaki Makihara, Ryojiro Tominaga, Masatoshi Fujita, Takeshi Sato, Fuji Machine Mfg. / Japan		 TB1-3
Parameters Study of Thermomechanical Reliability of Board-level Fan-out Package
Mengkai Shih, Ying-Chih Lee, Ryan Chen, David Tarng, CP Hung, Advanced Semiconductor Engineering / Taiwan

TD1-3
Comparison of Thermal Properties Between Si and SiC Power MOSFET using Electro-Thermal Analysis
Risako Kibushi1, Tomoyuki Hatakeyama2, Kazuhisa Yuki1, Noriyuki Unno1, Masaru Ishizuka2, 1Tokyo University of Science -Yamaguchi, 2Toyama Prefectural University / Japan

 TE1-3
A Cross Type of Unbalanced Dipole Antenna with the Bent Type of Semicircular and Trapezoidal Radiating Elements
Tomohiro Yamada1, Fukuro Koshiji1, Yudai Nagatsu1, Kohji Koshiji2, 1Tokyo Polytechnic University, 2Tokyo University of Science / Japan
10:40 TA1-4 <Session Invited>
Panel Discussion		 TB1-4
Folded Flexible Printed Circuit Module for Hearing Aids
John Dzarnoski, Susie Johansson, Starkey Hearing Technologies / USA

TD1-4
Thermal Management of Silicon Micro Robot Driven by Neural Networks IC control SMA Actuator
Minami Takato, Yuya Nakata, Yuto Uchiumi, Taisuke Tanaka, Ken Saito, Fumio Uchikoba, Nihon University / Japan		 TE1-4
A Self-Complementary Antenna for WLAN and WiMAX Applications Using Traditional Molding Skills and Techniques
Atsushi Maeda, Tsuyoshi Haga, Yoshiteru Watanabe, Yuichi Abe, IBUKI / Japan
Break
10:50 TA2: Taiwan Session TB2:Advanced Packaging-2 TC2: Materials and Processes-2 TD2: Thermal Management-2 TE2: Optoelectronics
TA2-1 <Session Invited>
Reliability Assessment using Modified Energy Based Model for WLCSP Solder Joints
Cheng Yen Tsou, Tien Ning Chang, Kai Chiang Wu, Kuo Ning Chiang, National Tsing Hua University / Taiwan 		TB2-1 <Session Invited>
Innovative Laser Enabled Dual Damascene Process for Ultra-fine Line Multi-layer Routing for Advanced Packaging
Habib Hichri, Seongkuk Lee, Markus Arendt, Suss MicroTec Photonic Systems / USA		 TC2-1
An Investigation on Ultrathin Wafer Dicing by Ultrafast Laser with High Density Plasma Etching
Shih-Jeh Wu1, Hsiang-Chen Hsu1, Wen-Fei Lin1,2, Shen-Li Fu1, 1I-Shou University, 2E&R Engineering / Taiwan		 TD2-1
Immersion Cooling Technology of SiC-based On-vehicle Inverter by Anti-freezing Liquid with Subcooled Boiling
Tianyu Ma, Kazuhisa Yuki, Tadashi Furusho, Kibushi Risako, Noriyuki Unno, Koichi Suzuki, Tokyo University of Science-Yamaguchi / Japan		 TE2-1
High Density Optical and Electrical Interfaces for Chip-scale Silicon Photonic Receiver
Koichi Takemura1, Yasuhiro Ibusuki1, Akio Ukita1, Mitsuru Kurihara1, Keizo Kinoshita1, Daisuke Okamoto1, Junichi Fujikata1, Kenichiro Yashiki1, Yasuyuki Suzuki1, Tsuyoshi Horikawa1,2, Tohru Mogami1, Kazuhiko Kurata1, 1Photonics Electronics Technology Research Association, 2National Institute of Advanced Industrial Science and Technology / Japan
TA2-2 <Session Invited>
Innovated Ultra-thin and Super Fine-pitch Panel RDL Substrate Manufacturing for Advanced Package
Yu-Hwa Chen, Puru Bruce Lin, Cheng-Ta Ko, Tzyy-Jang Tseng, Unimicron Technology / Taiwan		 TB2-2
Study of Influence of Mechanical Property of Temporary Bonding Adhesive on Warpage of FO-WLP
Keisuke Nishido, Kouji Hamaguchi,  Masaaki Takekoshi, Naoya Suzuki, Toshihisa Nonaka, Hitachi Chemical / Japan		 TC2-2
Real Time X-ray Imaging of Soldering Processes at the SPring-8 Synchrotron
Kazuhiro Nogita1, Arif Salleh2, Guang Zeng3, Stuart McDonald1, Christopher Gourlay3, Hideyuki Yasuda4, 1The University of Queensland / Australia, 2Universiti Malaysia Perlis / Malaysia, 3Imperial College / UK, 4Kyoto University / Japan

 TD2-2
Advanced Cooling Technology via Boiling Heat Transfer Considering the Wettability of a Heating Surface
Noriyuki Unno1, Xiang-Yi Jia1, Kazuhisa Yuki1, Risako Kibushi1, Shin-ichi Satake2, Koichi Suzuki2, 1Tokyo University of Science- Yamaguchi, 2Tokyo University of Science / Japan		 TE2-2
Integration of Optical Interconnect for Servers - packaging approach toward near-CPU optics
Yoichi Taira, Keio University / Japan
TA2-3 <Session Invited>
Low Temperature Interconnect Fabrication using Submicron/Nano Metallic Particles
Jenn-Ming Song, Chi-Nan Cheng, Guo-Lun Huang, National Chung Hsing University / Taiwan		 TB2-3
Effect of External Bending Stress on Device-Embedded Substrate
Katsumi Miyama1, Yoshihisa Katoh2, 1Hokkaido University of Science, 2Fukuoka University / Japan		 TC2-3
Fabrication of Self-Standing Curved Film with Pillar Arrays by Large Area Spherical Soft-UV Imprint Lithography
Takumi Kamibayashi, Hiroyuki Kuwae, Atsuki Nobori, Shuichi Shoji, Jun Mizuno, Waseda University

