| A |
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| 13:30 15:00 |
Global Business Council �gNew Era of Automotive Electronics�h 1. Automotive Design Based on Sensibility Study of Brain Activity [Provisional ] Kazuo Nishikawa, Mazda Motor 2. Automotive Electronics Evolves Automobile!? Nobuaki Kawahara, DENSO 3. SiC solutions for eMobility Akifumi Enomoto, ROHM Semiconductor |
| Break | |
| 15:15 17:15 |
4. Integrated Intelligent Transportation & Key Enablers Dwight Howard, Delphi Automotive Systems 5. Artificial Intelligence and Automotive Manufacturing Bill Cardoso, Creative Electron 6. Automotive Electronics are Driving Innovation in Electronic Materials, Processes and Packaging Technologies Rozalia Beica, The Dow Chemical 7. What 2D and 3D (CT) X-Ray Inspection Now Provides for Electronics in Automotive Environments David Bernard, David Bernard Consultancy |
| 17:45 19:15 |
Party |
| A |
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| 10:00 10:20 |
Opening |
| 10:20 11:20 |
Keynote Lecture Future Prospect for Semiconductor Technologies Supporting Automotive �gIntelligence�h and �gElectrification�h Kiminori Hamada, Toyota Motor |
| 11:20 12:20 |
Keynote Lecture Challenges and Opportunities in Gen3 Embedded Cooling with High Quality Microgap Flow Avram Bar-Cohen, Raytheon |
| 12:20 13:30 |
Lunch Time |
| 13:30 13:35 |
Greeting |
| 13:35 14:10 |
Ceremony |
| 14:10 15:10 |
Keynote Lecture A New Neurofeedback Based Cognitive Training with Ultra-small NIRs System Ryuta Kawashima, Tohoku University |
| 15:10 16:10 |
Poster Session / Break |
| 16:10 17:10 |
Keynote Lecture Magnetism and Superconductivity Kazuyoshi Yoshimura, Kyoto University |
| 17:10 18:10 |
Keynote Lecture Current Status and Trends of IC Packaging in China Tianchun Ye, Institute of Microelectronics of Chinese Academy of Sciences |
| 18:10 18:20 |
Introduction of Future Events |
| 18:30 20:30 |
Welcome Reception Hotel Hanamizuki |
| A |
B | C |
D |
E |
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| 9:00 10:40 |
TA1:
Korea Session-1 TA1-1 <Session Invited> Multiple Plasma System for Panel Level Package Gusung Kim, Kangnam University / Korea TA1-2 <Session Invited> PCB Material Property Effects on PBGA Reliability Yeong K. Kim1, Dong Yeong Kim1, Hyun Soo Park1, Do Soon Hwang2, Young Sik Boo3, 1Inha University, 2Korea Aerospace Research Institute, 3Korea Aerospace Industries / Korea TA1-3 <Session Invited> Intermetallic Compound Formation and Mechanical Property of Sn-Cu-xCr/Cu Lead-free Solder Join Junghwan Bang1, Dong-Yurl Yu1, Yong-Ho Ko1, Sehoon Yoo1, Hiroshi Nishikawa2, Chang-Woo Lee1, 1Institute of Industrial Technology / Korea, 2Osaka University / Japan TA1-4 <Session Invited> Electrochemical Etching Behavior of Copper and Invar for Metal Core PCB Application Jae-Ho Lee, Yongsu Lee, Hongik University |
TB1:
Advanced Packaging-1 TB1-1 <Session Invited> 3D IPD Teck Lee, ASE Group / Taiwan TB1-2 Development of the Integrated Passive Device using Through-Glass-Via substrate Jun Onohara1, Fusao Takagi1, Takashi Kizu1, Koji Imayoshi1, Hironori Nomura1, Hobie Yun2, 1Toppan Printing / Japan, 2Qualcomm Technologies / USA TB1-3 Wafer Level 3D Stacked Technology Solution for Future IoT Devices. Takahide Murayama, Toshiyuki Sakuishi, Akiyoshi Suzuki, Yasuhiro Morikawa, ULVAC / Japan TB1-4 Application-oriented Wear-leveling Optimization of 3D TSV-integrated Storage Class Memory-based Solid State Drives Masaru Nakanishi, Yutaka Adachi, Chihiro Matsui, Yusuke Sugiyama, Ken Takeuchi, Chuo University / Japan |
TC1:
Materials and Processes: plating tech TC1-1 Effects of Plating Conditions on Electroless Ni-P Plating in the Microchannel Ching-Yun Yang, Han-Tang Hung, C. Robert Kao, National Taiwan Unicersity / Taiwan TC1-2 Effect on Film Properties by Phosphorus and Sulfur Content Rate in Electroless Ni-P Plating Films Norihiko Hasegawa, Kei Hashizume, Junichi Katayama, Okuno Chemical Industries / Japan TC1-3 Insulation Reliability of Electric Circuit Fabricated with Nano-Silver Plating Catalyst Norimasa Fukazawa, Wataru Fujikawa, Yoshinari Santou, Jun Shirakami, DIC / Japan TC1-4 Bonding of Copper Pillars using Electroless Au Plating I-An Weng, Han-Tang Hung, Sean Yang, Ying-Hsuan Chen, C. Robert Kao, National TaiwanUniversity / Taiwan |
TD1:
Medical & Healthcare-1 TD1-1 <Session Invited> Wearables and Implantables : How technology transforms health care--and how health care transforms the technology business Matthew K. Hudes, bdlBilologx / USA TD1-2 <Session Invited> Non-invasive Biosensing Devices for Preemptive Medicine Kohji Mitsubayashi, Tokyo Medical and Dental University / Japan TD1-3 Practical Realization of Enfold Connecting System of Artificial Blood Vessel for Simplifying Maintenance Surgery Evaluation of Thrombus Formation and Blood Coagulation Capasity Ai Watanabe1, Takashi Ota1, Y. Kanno2, Norihisa Miki1, 1Keio university, 2Tokyo Medical University / Japan TD1-4 Development of Multi-lead ECG Measurement Wear using Electrostatic Flocking Technology Toshihiro Takeshita1, Manabu Yoshida1, Atsushi Ouchi1, Akinari Hinoki2, Hiroo Uchida2, Takeshi Kobayashi1, 1National Institute of Advanced Industrial Science and Technology, 2Nagoya University / Japan |
