| April 15 (Wed.) | ||
|---|---|---|
| 9:50 | OPENING CEREMONY | |
| 10:10 | WA1 CSP/BGA (6) | WB1 Materials-1 (6) |
| 12:40 | LUNCH TIME | |
| 14:00 | Invited Lectures (3) | |
| 16:45 17:00 | AWARDING CEREMONY (3) | |
| 17:20 19:30 | EVENING PARTY | |
| April 16 (Thu.) | ||
|---|---|---|
| 9:30 | TA1 Flip chip/ Interconnection Technologies -1 (6) | TB1 Optical Components and Modules (5) |
| 12:00 | LUNCH TIME | |
| 13:00 | TA2 Thin/Thick Film, Technologies (4) | TB2 Thermal Management (4) |
| 14:40 | COFFEE BREAK | |
| 15:00 17:05 | TA3 Packaging Technology (5) | TB3 Failure Analysis and Reliability (5) |
| 17:30 19:30 | INTERNATIONAL PARTY | |
| April 17 (Fri.) | ||
|---|---|---|
| 9:30 | FA1 MCM/3D Packaging Technologies (5) | FB1 Modeling and Analysis (5) |
| 11:35 | LUNCH TIME | |
| 13:00 | FA2 Substrate Technologies (4) | FB2 Components (4) |
| 14:40 | COFFEE BREAK | |
| 15:00 16:40 | FA3 Flip chip/Interconnection Technologies -2 (4) | FB3 Materials-1 (4) |
| Back |