 TD2-3
Cooling Augmentation of Subcooled Boiling Liquid by a Nano-particle Coated Surface
Yoshito Iwanaga, Kazuhisa Yuki, Noriyuki Unno, Risako Kibushi, Koichi Suzuki, Tokyo University of Science Yamaguchi / Japan

 TE2-3
Packaging of UV LED with a Stacked Silicon Reflector for Converged UV Emission
Xing Qiu, Jeffery C. C. Lo, S. W. Ricky Lee, Hong Kong University of Science and Technology / Hong Kong
12:30 TA2-4 <Session Invited>
Fine Line Fan Out Package on Panel Level
Daniel Fann, David Fang, Jeffery Chiang, Kevin Huang Powertech Technology / Taiwan
TC2-4
Fine Pitch Plating Resist for High Density FO-WLP
Makoto Katsurayama, Hirokazu Ito, Hisanori Akimaru, Tomoyuki Matsumoto, Hirokazu Sakakibara, Kenji Okamoto, Koichi Hasegawa, JSR / Japan		 TD2-4
Liquid-Gas Heat Exchanger for Low Pressure Refrigerant Application
Nirmal-Singh Rajput, Asuka Matsuba, Hisato Sakuma, Minoru Yoshikawa, NEC / Japan		 TE2-4
Design and Fabrication for Low Loss Channel-Shuffling Polymer Waveguides
Kohei Abe, Yoichi Taira, Takaaki Ishigure, Keio University / Japan
Lunch Time
13:30 TA3: Korea Session TB3: Power Electronics Integration-1 TC3: Materials and Processes-3 TD3: Interconnection-1 TE3: DMR-E

TA3-1 <Session Invited>
Preparation and Properties of Passivation Film Layers Spray Coated Flexible Cu(In,Ga)Se2 Solar Cells
Sang Hee Lee, Byung Min Park, Hyun Sik Kim, Ho Jung Chang, Dankook University / Korea		 TB3-1
Silver Sinter Joining for WBG Die-attach
Katsuaki Suganuma1, Shijo Nagao1, Toru Sugahara1, Hao Zhang1, Chuantong Chen1, Toshiyuki Ishina1, Jinting Jiu1,2, 1Osaka University, 2Senju / Japan
 TC3-1 <Session Invited> 50min
Corundum-strructured α-Ga2O3-based Alloys for Future Power Device Applications
Kentaro Kaneko1,2, Masaya Oda2, Toshimi Hitora2, Shizuo Fujita1, 1Kyoto University, 2FLOSFIA / Japan
 TD3-1
Flip Chip Joining with Low Temperature Solders and Thermal Gradient Bonding
Toyohiro Aoki, Eiji Nakamura, Takashi Hisada, Mori Hiroyuki Mori, Shintaro Yamamichi, IBM Japan / Japan 		TE3-1
Comprehensive Analysis on SCM Specifications for High-
Performance SCM/NAND Flash Hybrid SSD with Through-Silicon Via
Tomoaki Yamada, Atsuya Suzuki, Yusuke Sugiyama, Chihiro Matsui, Ken Takeuchi, Chuo University / Japan
TA3-2 <Session Invited>
Formation of Through-Silicon-Vias by Tin Filling Processes using Pressure Infiltration and Electrodeposition/Reflow
Donghyun Park, Jae-Hwan Kim, Tae Sung Oh, Hongik University / Korea 		TB3-2
Laserbonding instead of Ultrasonic Wire Bonding - an alternative joining technology for power applications
Josef Sedlmair1, Benjamin Mehlmann1, Alexander Olowinsky2, 1F&K Delvotec Bondtechnik, 2Fraunhofer IZM / Germany
TD3-2
Effects of Cu Plating Formulas on the Solder Joint Reactions
Shang-Wei Chi, Hsuan Lee, Chih-Ming Chen, National Chung Hsing University / Taiwan		 TE3-2
A Study on Frequency Dispersion of Transmission Characteristics of Shielded-Flexible Printed Circuits
Yoshiki Kayano1, Hiroshi Inoue2, 1The University of Electro-
Communications, 2The Open University of Japan - Akita Study Center / Japan
TA3-3 <Session Invited>
Effects of Ultrasonic Process on the Adhesion of Cu/Non-Conductive PCB Substrates in Electroless Copper Plating
Ju-Seok Kang1, Jinuk Lee2, Hyun-Woo Kwon2, Jae-Ho Lee1, 1Hongik Univeristy, 2Samsung Electro-Mechanics / Korea		 TB3-3
First Failure Point of a SiC Power Module with Sintered Ag Die-Attach on Reliability Tests
Kazuhiko Sugiura1,2, Tomohito Iwashige1, Kazuhiro Tsuruta1, Chuantong Chen2, Shijo Nagao2, Hao Zhang2, Tohru Sugahara2, Katsuaki Suganuma2, 1Denso, 2Osaka University / Japan