TE1:
Design, Modeling, and Reliability-1 TE1-1 Evaluation of Residual Thermal Stress in Cu Metalized Silicon Nitride Substrates by Raman Spectroscopy Kiyoshi Hirao1, Shinji Fukuda1, Hiroyuki Miyazaki1, You Zhou1, Hideki Hyuga1, Shoji Iwakiri2, 1National Institute of Advanced Industrial Science and Technology, 2Denka / Japan TE1-2 Electric Current-induced Plastic Deformation: an in situ experimental study Yu-chen Liu, Shih-kang Lin, National Cheng Kung University / Taiwan TE1-3 High Spatial-resolution X-ray Inspection by Pixelated Scintillator Sho Miyao, Takahiro Tanino, Nobuyasu Fujioka, Izumi Hikita, Tomohiro Morinaga, Haruhito Kodama, Masaki Okamura, Kazuki Shigeta, Toray Industries / Japan TE1-4 Investigation of Stresses in HALT (Highly Accelerated Limit Test) Raphael Pihet, Takuya Hirata, Hideki Kawai, Yuichi Aoki, ESPEC / Japan |
| Break |
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| >10:50 12:30 |
TA2:
Korea
Session-2 TA2-1 <Session Invited> Fabrication of Ag Nano Composite Paste and Its Characteristics Seung-Boo Jung1, Bum-Geun Park1, Kwang-Seok Kim2, Daeup Kim2, 1Sungkyunkwan University, 2Korea Institute of Industrial Technology / Korea TA2-2 <Session Invited> Aerogels for Interlayer Low Dielectric of Semiconductor Devices Hyung-Ho Park, Kyu-Yeon Lee, Tae-Hee Kim, Haryeong Choi, Yonsei University / Korea TA2-3 <Session Invited> Strategies for Improving Mechanically Reliability of Thin-Film Flexible Electronics Taek-Soo Kim, Korea Advanced Institute of Science and Technology / Korea |
TB2:Advanced
Packaging-2 TB2-1 Study on Silicon Device of Microrobot System for Heterogeneous Integration Ken Saito1,2, Daniel S. Contreras2, Yudai Takeshiro3, Yuki Okamoto3, Yuya Nakata1, Taisuke Tanaka1, Satoshi Kawamura1, Taisuke Tanaka1, Minami Kaneko1, Fumio Uchikoba1, Yoshio Mita3, Kristofer S. J. Pister2, 1Nihon University / Japan, 2University of California / USA, 3The University of Tokyo / Japan TB2-2 Ultra-Slim Package Design for Millimeter Wave Application Ming-Fong Jhong1, Chung-Hsiung Ho2, Wen-Hsuan Lin2, Chih-Yi Huang1, Po-Chih Pan1, Chen-Chao Wang1, 1Advanced Semiconductor Engineering, 2NXP Semiconductors / Taiwan TB2-3 Novel Plating Photoresist Development for Advanced Packaging Rui Li, Tomoyuki Matsumoto, Takuhiro Taniguchi, Naoki Nishiguchi, Akito Hiro, Hirokazu Sakakibara, Koichi Hasegawa, JSR / Japan TB2-4 Laser Micro-machining of LPM Compound Material for Panel and IC Packaging Wen-Fei Lin1, Shih-Jeh Wu1, Hsiang-Chen Hsu1,2, Boen Houng1, Min-Shuo Chen1, 1I-Shou University, 2St. John�fs University / Taiwan |
TC2:
Materials and Processes: solder materials TC2-1 Considerations on Selection of Alloying Elements for Designing Sn-based Solder Alloys by the Molecular Orbital Method Wataru Takahara, Osaka University / Japan TC2-2 Effect of Reflow Conditions on the Intermetallic Layer in Solder Joints Kazuhiro Nogita1, Flora Somidin1,2, Arif Salleh1,2, Keith Sweatman3, Tetsuro Nishimura3, Stuart McDonald1, Hiroshi Maeno4, Syo Matsumura4, 1The University of Queensland / Australia, 2Universiti Malaysia Perlis / Malaysia, 3Nihon Superior, 4Kyushu University / Japan TC2-3 Investigation of the Interfacial Reactions and Mechanical Strength in the Sn-Ag-Cu (SAC)/ Cu-Be Alloy (Alloy25) Couple Jing-Shiun Chang, Yee-Wen Yen, National Taiwan University of Science and Technology / Taiwan TC2-4 Solder Electromigration Failure Time as a Function of the Angle Between the c-axis of Sn Crystals and Direction of Electron Flow Tsubasa Sakai, Eishi Watanabe, Tsubasa Sei, Kimihiro Yamanaka, Chukyo University / Japan |
TD2: Emerging
Technologies-1 TD2-1 <Session Invited> On-demand Full Additive Manufacturing of Electoronic Devices applying Inkjet Technology Ryojiro Tominaga, Takeshi Sato, Kenji Tsukada, Akihiro Kawajiri, Katsuaki Makihara, Yoshitaka Hashimoto, Shigeyoshi Inagaki, FUJI Machine Mfg. / Japan TD2-2<Session Invited> Advanced FPGA Technology Trend based on Patent Analysis with Link Mining Masashi Shibata, Yuichi Ohtsuka, Masakazu Takahashi, Kazuya Okamoto, Yamaguchi University / Japan TD2-3 Deep Learning Consideration with Novel Approach: look-up-table based processing conjugated memory Kanji Otsuka, Yoichi Sato, Meisei University / Japan TD2-4 A Study on Application of Artificial Intelligence (AI) for Cosmetics: Quantum computer is necessary for Beauty-field analysis Yasuo Kato, SHISEIDO / Japan |
TE2:
Design, Modeling, and Reliability-2 TE2-1 Optimization of Ni and Bi Levels in Sn-0.7Cu-xNi-yBi Solders for Improved Interconnection Reliability Sergey Belyakov1, Takatoshi Nishimura2, Tetsuya Akaiwa2, Keith Sweatman2, Kazuhiro Nogita3, Christopher Gourlay1, 1Imperial College London / UK, 2Nihon Superior / Japan, 3University of Queensland / Australia TE2-2 Analysis of the Effects of Voids on Crack Initiation in Solder Joints of High-Power LEDs Ping Xu1, Rongge Ke1, Miriam Rauer2, Michael Kaloudis3, Joerg Franke1, 1University of Erlangen-Nuremberg, 2Heraeus Deutschland, 3University of Applied Science Aschaffenburg / Germany TE2-3 Creep Mechanism in Characteristic Orientation of Sn and Sn-1.8Ag by Nanoindentation Po-Jung Chiang, Jui-Yang Wu, Yi-Chia Liao, C. Robert Kao, National Taiwan University / Taiwan TE2-4 The Failure Mode of Bi and Ni-doped Sn-Ag-Cu Solder Joint under Electromigration Tests Ting Chun Lin1, Heng Yu Kung1, Shu Hsien Lee1, Ming Hung Chen1, Ying Ta Chiu1, Kwang Lung Lin2, 1Advanced Semiconductor Engineering, 2National Cheng Kung University / Taiwan |
