ICEP 2024 will be held from April 17 to 20, 2024 in Toyama, Japan.
Event
Journal
![](https://jiep.or.jp/en/assets/img/journal_home.jpg)
Transactions of The Japan Institute of Electronics Packaging (Trans. JIEP)
The latest information on mounting technology and future technology is published in a timely manner.
Information for Authors / Template / Copyright Transfer