 TC3-2
Electroless Ni-P Plating Applicable to Fine Pattern
Hiroki Seto, Toshiya Murata, Okuno Chemical Industries / Japan		 TD3-3
Effect of Ag-11Au-4.5Pd Alloy Bonding Wire Properties and Structure on Bond Strengths and Reliability
Jun Cao1,2, JunLing Fan3, WeiBin Gao1, 1HeNan Polytechnic University, 2HeNan Youk Electronic Material, 3Jiaozuo University / China

 TE3-3
High Impedance Design and Investigation Using TDR for Fine Lines on High Density Organic Substrate
Hung-Chun Kuo, Fu-Chen Chu, Chen-Chao Wang, Chih-Pin Hung, Advanced Semiconductor Engineering / Taiwan
15:10 TA3-4 <Session Invited>
Electroplating for the Ni Probe Tip
Nam Gil Kim, Yong-Bin Sun, Kyonggi University / Korea

 TB3-4
High Temperature SiC Power Device Realized by Electroless Plating Diffusion Barrier for Ag Sinter Die-attach
Shinya Seki1,2, Akio Shimoyama1, Hao Zhang1, Seigo Kurosaka3, Takuo Sugioka4, Hirofumi Fujita1, Keiji Yamamura1, Tetsuro Muramatsu1, Tohru Sugahara1, Shijo Nagao1, Katsuaki Suganuma1, 1Osaka University, 2Toray Research Center, 3Uyemura, 4Nippon Shokubai / Japan		 TC3-3
The Study of Nano Anchoring Copper Foil for PWB
Makiko Sato, Naoki Obata, Yoshinobu Kokaji, Ken Okubo, Osamu Suzuki, NAMICS / Japan



Poster Session / Break
16:10 TA4: iNEMI Session TB4: Power Electronics Integration-2 TC4: Materials and Processes-4 TD4: Interconnection-2 TE4: DMR-Mechanical
TA4-1 <Session Invited>
Technology Roadmap Overviews and Future Direction through Technology Gaps
Chuck Richardson1, Masahiro Tsuriya2, Haley Fu3, 1iNEMI / USA, 2iNEMI / Japan, 3iNEMI / China
 TB4-1 <Session Invited>
Reliability of POL-kw Power Modules
Liang Yin1, Kaustubh Nagarkar1, Arun Gowda1, Christopher Kapusta1, Risto Tuominen2, Paul Gillespie1, Donna Sherman1, Tammy Johnson1, Shingo Hayashibe3, Hitoshi Ito3, Tadashi Arai3, 1GE Global Research / USA, 2Consultant to GE Global Research / USA, 3SHINKO ELECTRIC INDUSTRIES / Japan
 
 TC4-1
Low Temperature Direct Bonding of Polyoxymethylene (POM) through Self Assembled Monolayers (SAM)
Weixin Fu, Hiroyuki Kuwae, Bo Ma, Shuichi Shouji, Jun Mizuno, Waseda University / Japan		 TD4-1 <Session Invited>
Surface-activated Bonding of III-V Compound Semiconductors and Si for Fabricating Hybrid Tandem Solar Cells
Naoteru Shigekawa, Jianbo Liang, Osaka City University /Japan

 TE4-1
Canary Devices for Through- Silicon Vias - a condition monitoring approach
Kathleen Jerchel1, Arian Grams2, Nils F. Nissen2, Tadatomo Suga1, Klaus-Dieter Lang2,3, 1The University of Tokyo / Japan, 2Fraunhofer Institute for Reliability and Microintegration, 3Technische Universität Berlin / Germany
TA4-2
Relative Humidity Dependence of Creep Corrosion on Printed Circuit Boards
Prabjit Singh1, Larry Palmer1, Dem Lee2, Jeffrey Lee2, Karlos Guo3, Julie Liu3, Simon Lee4, Geoffrey Tong4, Chen Xu5, Debbie Fleming5, Haley Fu6, 1IBM / USA, 2iST-Integrated Service Technology / Taiwan, 3Lenovo (Beijing) / China, 4The Dow Chemical / Taiwan and Hong Kong, 5Nokia / USA, 6iNEMI / China

 TB4-2
Packaging IGBT Modules by Rapid Sintering of Nanosilver Paste in a Current Way
Yijing Xie1, Yunhui Mei1, Shuangtao Feng1, Pu Zhang2, Long Zhang3, Yingkun Yang3, 1Tianjin University,
2Chinese Academy of Sciences,
3China Academy of Engineering Physics / China

TC4-2
Cu-Sn Based Joint Material Having IMC Forming Control Capabilities
Hiroaki Ikeda1,2, Shigenobu Sekine1, Ryuji Kimura1, Koichi Shimokawa1, Keiji Okada1, Hiroaki Shindo1, Tatsuya Ooi1, Rei Tamaki1, Makoto Nagata2, 1Napra, 2Kobe University / Japan		 TD4-2
Role of Bi in Microstructure Formation of Sn-Cu-Ni Based BGAs on Cu Metallizations
Sergey Belyakov1, Takatoshi Nishimura2, Tetsuya Akaiwa2, Keith Sweatman2, Christipher Gourlay1, 1Imperial College London / UK, 2Nihon Superior / Japan		 TE4-2
A MEMS-based Measurement Approach for Contact Normal Force Measurement in Crimp Terminals
Soeren Majcherek1, Aman Alexander2, Joerg Fochtmann1, 1Otto-von-Guericke University, 2University of Applied Science Brandenburg / Germany
TA4-3
Inspection/ Metrology Benchmarking on Fine Pitch Design Substrate for Advanced Packages
Feng Xue1, Hiroyuki Watanabe2, Cindy Han3, Charles Reynolds4, Thomas Wassick4, Glenn Pomerantz4, Masahiro Tsuriya5
1IBM Systems Supply Chain Engineering / Singapore, 2Ibiden / Japan, 3Wistron / Taiwan, 4IBM Systems Packaging Development / USA, 5iNEMI / Japan