| Lunch Time |
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13:30
15:10 |
TA3: Taiwan
Session TA3-1 <Session Invited> Sintered Silver-Indium Bonding with Anti-oxidation Property for High Temperature Applications C Robert Kao, C A Yang, National Taiwan University / Taiwan TA3-2 <Session Invited> Thermal Strategy for 2.5D IC High Power Application Tang-Yuan Chen, Jin-Feng Yang, Meng-Kai, Shih, David Tarng, Chih-Pin Huang, Advanced Semiconductor Engineering / Taiwan TA3-3 <Session Invited> Low Temperature Bonding Technology for 3D Integration and Advanced Packaging Kuan-Neng Chen, National Chiao Tung University / Taiwan |
TB3:
Advanced Packaging-3 TB3-1 Effect of Substrate Surface Finish on Bonding Strength of Pressure-less Sintered Silver Die-attach Meiyu Wang1,2, Yunhui Mei1, Rolando Burgos2, Dushan Boroyevich2, Guo-Quan Lu1,2, 1Tianjin University / China, 2Virginia Tech / USA TB3-2 Ag Joint Bonding Technology for Bare Copper Substrate in Low Temperature, Pressureless and Air Condition Zheng Zhang, Chuantong Chen, Hao Zhang, Shijo Nagao, Katsuaki Suganuma, Osaka University / Japan TB3-3 Interfacial Reactions between Sn and Au-xCu Alloys Chih-Hung Lin, Chia-Yi Yeh, Yee-Wen Yen, National Taiwan University of Science and Technology / Taiwan |
TC3:
Materials and
Processes: micro / nano silver relating
tech TC3-1 Sprayable Silver Paste with Good Shielding Characteristics in the High Frequency Band Takashi Sakamoto, Daisuke Hashimoto, Namics / Japan TC3-2 Ultra-fine Patterning Technology by Utilizing Nano-silver Catalysts in MSAP Yuhei Kitahara, Joonhaeng Kang, Okuno Chemical Industries / Japan TC3-3 Effect of Pre-annealing of Au Metallization Structure on the Bonding Performance with Low Temperature Pressureless Sintering Ag Chuantong Chen1, Zheng Zhang1, Shijo Nagao1, Katsuaki Suganuma1, Tomohito Iwashige2, Kazuhiko Sugiura2, Kazuhiro Tsuruta2, 1Osaka University, 2Denso / Japan TC3-4 Sintering Mechanism of Micron/submicron-size Silver Particles Jeyun Yeom, Cai-Fu Li, Katsuaki Suganuma, Osaka University/ Japan |
TD3:
High-Speed, Wireless &
Components-1 TD3-1 <Session Invited> (50min.) High Speed Vertical Interconnect Analysis for Dense Pin Assignment Optimization using Electromagnetic Multiple Scattering Techniques Boping Wu, Huawei Technologies / China TD3-2 43 % Reduced Program Time, 23 % Energy Efficient ReRAM Boost Converter with PMOS Switching Transistor and Boosted Buffer Circuit for ReRAM and NAND Flash Hybrid SSDs Kenta Suzuki, Masahiro Tanaka, Kota Tsurumi, Ken Takeuchi, Chuo University / Japan TD3-3 Design of Transmission Line with Impedance Resonator for Negative Group Delay and Slope Characteristics by Preference Set-based Design Method Yoshiki Kayano, Yoshio Kami, Haruo Ishikawa, Fengchao Xiao, Hiroshi Inoue, The University of Electro-Communications / Japan |
TE3:
Battery Materials TE3-1 Multilayer Ceramic Li-ion Secondary Battery Tomohiko Komuro, Takyuki Fujita, Namics / Japan TE3-2 Synthesize of Negative Electrode Composed 3D Nano-structures and Sn Based Material for Sodium Ion Secondary Battery Naoki Okamoto, Kengo Kikuchi, Koki Morita, Takeyasu Saito, Osaka Prefecture University / Japan TE3-3 Handling of Glass and Ceramic Ultrathin Substrates for Flexible Thin Film Batteries Messaoud Bedjaoui, Johnny Amiran, Sylvain Poulet, Nicolas Lopez, Jouhaiz Rouchou, Université Grenoble Alpes / France TE3-4 Evaluating Method for Degradation of Electrolyte Membrane Akira Ueno, Tomoki Ko, Shin Sato, Takeo Takakura, Guennec Benjamin, Ritsumeikan University / Japan |
Poster
Session / Break
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16:10
17:50 |
TA4: iNEMI
Session TA4-1 <Session Invited> iNEMI Project Overview: characterize and quantify the production inspection capability of AXI for HiP defects Ayman Fayed, Intel / USA TA4-2 SiP Module Mold Flowability Experiment Result and Simulation Study Yonghyuk Jeong1, Billy Ahn1, Jim Hsu2, Anthony Yang2, Tetsuya Koyama3, Kiyoshi Oi3, Jeffrey Lee4, Takahiro Horie5, Masahiro Tsuriya6, 1STATSChipPAC / Korea, 2CoreTech System (Moldex3D) / Taiwan, 3Shinko Electric Industries / Japan, 4Integrated Service Technology / Taiwan, 5Hitachi Chemical, 6iNEMI / Japan TA4-3 SiP Module Warpage Characterization and Simulation Study Jim Hsu1, Anthony Yang1, Yonghyuk Jeong2, Billy Ahn2, Tetsuya Koyama3, Kiyoshi Oi3, Jeffrey Lee4, Takahiro Horie5, Masahiro Tsuriya7, 1CoreTech System (Moldex3D) / Taiwan, 2STATSChipPAC / Korea, 3Shinko Electric Industries / Japan, 4Integrated Service Technology / Taiwan, 5Hitachi Chemical, 6iNEMI / Japan TA4-4 iNEMI Project on Process Development of BiSn-Based Low Temperature Solder Pastes - Part III: mechanical shock tests on PoP BGA assemblies Haley Fu1, Jagadeesh Radhakrishnan2, Morgana Ribas3, Raiyo Aspandiar2, Kevin Byrd2, Jimmy Chen4, Shunfeng Cheng2, Qin Chen5, Richard Coyle6, Sophia Feng7, Mark Krmpotich8, Scott Mokler2, Brook Sandy-Smith9, Kok Kwan Tang10, Greg Wu11, Anny Zhang9, Wilson Zhen12 1iNEMI / China, 2Intel / USA, 3Alpha Assembly Solutions / India, 4Flex / China, 5Eunow / China, 6Nokia / US, 7Celestica / China, 8Microsoft / USA, 9Indium / USA, 10Intel / Malaysia, 11Wistron / Taiwan, 12Lenovo / China |
