1998 IEMT/IMC SYMPOSIUM
Advance Program
April 15 - 17, 1998
Sonic City - Omiya, Tokyo Japan
"Breakthrough for System Packaging"
Sponsored by
IEEE CPMT (Components, Packaging, and Manufacturing Technology) Society
SHM：The Microelectronics Society - Japan （IMAPS Japan）
| Organizing Commitiee | General Information | Access & Hotel |
________Microelectronics, "Breakthrough for System Packaging", is the theme for the 1998 IEMT/IMC Symposium, and it offers attendees a broad spectrum of technical contributions in diverse areas of microelectronics interconnection and packaging technologies. It emphasizes the exhilarating future of our profession as we move into the 21st century. Customer demand for more all thing smarter, smaller, faster more reliable and at low cost. ________The technical sessions are focusing on MCM, CSP, BGA, flip chip, substrate, components, optical components, material, thermal management, reliability and related technologies. Three invited papers and sixty-three technical papers, which cover the latest microelectronics technologies will be presented. ________The Symposium Committee has information available on the total experience of 1998 IEMT/IMC. I also look forward to seeing you in Sonic City-Omiya. Iwao Tachikawa
General Chairperson
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