 TB4-3
Packaging Technology of Power Module for Automotive Applications
Ayako Shimoduma1, Hiromasa Hayashi1, Shingo Higuchi1, Yoshitsugu Sakamoto1, Sakie Okada2, 1Denso, 2Senju Metal Industry / Japan		 TC4-3
The Effect of Surface Activation Process for the GaAs Device Properties
Masahisa Fujino1, Nobuto Managaki2, Hiroshi Yamada2, Tadatomo Suga1, 1The University of Tokyo, 2Toshiba / Japan
TE4-3
Novel Wafer Level Packaging for Large Die Size Device
Tien-Ning Chang, Cheng-Yen Tsou, Bao-Hsiung Wang, Kou-Ning Chiang, National Tsing Hua University / Taiwan
TA4-4
High-Temperature Pb-Free Die Attach Material Project Phase 1: Survey Result
Lim Sze Pei1, Binghua Pan2, Hongwen Zhang1, Wayne Ng3, Bosgum Wu4, Kim S. Siow5, Sayalee Sabne6, Masahiro Tsuriya7, 1Indium / Singapore/ USA, 2Delphi Automotive Systems Singapore / Singapore, 3Nihon Superior / Japan, 4Wistron / Taiwan, 5Universiti Kebangsaan Malaysia / Malaysia, 6Flex / USA, 
7iNEMI / Japan		 TB4-4
Microstructural Homogeneity of Sintered Ag Joint after Pressureless Sintering Process
Hao Zhang, Chuantong Chen, Jinting Jiu, Shijo Nagao, Katsuaki Suganuma, Osaka University / Japan
TE4-4
Investigation of the Warpage Modeling Technique for Thick Multi-chip Module Encapsulated by Compression Molding
Kosuke Suzuki, Yuki Sanada, Shinya Uchibori,  Atsushi Kashiwazaki, Masaji Imada, Denso / Japan
18:15 TB4-5
Thermal Resistance Evaluation of Die-attachment Made of Nano-composite Cu/Sn TLPS Paste in SiC Power Module
Fumiki Kato1, Fengqun Lang1, Hiroshi Nakagawa1, Hiroshi Yamaguchi1, Ryuuji Kimura2, Keiji Okada2, Hiroaki Shindo2, Tatsuya Ooi2, Rei Tamaki2, Shigenobu Sekine2, Hiroshi Sato1, 1National Institute of Advanced Industrial Science and Technology, 2Napra / Japan                                 



April 21
A B C D E
9:00 FA1: IEEE CPMT Session: Heterogeneous Integration Roadmap FB1: Materials and Processes-5 FC1:Thermal Management-3 FD1: Printed Electronics-1 FE1: N-MEMS
FA1-1 <Session Invited> 50min.
Heterogeneous Integration Roadmap
William Chen1, W.R Bottoms2, 1ASE Group, 23MTS / USA
FB1-1
High Thermal Sintering Die Attach for Power Device
Kyeongsool Seong, Toshihiro Iwasaki, Takashi Nakamura, Shotaro Sakumoto, Fumihiko Taniguchi, J-Devices / Japan		 FC1-1
Relationship between Vacuum Degree and Measurement Accuracy of Thermal Conductivity using Quasi-Steady State Measurement
Jumpei Hatakeyama, Koichi Hirose, Michimasa Uchidate, Takashi Fukue, Iwate University / Japan

 FD1-1 <Session Invited> 50min
Developments of High Precision Printing Processes for Fabricating the Flexible Electronics
Hirobumi Ushijima, Yasuyuki Kusaka, Mariko Fujita, Ken-ichi Nomura, Shusuke Kanazawa, Yoshinori Horii, Koji Abe, Noritaka Yamamoto, National Institute of Advanced Industrial Science and Technology / Japan
 FE1-1 <Session Invited>
Mouthguard Biosensor Integrated with Wireless Module for Monitoring Human Oral Information
Takahiro Arakawa, Keisuke Tomoto, Zhiwei Zhang, Hiroki Nitta, Koji Toma, Shuhei Takeuchi, Toshiaki Sekita, Shunsuke Minakuchi, Kohji Mitsubayashi, Tokyo Medical and Dental University / Japan
FA1-2 
Panel Discussion		 FB1-2
Improved Adhesion of Plating Copper Metal on Various Substrates by Controlled Interface of Ag Nanoparticles and Thin Polymer Layer
Norimasa Fukazawa, Wataru Fujikawa, Akira Murakawa, Jun Shirakami, DIC / Japan

 FC1-2
Embedded Heat Pipes as Thermal Solution for PCBs
Jonathan Silvano de Sousa1, Paul Fulmek2, Michael Unger2, P. Haumer2, Johann Nicolics2, 1AT&S Austria Technologie & Systemtechnik, 2Technische Universit¨at Wien / Austria
 FE1-2
Wireless Monitoring of Mouse by Ultra-small and Low Power Implantable Sensor Node
Jian Lu1, Kouichi Serizawa1, Mizuho Sato2, Lan Zhang1, Ryutaro Maeda1, Atsushi Toyota2, 1AIST, 2 Ibaraki University / Japan
FB1-3
Caltrop Cupric Oxide Particles Synthesized by X-ray Photochemical Reaction
Akinobu Yamaguchi1, Ikuo Okada2, Takao Fukuoka1, Yuichi Utsumi1, 1University of Hyogo, 2Nagoya University / Japan		 FC1-3
A Study of Temperature Rise of Small Chip Components in case of Dense Mounting
Yoshinori Aruga1, Koichi Hirasawa1, Hirotoshi Aoki2, Tomoyuki Hatakeyama2, Shinji Nakagawa2, Masaru Ishizuka2, 1KOA, 2Toyama Prefectural University / Japan