TB4:
Materials for Organic Semiconductor Devices TB4-1 Printable Electronic Circuits Based on Metal Nanoparticles and Organic Semiconductors Takeo Minari1 , Xuying Liu1, Masayuki Kanehara2, 1NIMS, 2C-INK / Japan TB4-2 <Session Invited> Key Factor of Conductive Nanoink Design for High Performance Printed Devices Masayuki Kanehara, C-INK / Japan TB4-3 <Session Invited> High-yield Flexible Organic Complementary Circuits Integrated with Sensors Mayumi Uno, Osaka Research Institute of Science and Technology / Japan TB4-4 Design and Fabrication of Photo-sensitive Thin-film Transistors with IGZO and Organic Photo-absorber Zhaogui Wang1, Yongfeng Zheng1, Xuhong Cao1, Hang Zhou2, Chuan Liu1, 1Sun Yat-sen University, 2Peking University / China |
TC4:
Materials and Processes: thermal solution TC4-1 Extreme Low Interfacial Thermal Resistance Heat Conductive Sheet Masao Tomikawa, Akira Shimada, Toray Industries / Japan TC4-2 Development of Low Temperature Solder Alloys for Advanced Electronic Packaging - assessment of In-Bi alloys on Cu substrates Albert T. Wu1, Chih-Hao Chen1, Jyun-Jhe Huang1, Jeng-Yu Chiang1, Chang-Meng Wang2, 1National Central University, 2SHENMAO Technology / Taiwan TC4-3 Measurement of Thermal and Electrical Contact Resistance Between Conductive Materials Yoshiki Hyodo1, Tomoyuki Hatakeyama1, Risako Kibushi2, Masaru Ishizuka1, 1Toyama Prefectural University, 2Tokyo University of Science Yamaguchi / Japan TC4-4 Process Evaluation of Pyramidal and Cone-shaped Nanoparticle Deposition (NPD) Bumps using a Thermally Resistant Resist Ying Ying Lim, Masaru Hashino, Hiroshi Nakagawa, Masahiro Aoyagi, Katsuya Kikuchi, National Institute of Advanced Industrial Science and Technology / Japan |
TD4:
High-Speed, Wireless & Components-2 TD4-1 Antenna on Glass for 60GHz WiGig Application Ching Kuan Lee1,Yung Jean (Rachel) Lu2, Hsiang-Hung Chang1, Li-Chi Chang1, Chang-Sheng Chen1, 1Industrial Technology Research Institute, 2Corning / Taiwan TD4-2 Design and Demonstration of Ultra-thin 3D Glass-based 5G Modules with Low-loss Interconnections Atom O. Watanabe1, Tong-Hong Lin1, Tomonori Ogawa2, P. Markondeya Raj1, Venkatesh Sundaram1, Manos M. Tentzeris1, Rao R. Tummala1, 1Georgia Institute of Technology / USA, 2Asahi Glass / Japan TD4-3 Experimental Study of Through Glass Via Effects on High Frequency Electrical Characteristics Masaya Tanaka1, Yumi Okazaki1, Junichi Suyama1, Satoru Kuramochi1, Youggun Han2, Osamu Horiuchi2, Yoshihisa Kato2, 1Dai Nippon Printing, 2Fukuoka University / Japan TD4-4 Experimental Investigation of Wireless Energy Harvesting with a Bluetooth Low Energy Sensing Unit Mohamed M. Mansour1,4, Osamu Takiguchi2, Takayuki Inoi3, Haruichi Kanaya1, 1Kyushu University, 2ALSENSE, 3Yamagata University / Japan, 4Electronics Research Institute / Egypt |
TE4: Tomokage
Memorial Session TE4-1 <Session Invited> Updated Status and Trend of Panale Level Packaging & Standardization Tanja Braun, Fraunhofer IZM Berlin / Germany TE4-2 <Session Invited> Printing in the Third Dimension Charles E. Bauer, TechLead / USA TE4-3 <Session Invited> Updated R&D Status of Embedding Technology in Japan Yoshihisa Katoh, Fukuoka University / Japan TE4-4 <Session Invited> Future Activities on Embedding Technology in IEC Hisao Kasuga, IS-Innovation Technology Research Association / Japan |
| A |
B |
C |
D |
E |
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| 9:00 10:40 |
FA1: Yole
Development Session FA1-1 <Session Invited> (50min.) Advanced Packaging : a very dynamic ecosystem Santosh Kumar, Yole Developpement / France FA1-2 <Session Invited> (50min.) Fan-out Packaging : technologies & market trend Jerome Azemar, Yole Developpement / France |
FB1:
Emerging Technologies-2 FB1-1 Surface Activated Bonding of Au/Ta Layers after Degas Annealing for MEMS Packaging Takashi Matsumae, Yuichi Kurashima, Eiji Higurashi, Hideki Takagi, National Institute of Advanced Industrial Science and Technology / Japan FB1-2 Direct Metallic Bonding Assisted by Electromagnetic Irradiations Yi-You Yu1, Sin-Yong Liang1, Jenn-Ming Song1, Shang-Kun Huang2, Ying-Ta Chiu2, David Tarng2, Chih-Pin Hung2, 1National Chung Hsing University, 2Advanced Semiconductor Engineering / Taiwan FB1-3 Study on 3D Self-aligned Assembly Using Chips with Etched Edge and SAM for Liquid Confinement Yong Liu1,2,3, Jaber Derakhshandeh1, Yao Gao3, Kenneth June Rebibis1, Ingrid De Wolf1,3, Pei Li2, 1IMEC / Belgium, 2East China Research Institute of Electronic Engineering / China, 3KULeuven / Belgium |
FC1: Materials and
Processes: emerging technology FC1-1 Optimum Rotation Angle for Mitigating Differential Skew Induced by Glass Cloth in PCB Chenyu Wang, Kengo Iokibe, Yoshitaka Toyota, Okayama University / Japan FC1-2 Highly Sensitive Wearable Strain Sensors Using Copper Nanowires and Elastomers Chunrui Liu, Songjia Han, Zunming Du, Yiqun Liu, Chuan Liu, Sun Yat-sen University / China FC1-3 A Study on Mechanical Properties of Thinned Single Crystal Silicon Wafer: effect of size and direction Sangmin Lee1, Jae-Han Kim2, Takyuki Ohba3, Young Suk Kim3,4, Taek-Soo Kim1, 1Korea Advanced Institute of Science and Technology, 2Korea Atomic Energy Research Institute / Korea, 3Tokyo Institute of Technology, 4DISCO / Japan FC1-4 Bonded Strength and Reliability under High Temperature and Humid Environment for Silver Alloy Bonding Wire Jun Cao1,2, Han Hua1, 1HeNan Polytechnic University, 2HeNan YOUK Electronic Material / China |
FD1:
Interconnection FD1-1 Ga-based Submicron Particle and Applications Hseng-ming Liao, Che-yu Yeh, Shih-kang Lin, National Cheng Kung University / Taiwan FD1-2 Introduction of Sub-2-micron Cu Traces to EnCoRe Enhanced Copper Redistribution Layers for Heterogeneous Chip Integration Hiroshi Kudo, Yuuki Aritsuka, Tanaka Masaya, Ryohei Kasai, Jyunichi Suyama, Mitsuhiro Takeda, Yumi Okazaki, Haruo Iida, Daisuke Kitayama, Kouji Sakamoto, Takamasa Takano, Miyuki Akazawa, Hiroaki Sato, Shouhei Yamada, Satoru Kuramochi, DNP / Japan FD1-3 Photonic-sintering of Submicron/nano Silver Particles with Low Density Irradiations Po-Hsiang Chiu, Guo-Lun Huang, Jenn-Ming Song, National Chung Hsing University / Taiwan FD1-4 Mechanical Properties of Sn-Bi-In-Ga Low Melting Temperature Solder Alloys Chih-han Yang1, Shiqi Zhou2, Hiroshi Nishikawa2, Shih-kang Lin1, 1National Cheng Kung University / Taiwan, 2Osaka University / Japan |
FE1: Thermal
Management-1 FE1-1 Study on Moving Nozzle Effects on Spray Cooling of Electronics Omar Lamini, Chang-Ying Zhao, Shanghai Jiao Tong University / China FE1-2 Advanced Boiling Cooling Technology Using a Compact Vessel with a Low Water Level Noriyuki Unno1, Kazuhisa Yuki1, Risako Kibushi1, Koichi Suzuki2, 1Tokyo University of Science Yamaguchi, 2Tokyo University of Science / Japan FE1-3 Conjugate Heat Transfer Analysis of a Thin Liquid Cooling Heat Sink Using Free Software Thomas Schiano1,2, Ryohei Hirose1, Keisuke Iida1, Miho Seike1, Tomoyuki Hatakeyama1, Shinji Nakagawa1, 1Toyama Prefectural University / Japan, 2Université Paris-Saclay / France FE1-4 Relationship between Natural Convection Cooling Performance and Tilt Angle of Thin Enclosure Shun Yonezuka1, Takashi Fukue1, Mamoru Kikuchi1, Kouichi Hirose1, Qiang-Sheng Wang1, Wakana Hiratsuka1, Yuji Okada2, Chiaki Sakaki2, 1Iwate University, 2EIZO / Japan |
| Break | |||||
| 10:50 12:30 |
FA2: Fan-Out
Packaging Technology-1 FA2-1 <Session Invited> (50min.) Markets and Applications for FO-WLP Jan Vardaman, TechSearch International / USA FA2-2 <Session Invited> Panel RDL Substrate for Next Generation Substrate Manufacturing Yu-Hua Chen, Cheng-Ta Ko, Puru Bruce Lin, Tzyy-Jang Tseng, Unimicron Technology / Taiwan |
FB2: Emerging
Technologies-3 FB2-1 Fabrication of Microchannel-TEM Grid for in situ Liquid Observation of Interfacial Chemical Reaction Keito Miwa, Hiroyuki Kuwae, Kosuke Sakamoto, Shuichi Shoji, Jun Mizuno, Waseda University / Japan FB2-2 High Density Flex-Cable and Interconnection Technologies for Large Silicon Detector Modules Thomas Blank1, P. Pfistner1, B. Leyrer1, M. Caselle1, C. Simons2, C.J. Schmidt2, M. Weber2, 1Karlsruhe Institute of Technology, 2Gesellschaft für Schwerionenforschung / Germany FB2-3 Development of Mountable Electromagnetic Induction Type MEMS Generator Minami Kaneko, Kaito Mishima, Kazuya Kudo, Kazuki Ebisawa, Ken Saito, Fumio Uchikoba, Nihon University / Japan FB2-4 An Evaluation and Comparison of Cross- Sensitivities of Various Different Types of Screen Printed Ag/AgCl Reference Electrodes John Karl Atkinson, University of Southampton / UK |
FC2:
Materials and Processes:
polymer materials FC2-1 TSV Liner Dielectric Technology with Spin-on Low-k Polymer Sungho Lee, Yohei Sugawara, Masato Ito, Hisashi Kino, Tak Fukushima, Tetsu Tanaka, Tohoku University / Japan FC2-2 Solderability Evaluation of Printed Silver Solder Pad for Wafer-Level Packaging Mian Tao1, Jeffery C. C. Lo1, Ying-Hong Liou2, Peter Chiu2, S. W. Ricky Lee1, 1Hong Kong University of Science & Technology, 2DETEKT Technology / Hong Kong FC2-3 Gang-bonding CoC Assembly by NCF-TCB Using Newly Developed Bonding Force Leveling Film Yuta Koseki, Kazutaka Honda, Tomonori Minegishi, Tsuyoshi Ogawa, Hitachi Chemical / Japan FC2-4 Underfill Fatigue Life Enhancement by Means of Rubber and Elastomer Additives Hiroshi Yamaguchi, Toshiaki Enomoto, Toshiyuki Sato, Namics / Japan |
FD2: Materials and
Processes: bonding technology FD2-1 Development of Nanocomposite Pastes for Low-Temperature Low-Pressure Bonding Ting-Jui Wu, Jen-Hsiang Liu, Jenn-Ming Song, National Chung Hsing University / Taiwan FD2-2 Investigation of Aluminum Patterned Electrodeposition Process from AlCl3-[EMIm]Cl Ionic Liquid for Microsystems Application Muhammad Salman Al Farisi1, Silvia Hertel2, Maik Wiemer2, Thomas Otto2,3, 1Tohoku University / Japan, 2Fraunhofer Institute for Electronic Nano Systems, 3Chemnitz University of Technology / Germany FD2-3 Reliability Performance of 30��m-pitch Solder Micro Bump Fluxless Bonding Interconnections Shin-Yi Huang, Tao-Chih Chang, Yu-Min Lin, Su-Ching Chung, Su-Yu Fun, Industrial Technology Research Institute / Taiwan |