 FD1-2 <Session Invited>50min
Newly Developed Silver Nanoparticle Ink for Organic TFT Circuits Fabricated with High Resolution Printing System
Daisuke Kumaki1,2, Shizuo Tokito1,2, 1Yamagata University, 2Future Ink / Japan		 FE1-3
Development of High Resolution Electrostatic Tactile Display
Hiroki Ishizuka, Katsuyori Suzuki, Kyohei Terao, Hidekuni Takao, Husao Shimokawa, Kagawa University / Japan
10:40
FB1-4
Effect of Molecular Weight of PVA on the Reactivity and Stability Behavior of Adhesive
Yu-Chen Kao, Meei-Yu Hsu, Yi-Chun Chen, Kai-Chi Chen, Industrial Technology Research Institute / Taiwan		 FC1-4
Basic Investigation of Cooling Performance at Upstream Side of Bend to Develop 1-Dimensional Thermal Design Scheme
Jun Ikehata1, Kota Kobayashi1, Takashi Fukue1, Koichi Hirose1, Yosuke Hata2, Hiroyuki Ishikawa2, 1Iwate University, 2Brother Industries / Japan		 FE1-4
Formation of Extremely High-Aspect Si Sub-micron Patterns with Smooth wall for MEMS and X-ray Devices
Hayato Komatsu1, Wataru Yashiro2, Hidemi Kato2, Johji Kagami3, Kentaro Totsu2, Masashi Nakao2, 1Miyagi Prefectural Government, 2Tohoku University, 3Shinko Seiki / Japan
Break
10:50 FA2: SMTA Pan Pacific Session : Strategies for High Volume/High Mix Manufacturing
FA2-1<Session Invited>
IoT & Wearable Electronics Revolutionize Electronics Manufacturing Paradigms
Charles E. Bauer, Herbert J. Neuhaus, TechLead, USA
FB2: Materials and Processes-6
FB2-1 <Session Invited> 50min
Polymer / Metal Composite for Flexible Interconnect
Jin Kawakita, Toyohiro Chikyow,  National Institute for Materials Science / Japan		 FC2: Thermal Management-4
FC2-1
Development of Conductive Fusion Technology-advanced die attach materials for high power applications
Maciej Patelka1, Nicholas Krasco1, Sho Ikeda1, Toshiyuki Sato2, Miguel Goni3, Elbara Ziade3, Aaron J. Schmidt3, 1 NAMICS North American R&D Center / USA, 2NAMICS Techno Core / Japan, 3Boston University / USA

 FD2: Printed Electronics-2
FD2-1 <Session Invited>
Print and Imprint Method for Nanoimprint Lithography with High-viscosity Photo-curable Resins
Takahiro Nakamura, Masaru Nakagawa, Tohoku University / Japan

 FE2: Fan-out Packaging Technology-1
FE2-1 <Session Invited>
FOWLP Technology as Wafer Level System in Packaging (SiP) Solution
Leo Lee, Lewis Kang, Yong Tae Kwon, TH Kim, JH Kim, EJ Lee, JK Lee, Nepes / Korea

FA2-2 <Session Invited>
Intelligent Automation; Key Factor for High Mix Manufacturing
Horatio Quinones1, Yong Yang2, 1CANTOK / USA, 2Jutze Intelligent Systems / China		 FB2-2
Advanced Materials with Low Dielectric Properties and Highly Thermal Conductivity
Feng-Po Tseng, Wen-Pin Ting, Kuo-Chan Chiou, Industrial Technology Research Institute / Taiwan		 FC2-2
New Materials with Extremely High Thermal Conductivity Coefficient
Andrzej Moscicki1, Tomasz Falat2, Andrzej Kinart1, Mohamad Abo Ras3, 1Amepox Microelectronics, 2Wroclaw University of Technology / Poland, 3Berliner Nanotest & Design / Germany

 FD2-2
UV-assisted 3D-printing of Soft Ferrite Magnetic Components for Power Electronics Integration
Lanbing Liu1, Ting Ge1, Yi Yan1, Khai Ngo1, Guo-quan Lu1,2, 1Virginia Tech / USA, 2Tianjin University / China		 FE2-2 <Session Invited>
Carrier Glass Substrates for Fan-out Wafer/Panel Level Packaging
Kazutaka Hayashi, Asahi Glass / Japan
FA2-3 <Session Invited>
3D & Printed Electronics Manufacturing Strategies
Christopher Bailey, S Stoyanov, T Tilford, G Tourloukis, University of Greenwich / UK		 FB2-3
Study of High UPH TCB Process with Slow Cure NCP
Hiroki Myodo, Yusuke Kamata, Yukihiro Ikeda, Masaaki Hoshiyama, NAMICS / Japan
FC2-3
Thermal Transient Test of GaN HEMT Devices
Tomoaki Hara1, Kentaro Yanai2, 1Mentor Graphics Japan, 2Omron / Japan		 FD2-3
Imaging the Patterning Step of R2S Microcontact Printing
Yasuyuki Kusaka, Shusuke Kanazawa, Noritaka Yamamoto, Hirobumi Ushijima, National Institute of Advanced Industrial Science and Technology / Japan		 FE2-3 <Session Invited>
Recent Progress in Low Temperature Curable Photosensitive Dielectric
Tetsuya Enomoto, Satoshi Abe, Daisaku Matsukawa, Tadamitsu Nakamura, Nobuyuki Saito, Masayuki Ohe, Noriyuki Yamazaki,  Takeharu Motobe, Hitachi Chemical DuPont MicroSystems / Japan
12:30 FA2-4 <Session Invited>
Panel Processing for High Volume/ High Mix Manufacturing
Rolf Aschenbrenner, Andreas Ostmann, Frauhofer IZM / Germany