FE2:
Thermal Management-2 FE2-1 Heat Flow Sensor Created by Printed Circuit Board Manufacturing Process Yukikatsu Ozaki1, Hirohito Matsui1, Motoki Shimizu2, 1SOKEN, 2DENSO / Japan FE2-2 Relationship between Thermal Resistance and Shape of Copper Pads in Densely Mounted Board Yoshinori Aruga1, Koichi Hirasawa1, Takayuki Yamabe1, Hirotoshi Aoki1, Tomoyuki Hatakeyama2, Shinji Nakagawa2, Msaru Ishizuka2, 1KOA, 2Toyama Prefectural University / Japan FE2-3 Thermal Resistance Evaluation in High Heat Flux Electronics Risako Kibushi1, Kazuhisa Yuki1, Noriyuki Unno1, Kohei Yuki2, Toshio Tomimura3, Tomoyuki Hatakeyama4, Masaru Ishizuka4, 1Tokyo University of Science, Yamaguchi, 2Tohoku University, 3Kumamoto University, 4Toyama Prefectural University / Japan FE2-4 Investigation of Design Parameters of 1-Dimensional Thermal Conductivity Measurement System for Shortening Measurement Time of Thermal Conductivity by Steady - Temperature - Prediction - Method (STPM) Kohei Urata, Jumpei Hatakeyama, Koichi Hirose, Michimasa Uchidate, Takashi Fukue, Iwate University / Japan |
| Lunch Time | |||||
| 13:30 15:10 |
FA3:
Fan-out Packaging Technology-2 FA3-1 <Session Invited> Fan-out Wafer Level Packaging for 5G and mm-Wave Applications Tanja Braun1,2, Karl-Friedrich Becker2, Ole Hoelck1, Ruben Kahle1, Markus Woehrmann1, Michael Toepper1, Ivan Ndip1, Uwe Maass1, Christian Tschoban1, Rolf Aschenbrenner1, Steve Voges2, Klaus-Dieter Lang2, 1Fraunhofer IZM, 2Technical University Berlin / Germany FA3-2 <Session Invited> Development of Liquid Compression Molding Material (LCM) for Low Warpage Tsuyoshi Kamimura1, Satomi Kawamoto1, Daisuke Hashimoto1, Haruyuki Yoshii1, Hidetoshi Inoue2, 1Namics, 2Hitachi Chemical / Japan FA3-3 <Session Invited> Temporary Adhesive and Equipment Solutions for Fan-out WLP/PLP Technology Akihiko Nakamura, Tokyo Ohka Kogyo / Japan FA3-4 UV Laser Releasable Temporary Bonding Materials for FO-WLP Hikaru Mizuno, Hiroyuki Ishii, Hitoshi Kato, Takashi Mori, Hiroki Ishikawa, Yooichiroh Maruyama, Kenzo Ohkita, Koichi Hasegawa, JSR / Japan |
FB3:
Emerging Technologies-4 FB3-1 Flexible Substrate with Movable Device Island Supported by Serpentine Interconnect for Mounting Ultra-thin Silicon Chips Takeshi Kobayashi, Toshihiro Takeshita, Yusuke Takei, Ryohei Takei, National Institute of Advanced Industrial Science and Technology / Japan FB3-2 Fully-printed Vertical Interconnections with Tapered Contact Holes Formed by Vapor-annealing Technique Yasuyuki Kusaka, Shusuke Kanazawa, Hirobumi Ushijima, National Institute of Advanced Industrial Science and Technology / Japan FB3-3 Reliability Analysis of SiP Module Board Level Bending Test Wei-Hong Lai, Shao-Chen Yen, Hsin-Chih Shih, Meng-Kai Shih, David Tarng, Chih-Pin Huang, Advanced Semiconductor Engineering / Taiwan FB3-4 Void Reduction in Reflow Soldering Processes by Sweep Stimulation of PCB Substrate Viktoria Rawinski, Ersa / Germany |
FC3:
Power Electronics Integration-1 FC3-1 <Session Invited> Power Device Applications of Ga2O3 Kentaro Kaneko1, Takashi Shinohe2, Shizuo Fujita1, 1Kyoto University, 2FLOSFIA / Japan FC3-2 SiC Power Module for Motor Driving System Chun-Kai Liu1, Chih-Ming Tzeng1, Rong-Chang Fang1, Chih-Wei Li2, James Goo3, 1Industrial Technology Research Institute, 2LINGSEN Precision, 3Shihlin Electric / Taiwan FC3-3 Failure Mode Verification of Power IGBT under Different Thermal Stress Application Conditions in Power Cycling Test Environment Qun Yuan1, Ryo Endoh2, Tetsuya Ima3, Yasushi Kajita4, Yafei Luo1, 1Mentor Graphics Japan, 2Toray Research Center, 3Yamaha Motor, 4Nagoya Municipal Industrial Research Institute Industrial Research Institute / Japan FC3-4 Metallization Technology of SiC Power Module in High Temperature Operation Tomohito Iwashige1, Kazuhiko Sugiura1, Takeshi Endo1, Kazuhiro Tsuruta1, Yuich Sakuma2, Seigo Kurosaka2, Yukinori Oda2, Chuantong Chen3, Shijo Nagao3, Katsuaki Suganuma3, 1Denso, 2C. Uyemura, 3Osaka University / Japan |
FD3:
Materials and Processes: advanced process FD3-1<Session Invited> New Market Trend in CMP Equipment / Material for the " More than Moore" era Yasuhiko Takeno1, Kazuya Okamoto2, 1Global Net, 2Yamaguchi University / Japan FD3-2 Investigation of the Laser Ablation Threshold for Optimizing Laser Direct Structuring in the 3D-MID Technology Li Wang, Robert Suess-Wolf, Michael Ulm, Joerg Franke, Friedrich-Alexander University Erlangen-Nuremberg / Germany FD3-3 Rapid Laser Drilling on Thick Ceramic Substrates for SiP Applications Shih-jeh Wu1, Hsiang-Chen Hsu1,2, Wen-Fei Lin1, Boen Hung1, Yeh Chang1, 1I-Shou University, 2St. John�fs University / Taiwan FD3-4 Investigation of the Differences in Nanometric Grinding of SiC and Si by Molecular Dynamics Miaocao Wang1, Fulong Zhu1, Yixin Xu1, Sheng Liu1,2, 1Huazhong University of Science and Technology, 2Wuhan University / China |
FE3:
Optoelectronics FE3-1<Session Invited> Toward Cointegration of Silicon and Polymer for Optical Interconnect Modules Okihiro Sugihara, Utsunomiya University / Japan FE3-2 <Session Invited> Multimode / Single-mode Polymer Waveguides for Optical Wiring from the Chip to On-Board Takaaki Ishigure, Keio University / Japan FE3-3 <Session Invited> High-density Broadband 400Gb/s on-PKG Silicon Photonics TRx Tsuyoshi Aoki1, Shigeaki Sekiguchi1, 1PETRA, 2Fujitsu, 3Fujitsu Laboratories / Japan FE3-4 Process Development and Reliability of Sintered High Power Chip Size Packages and Flip Chip LEDs Alexander Hanss1, Maximilian Schmid1, Sri Krishna Bhogaraju1, Fosca Conti2, Gordon Elger1, 1Technische Hochschule Ingolstadt / Germany, 2University of Padova / Italy |
| Break | |||||
| 15:30 17:35 |
FA4: Fan-Out
Packaging Technology-3 FA4-1 Highly Reliable Low Temperature Curable Photosensitive Polyimide Masao Tomikawa, Yuki Masuda, Yu Shoji, Kazuyuki Matsumura, Ryoji Okuda, Toray Industries / Japan FA4-2 Modeling of Cure Kinetics of Molding Compound and Its Effects on Drag Force in Compression Molding Chia-Heng Chung1, Hsien-Chie Cheng2, Wen-Hwa Chen1, 1National Tsing Hua University, 2Feng Chia University / Taiwan FA4-3 Mechanical Characterization Comparison as Flip-Chip Package to Fan-Out Package Dao-Long Chen, Po-Hsien Sung, Wei-Jie Yin, Meng-Kai Shih, David Tarng, Chih-Pin Hung, Advanced Semiconductor Engineering / Taiwan |
FB4: Medical
& Healthcare-2 FB4-1 <Session Invited> Peripheral Nerve Detection Probe by Raman Spectroscopy Yasuaki Kumamoto, Tetsuro Takamatsu, Kyoto Prefectural University of Medicine / Japan FB4-2 <Session Invited> Smart Environment Sensor for Healthcare Applications Naotsugu Ueda, Rysuke Sakai, Hiroyuki Mino, OMRON / Japan FB4-3 Fundamental Study to Evaluate Walking Skill of Visually Impaired Person Hiroaki Inoue1, Shunji Shimizu1, Toshiya Tsubota1, Tatsuo Hisaoka1, Yoshikazu Seki2, 1Tokyo University of Science, Suwa, 2National Institute of Advanced Industrial Science and Technology / Japan FB4-4 Noncontact Heart Rate Measurement System on Single Board Computer Daisaku Ikoma1, Yuya Abe1, Naoki Kawazu1, Hideharu Toda1, Masatoshi Sato2, Hisashi Aomori1, 1Chukyo University, 2Tamagawa University / Japan FB4-5 Development of an Automatic Urine Monitoring Device using Cross-selectivity Sensing Principle Benjamin Ioller, Norihisa Miki, Keio University / Japan |
FC4:
Power
Electronics
Integration-2 FC4-1 <Session Invited> Semiconductor Package Technologies in J-Devices for Automotive Application Akio Katsumata, Akito Yoshida, Akinori Ono, Nobuaki Oie, Toru Takahashi, Fumihiko Taniguchi, J-Devices / Japan FC4-2 A highly Integrated Copper Sintered SiC Power Module for Fast Switching Operation Bao Ngoc An1, Dai Ishikawa2, Thomas Blank1, Helge Wurst1, Horst Demattio1, Benjamin Leyrer1, Johannes Kolb3, Torsten Scherer1, Ansgar Simon4, Marc Weber1, 1Karlsruhe Institute of Technology / Germany, 2Hitachi Chemical / Japan, 3Schaeffler Technologies, 4Infineon Technologies / Germany FC4-3 Cu-Sn Based Die Attach Material for Power Semiconductor with Stress Control Hiroaki Ikeda, Shigenobu Sekine, Ryuji Kimura, Koichi Shimokawa, Keiji Okada, Hiroaki Shindo, Tatsuya Ooi, Rei Tamaki, Napra / Japan FC4-4 A Nearly-perfect Ag Joints Prepared by Novel Ag to Ag Direct Bonding Hao Zhang, Seungjun Noh, Norio Asatani, Yukiharu Kimoto, Aiji Suetake, Shijo Nagao, Tohru Sugahara, Katsuaki Suganuma, Osaka University / Japan FC4-5 A High Efficient Synchronous Rectifier for Next Generation Automotive Alternator Applications K. S. Kao, H. H. Lin, W. K. Han, S. T. Wu, C. M. Tseng, T. J. Yu, P. K. Chiu, Y. T. Lin, S. F. Hsu, J. Y. Chang, T. C. Chang, Industrial Technology Research Institute / Taiwan |
FD4:
Materials
for Nanophotonics Devices FD4-1 <Session Invited> (50min) Nanophotonics: a frontier cultivated by microassembly Hideki T. Miyazaki, National Institute for Materials Science / Japan FD4-2 Organic/Inorganic Interfacial Microstructures Achieved by Fast Atom Beam Bombardment and Vacuum Ultraviolet Irradiation Tilo Hongwei Yang1,2, C. Robert Kao1, Akitsu Shigetou2, 1National Taiwan University / Taiwan, 2National Institute for Materials Science / Japan |
|
P01 P02 P03 P04 P05 P06 P07 P08 P09 P10 P11 P12 P13 P14 P15 P16 P17 P18 P19 P20 P21 P22 P23 P24 P25 P26 |
Effect of W Addition for Cu Diffusion Barrier Property of Electroless CoB Films Formed on SiO2 Takaki Iseri1, Shusuke Shindo1, Tomohiro Shimizu1, Takeshi Ito1, Moriji Matsumoto2, Shoso Shingubara1, 1Kansai University, 2JCU / Japan Batch Microwave Plasma Cleaning for Robustification of Automotive Devices Ghizelle Jane Estrada Abarro, Rod Delos Santos, Darwin De Lazo, Alvin Denoyo, Ariel Tan, Manny Ramos, ON Semiconductor Philippines / Philippines Multi-chip Gang Bonding Technology Using the Thermo-compression Bonder for Si Substrate Noboru Asahi, Yoshihito Mizutani, Koichi Imai, Hiroto Tanaka, Yasunori Hashimoto, Toshiyuki Jinda, Mikio Kawakami, Katsumi Terada, Toray Engineering / Japan Loop Height Assessment for Automotive Package Mohd Izzuddin Suboh, Mohamad Syahirul Syafiq Ali, Infineon Technologies (Malaysia) / Malaysia Material Characterization in TSV Fabricated by Supercritical Carbon Dioxide Electroplating Ho-Chiao Chuang1, Guan-Wei Jiang1, Ai-Ho Liao2, 1National Taipei University of Technology, 2National Taiwan University of Science