FE2-4 <Session Invited>
Encapsulation Processes and Materials for Advanced Package
Joji Yukimaru, Yuki Ishikawa, Tomoya Takao, Kazuhiro Ikeda, Akira Nakao, Sauyu Rec / Japan
Lunch Time
13:30 FA3: Fan-out Packaging Technology-2
FA3-1 <Session Invited>
FO-WLP Market and Technology Trends
E. Jan Vardaman, TechSearch International / USA		 FB3: Materials and Processes-7
FB3-1
Voiding Reduction and Leadframe Interactions in High-Lead Solder Die Attach for QFN Applications
Ariel Jan V. Sadural, Laura Antoinette D. Clemente, Texas Instruments Clark / Philippines		 FC3: Substrate and Interposers
FC3-1
FEM Simulation of Warpage Orientation Change of FRP Polymer Substrate during Thermal Processing
Cheolgyu Kim1, Tae-Ik Lee2, Min Sun Kim1, Taek-Soo Kim1, 1KAIST, 2SIMMTECH / Korea

 FD3: Printed Electronics-3
FD3-1 <Session Invited>
Feasible Monitoring Methods for Lung and Circulatory Functions using Wearable Sensors
Satoru Nebuya, Kitasato University / Japan		 FE3: 3DIC Packaging-1
FE3-1 <Session Invited>
Integrated Passive Device for TSV (Through-Silicon-Via) Interposer
Gu-Sung Kim, Kangnam University / Korea
FA3-2 
New Wave Fan-out Package for Heterogeneous Integration
Shin-Hua Chao1,2, Yuan-Fu Sung1, Ding-Bang Luh2, 11Advanced Semiconductor Engineering Group,
2National Cheng Kung University / Taiwan		 FB3-2
Effects of Bi in Sn-Cu Based Lead-free Solder Alloys and Interconnects
Kazuhiro Nogita1, Arif Salleh1,2, Selena Smith1, Yueqin Wu1, Stuart McDonald1, Ab Razak Ahmad Ghazie1, Tetsuya Akaiwa3, Takatoshi Nishimura3, 1The University of Queensland / Australia, 2Universiti Malaysia Perlis / Malaysia, 3Nihon Superior / Japan

 FC3-2
Low Dk / Df Polyimide Adhesives for Low Transmission Loss Substrates
Takashi Tasaki, Atsushi Shiotani, Takashi Yamaguchi, Keisuke Sugimoto, Arakawa Chemical Industries / Japan		 FD3-2 <Session Invited>
Stretchable and Robust Transistor of Single Wall Carbon Nanotube, Gel and Elastomeric Materials
Atsuko Sekiguchi, Fumiaki Tanaka, Takeo Yamada, Kenji Hata, National Institute of Advanced Industrial Science and Technology / Japan
 FE3-2
Impact of Backside Process on High Aspect Ratio Via-Middle Cu Through Silicon Via Reliability
Yunlong Li, Stefaan Van Huylenbroeck, Joeri De Vos, Michele Stucchi, Kristof Croes, Gerald Beyer, Eric Beyne, imec / Belgium
FA3-3 <Session Invited> 50min
Trends in Fan-out Wafer and Panel Level Packaging
Tanja Braun1, Karl-Friedrich Becker1, Markus Wöhrmann2, Michael Töpper1, Lars Böttcher1, Rolf Aschenbrenner1, Klaus-Dieter Lang2, 1Fraunhofer Institute for Reliability and Microintegration,  2Technical University Berlin / Germany