and Technology / Taiwan Flexible and Transparent Silver-grid Over-coated with PEDOT: PSS electrode prepared by gravure offset printing Masato Ohsawa, Natsuki Hashimoto, ULVAC / Japan A Study of the Anodizing of Titanium for Dye-sensitized Solar Cells Yu-Wen Chen, Chih-Ming Chen, National Chung Hsing University / Taiwan Preparation of Vitamin C Doped Polymers for Physical Characteristics Using Electrospinning Process Sheng-Hung Shih, Chun-Yi Chen, Cho-Liang Chung, I-Shou University / Taiwan Enhancement of Electrical Conductivity Developed in an Epoxy-based Adhesive with Silver Flakes Loading Tomohito Negishi, Masahiro Inoue, Gunma University / Japan Preparation of Superhydrophobic Silicon-Based Net-like Hollow Nanostructure Using Electrospinning Jui-Wen Liang, Wen-Yu Wang, Cho-Liang Chun, I-Shou University / Taiwan Variation in Electrical Conductivity of Air-curable Copper Pates Composed of a Phenolic-based Binder during Soaking in Several Environments Kenta Kawarai, Masahiro Inoue, Gunma University / Japan Creation and Functional Control of Metal Nanoparticle-Polymer Interface by Laser Plasma EUV Light Excitation Kiyokazu Yasuda, Nozomi Tanaka, Nao Wada, Hiroaki Nishimura, Osaka University / Japan First Principles Calculation of the Structure and Quantum Capacity of Acidic Functional Groups on Graphene-based Capacitor Bochen Li, Takeyasu Saito, Naoki Okamoto, Osaka Prefecture University / Japan A Fracture Analysis of Different Cu Electroplated Layers on Ni-metallized Polyimide Film Yi-Hsuan Chen, Shan-Chen Tsai, Chih-Ming Chen, National Chung Hsing University / Taiwan Variations in Electrical Resistivity of Stretchable Printed Wires Composed a Polyurethane-based Binder Containing Silver Fillers under Cyclic Tensions Yuta Hosono, Masahiro Inoue, Gunma University / Japan Coupling Model and Non-contact Measurement Approach by Near-field Technology Sheng-Wei Guan1, Chih-Wen Kuo1, Cheng-Tao Li2, Sung-Mao Wu2, 1National Sun Yat-sen University, 2National University of Kaohsiung / Taiwan Effect of Au Thickness on Bonding Reliability for Silver Coated Au Bonding Wire Xiangqing Yang, HeNan Polytechnic University / China Feasibility Study of All-SiC Pressure Sensor Fabrication without Deep Etching Fengwen Mu1, Yechao Sun2,4, Haiping Shang2, Yinghui Wang2,3,4, Tadatomo Suga1,3, Weibing Wang2,4, Dapeng Chen2,4, 1The University of Tokyo / Japan, 2Institute of Microelectronics of Chinese Academy of Sciences, 3Kunshan Branch, Institute of Microelectronics of Chinese Academy of Sciences, 4University of Chinese Academy of Sciences / China Reduction of Parasitic Capacitance of Flexible Tactile Sensors Tatsuho Nagatomo, Norihisa Miki, Keio University / Japan Electrodeposition of ZnS and Evaluation of Its Optical Property Naohiro Matsuda, Naoki Okamoto, Takeyasu Saito, Osaka Prefecture University / Japan Synthesis and Thermal Conductivity of Carbon Nanotube (CNT)/Polymer Composites Chih-Feng Wang1, Pei-Kang Huang1, Yi-Jung Tsai1, Chih-Lin Wu1, Yan-Yu Chang1, Kuo-Jung Lee1, Ping-Feng Yang2, 1I-Shou University, 2Advanced Semiconductor Engineering / Taiwan Synthesis and Thermal Conductivity of Expanded Graphite (EG)/Polymer Composites Chih-Feng Wang1, Pei-Rung Hung1, Chih-Lin Wu1, Yi-Jung Tsai1, Yan-Yu Chang1, Kuo-Jung Lee1, Ping-Feng Yang2, 1I-Shou University, 2Advanced Semiconductor Engineering / Taiwan Development of Novel AlN Filler for High Thermal Conductivity Packaging Material Yukihiro Kanechika, Akimasa Kuramoto, Yutaka Fukunaga, Yasushi Imoto, Yoshitaka Inaki, Saiko Fjii, Meng Wan, Teruhiko Nawata, Masahide Ueda, Tokuyama / Japan Evaluation of Thermal Resistance of Various Thermal Grease Shinya Seki, Ryo Endoh, Masaaki Takeda, Toray Research Center / Japan Evaluation of Thermal Cycle Stress in SiC Power Devices by Raman Spectroscopy Tomoyuki Uchida, Ryuichi Sugie, Toray Research Center / Japan Thermal Conductivity Measurement of Diamond and ��-Ga2O3 Thin Films by a 3�� Method Shinichiro Suzuki1,2, Shinya Ohmagari2, Yusuke Akutsu1, Naoki Okamoto1, Takeyasu Saito1, Hitoshi Umezawa2, Yoshiaki Mokuno2, 1Osaka Prefecture University, 2The National Institute of Advanced Industrial Science and Technology / Japan |
Cancelled
The
Geometric Approach on
Enabling Angular Die Bonding Process
Ernesto Pentecostes
Rafael, Dolores Babaran Milo, Texas Instrument Philippines / Philippines
Leadframe Design Resolution to
Eliminate Bsm Risk of Leakage and Metal Shorting
Dolores Babaran Milo,
Texas Instrument Philippines / Philippines
BAMFIT
– Bond Accelerated
Mechanical Fatigue Interconnect Test
Josef Sedlmair1,
Bernhard Czerny2, Golta Khatibi2, 1F&S
Bondtec Semiconductor, 2Technical University Vienna /
Austria
Package-in
Temperature Measuring with Micro-heater Soldering for
Pyroelectric IR Sensor
Hideaki Mizusaki1,2,
Toshiro Sato2, Makoto Sonehara2, 1Nagano
Prefecture General Industrial Technology Center, 2Shinshu
University / Japan
Wire Bond Design and Process
Simulation for Optimum Wire Bond Interconnect
Chee Meng Chai, Chan Lam Cha, Infineon Technologies Asia Pacific /
Singapore
*The content of the program may be subject to change without any prior notice. Please check the ICEP web site for an ipdated version.