FB3-3
Effect of Substrate Metallization on the Impact Strength of Sn-Ag-Cu Solder Bumps Fabricated in a Formic Acid Atmosphere
Siliang He, Hiroshi Nishikawa, Osaka University / Japan		 FC3-3
Direct Copper Metallization on Glass Technology
Shigeo Onitake, Kotoku Inoue, Masatoshi Takayama, Tsubasa Fujiwara, Koto Electric / Japan		 FD3-3 <Session Invited>
Fully Additive Manufacturing of a Polymer Cantilever with a Conductive Layer
Shusuke Kanazawa, Yasuyuki Kusaka, Ken-ichi Nomura, Noritaka Yamamoto, Hirobumi Ushijima National Institute of Advanced Industrial Science and Technology / Japan		 FE3-3
Influence of Surface Properties on Adhesion Strength of Dielectric Passivation in Chip Size Packaging
Takuro Suyama1, Kensuke Suga1, Takatoshi Igarashi1, Noriyuki Fujimori1,2, 1Olympus, 2Shinshu University / Japan
15:10 FB3-4
Study on Temperature Dependence of Viscosity of Halogen-Free Dispensing Solder Paste
Tetsuya Yamamoto, Yuchen Hsu, Toshihide Takahashi, Akiya Kimura, Daisuke Hiratsuka, Tsuyoshi Sato, Toshiba / Japan		 FC3-4
Development of Through Glass Vias (TGV) and Through Quartz Vias (TQV) for Advanced Packaging
Kohei Horiuchi, Motoshi Ono, Yoichiro Sato, Shintaro Takahashi, Asahi Glass / Japan		 FD3-4 <Session Invited>
Design of Printed E-textile Probers to Supress Electrocardiography Noise
Masahiro Inoue, Yusaku Amano, Yasunori Tada Gunma University / Japan		 FE3-4
Revisit the Electromigration Effect -in situ synchrotron X-ray and scanning electron microscopy and ab initio calculations
Shih-kang Lin1, Yu-chen Liu1, Shang-Jui Chiu2, Yen-Ting Liu2, Hsin-Yi Lee2, 1National Cheng Kung University, 2National Synchrotron Radiation Research Center / Taiwan
Break
15:20 FA4: Technology for High Speed Applications
FA4-1 <Session Invited>
Electronic Packaging Gears up for 5G Mobile Race
Toshihiko Nishio, SBR Technology / Japan 		FD4: Printed Electronics-4
FD4-1
Sub-micron Printing Technology using Seamless Roller Mold (SRM)
Kazuma Komatsu1, Shinya Matsubara1, Taishi Hitomi1, Kenjiro Okuno1, Keita Suzuki1, Shinji Matsui2, 1Asahi Kasei, 2University of Hyogo / Japan
 FE4: 3DIC Packaging-2
FE4-1
Polymer for Wafer-level Hybrid Bonding and Its Adhesion to Passivation Layer in 3D Integration
Cheng-Hsien Lu, Yi-Tung Kho, Chuan-An Cheng, Yen-Jun Huang, Kuan-Neng Chen, National Chiao Tung University / Taiwan
FA4-2 <Session Invited>
Reducing Technique of Sidelobe in Millimeter Wave Beam Multiplexing System
Shohei Ishikawa, Atsushi Honda, Toshihiro Shimura, Yoji Ohashi, Masahiko Shimizu, Fujitsu Laboratories / Japan

FD4-2
Real-Time Observation of the Reception of Silver Ink in Soft Blanket Gravure Printing
Konami Izumi, Yasunori Yoshida, Shizuo Tokito, Yamagata University / Japan		 FE4-2
A Design Guide of Thermal Resistance down to 30% for 3D Multi-stack Devices
Hiroyuki Ryoson, Koji Fujimoto, Takayuki Ohba, Tokyo Institute of Technology / Japan
16:35 FA4-3 <Session Invited>
Recent Trend of Layer-to-Layer Insulation Resin for High Frequency Package
Shohei Fujishima, Hiroyuki Sakauchi, Ajinomoto / Japan
FD4-3
Temperature Effects on Ink Transfer Performance of Gravure Offset Printing for Fine-line Circuitry
Yun-Hui Shen1, Hsien-Chie Cheng2, You-Wei Chen1, Su-Tsai Lu3, Shih-Ming Lin3, Wen-Hwa Chen1,
1National Tsing Hua University, 2Feng Chia University, 3Industrial Technology Research Institute / Taiwan
 FE4-3
3D-IC Thermo-Compression Collective Bonding Process Using High Temperature Stage
Noboru Asahi, Yoshihito Mizutani, Koichi Imai, Yasunori Hashimoto, Hikaru Tomita, Toshiyuki Jinda, Mikio Kawakami, Masafumi Senda, Katsumi Terada, Toray Engineering / Japan

Cancelled
High-Performance and Scalable FOWLP-Based Flexible Device Integration
T. Fukushima1,2, A. Alam1, S. Pal1, Z. Wan1, S. C. Jangam1, G. Ezhilarasu1, A. Bajwa1, S. S. Iyer1, 1UCLA / USA, 2Tohoku University / Japan
Effect of Moisture on the Curing Behavior of Mold Compound
Chia-Yu Chang, Texas Instruments / Taiwan
Electrical and Thermal Conduction Mechanisms in Novel Isotropic Conductive Adhesive
Helge Kristiansen1,2, Sigurd Pettersen2, Susanne Helland3, Robert Schlag4, Erik Kalland3, Corinna Grosse4, 1Norwegian University of Science and Technology, 2Conpart, 3Mosaic Solutions / Norway, 4Berliner Nanotest und Design / Germany
System PDN Design Exploration and Sensitivity Analysis using RLC Synthesized Models for DDR SI/PI Co-simulations
Javid Mohamed, Tim Michalka, Selman Ozbayat, Gerardo Romo Luevano, Venkat Satagopan, Qualcomm Technologies / USA
Impact of Sintering Parameters in Pressureless Sinter Joint on Silver Substrate
Ling Xin Yong, Juo Yan Tan, Heraeus Material Singapore / Singapore
Platform Power Rails Merger and Innovative Noise Isolation Approach
Fern Nee Tan, Hon Wah Chew, Paik Wen Ong, Mohd Shahrir Tamrin, Ji Yun Chuah, Chee Lun Foo, Intel Microelectronics (M) / Malaysia
Reliability Testing of Ceramic Capacitors with Thermal Transient Method
Sarkany Zoltan, Rencz Marta, Mentor Graphics / Hungary

Poster Session Poster sessions wil be held from 15:10-16:10 on April 19 and from 15:10-16:10 on April 20.


P01


P02


P03


P04


P05


P06


P07


P08


P09


P10


P11


P12


P13


P14



P15


P16


P17


P18


P19


P20
Simultaneous Printing of Interconnects with Different Line Width Using Soft Blanket Gravure Printing
Hiroyuki Nakamura, Yasunori Yoshida, Konami Izumi, Daisuke Kumaki, Shizuo Tokito, Yamagata University / Japan

Electromigration and Failure Analysis for Copper Pillar Bump in QFN Package
Yi-Shu Hsieh1, Shang-Lin Wu1, Kuan-I Cheng1, Sung-Mao Wu1, Tung-Bao Lu2, Liang-Tian Lu2, 1National University of Kaohsiung, 2ChipMOS Technologies / Taiwan

Thermal Stress Analysis of Chip with Pressure Sensor Embedded in Accelerometer
Chun-Lin Lu, Meng-Kao Yeh, National Tsing Hua University / Taiwan

Thermal Stress Analysis under Thermal Cycling Test for SiC Power Device Heat Dissipation Structures using Ag Sintered Layer
Kensuke Osonoe1, Masaaki Aoki1,2, Akihiro Mochizuki2, Yoshio Murakami2, Hitoshi Kida2, Goro Yoshinari2, Nobuhiko Nakano1, 1Keio University, 2 Alent Japan / Japan

Interfacial Reactions between Lead-free Solders and Cu-40Zn Alloys
Yee-Wen Yen, Pei-Yu Chen, Guan-Da Chen, National Taiwan University of Science and Technology / Taiwan

Fabrication of High Melting Point Joint using Sn-57Bi-1Ag Low Temperature Lead-free Solder and Gold-plated Electrode
Yuki Maruya, Hanae Hata, Ikuo Shohji, Shinji Koyama, Gunma University / Japan

Electrical Analysis and Solder Joint Quality of PCB Land-­pad Design for QFP E-­pad Packag
Kuan-I Cheng, Yi-Cheng Liu, Pai-Chou Liu, Sung-Mao Wu, National University of Kaohsiung / Taiwan

Effect of High Temperature and Humidity Treatment on Adhesion Properties and Bulk Properties of Structural Adhesive
Yugo Tomita1, Ikuo Shohji1, Shinji Koyama1, Seigo Shimizu2, 1Gunma University, 2Fuji Heavy Industries /Japan

Effect of Aging and Test Temperature on Adhesion Strength of Copper and Epoxy Resin
Yu Tonozuka1, Ikuo Shohji1, Shinji Koyama1, Hiroaki Hokazono2, 1Gunma University, 2Fuji Electric / Japan

Effect of Anisotropic Mechanical Properties of Woven CompositeSubstrates on Warpage Orientation of Printed Circuit Boards
Tae-Ik Lee1, Cheolgyu Kim1, Jae-Bum Pyo1, Min Sung Kim2, Taek-Soo Kim1, 1KAIST, 2Simmtech / Korea

Properties of Carbon-doped TiO2 Nanofiber Fabucated by Electrospinning
Sheng-Hung Shih, Yu-Min Chen, Cho-Liang Chung, I-Shou University / Taiwan

Preparation of Fluorescent Ceramic Nanofibers by Electrospinning and Heat Treatment
Jui-Wen Liang, Wen-Yu Wang, Cho-Liang Chung, I-Shou University / Taiwan

Eliminationg Surface Mount Issues due to Copper Smearing through Modified L- Lead Design
Dolores B. Milo, Mark Gerald R. Pinlac, Texas Instruments / Philippines

Electrochemical Corrosion of Copper and Copper Alloy in Aqueous Propylene Glycol Containing Rust Inhibitors
Kazunari Higuchi1, Ikuo Shohji1, Tetsuya Ando2, Koyama Shinji1, Yoshikazu Mizutani3, Yukio Inoue3, 1Gunma University, 2Muroran Institute of Technology, 3Showa Industries / Japan

Simple Modeling Method of EMI Simulation for PCB
Mitsuharu Umekawa, Keysight Technologies Japan / Japan

A Study on Magnetic Near-Field Noise and EMI of LED Light Bulb
Shunsuke Koyanagi1, Katsutoshi Saito1,2, Kazuki Muroi1, Motoshi Tanaka1, 1Akita University, 2Saikatu / Japan

An Investigation on Electromagnetic Environment In A Molding Factory
Yuichi Abe1, Yoshiteru Watanabe1, Tsuyoshi Haga1, Atsushi Maeda2, 1Ibuki, 2O2 Lab. / Japan

A Tapered Loop Antenna with Broadband Characteristics for Ultra-Wideband Radio
Yuto Shimazaki1, Yudai Nagatsu1, Fukuro Koshiji1, Kohji Koshiji2, 1 Tokyo Polytechnic University, 2Tokyo University of Science / Japan

Transmission characteristics around Human Body Standing on the Electrode Located on the Floor Surface for Human Body Communication
Ryogo Urushidate1, Yusuke Fujita1, Fukuro Koshiji1, Kohji Koshiji2, 1Tokyo Polytechnic University, 2Tokyo University of Science / Japan

Compact Rumen pH Sensor: Aiming at the Realization of Livestock Electronic Management and Fine Forage Strategy
Lan Zhang1, Jian Lu1, Hirofumi Nogami1,2, Hironao Okada1, Toshihiro Itoh1,3, 1National Institute of Advanced Industrial Science and Technology, 2Kyushu University, 3the University of Tokyo / Japan

Cancelled
Near-field to Far-field Transform Method by Using Kirchhoff Surface Integral Representation
Jing-Xin Chu, Sung-Mao Wu, Jia-Yu Liu, National University of Kaohsiung, Kaohsiung / Taiwan

*The content of the program may be subject to change without any prior notice. Please check the ICEP web site for an ipdated version.