9:30-12:00  FA1: Interconnection Technologies (1)

Chairperson: E. J. Vardaman (TechSearch International)
                 A. Okuno (Japan REC Co., Ltd.)

1. Reversible Interconnection between Gold Wire and Silver Plating on Copper Alloy Substrate
      M. Onodera, T. Suga
      The University of Tokyo / Japan
2. A Low Cost Electroless Process for Wafer Level CSP and ROL
      E. Zakel, T. Teutsch, P. Kasulke
      Pac Tech GmbH / Germany
3. Effect of Underfill and Die Geometry on Thermal Shock and Moisture Resistance Test Performance for Flip Chip PBGA
      T-K. Hwa, Y-W. Huang, K-L. Chua, T-B. Lim
      Institute of Microelectronics / Singapore
4. Wire Bond Strength on Au/Ni Plated Printed Circuit Boards
      J-K. Kim, M. P. L. Cheng, B. P. L. Au^*
      Hong Kong University, ^*ASM Assembly Automation Ltd. / Hong Kong
5. Pre-wirebond and BGA Plasma Cleaning for Maximizing Yield
      R. Nickerson
      Advanced Surface Technology, Inc. / U.S.A.
6. Low Cost Fluxless Soldering Process using Liquid Alcohol
      T. Nishikawa
      Hitachi, Ltd. / Japan

13:00 -- 15:05  FA2: ACF/ACP and Underfill

Chairperson: C. R. S. Needes (Dupont Microcircuit Materials)
                 I. Watanabe (Hitachi Chemical Co., Ltd.)

1. Development of High density Flip Chip on Flex Process Using Anisotropically Conductive Adhesives
      J. Maattanen, P. Palm, A. Tuominen^*
      Elcoteq Network Corporation, ^*Tampere University of Technology / Finland
2. Anisotropically Conductive Adhesives Based on Micro-Metallurgical Bonding
      M. J. Holloway, M. Ward, J. Kivilahti^*, M. Vuorela^*, S. Fuchs^**, F. Stam^**
      Loctite R&D, ^**NMRC / Ireland, ^*Helsinki University of Technology / Finland
3. Development of Reworkable Underfills for Flipchip
      L. Crane, A. Torres, E. Yasger, R. W. Johnson^*
      Loctite Corporation, ^*Auburn University / U.S.A.
4. Compression Flow-Able Underfill(NCP) for Flip-Chip Applications
      O. Suzuki, H. Yoshii, K. Suzuki
      NAMICS Corporation / Japan
5. Secondary Underfill for CSP Reliability
      A. J. Babiarz
      Asymtek Marketing Communications / U.S.A.

15:25 -- 17:55  FA3: Interconnection Technologies (2)

Chairperson: E. Zakel (PacTech GmbH)
                 K. Yamamura (Sharp Corporation)

1. Shape Evolution of Electrodeposited Bumps with Additive Ⅱ- Center Humped Bumps
      K. Kondo, M. Eguchi, Z. Tanaka
      University of Okayama / Japan
2. Advantage of Silver Plating on Printed Circuit Board for CSP/BGA Assembly
      S. Saito, J. Baker
      Cookson ELECTRONICS PC fablication / Japan
3. Development of Tin-Capped C4 Solder Bumped Flip Chip Assembly Process on Flex Cable
      H. Mori
      IBM Japan, Ltd. / Japan
4. Development of Chip on Paste Technology
      K. Toriyama
      IBM Japan, Ltd. / Japan
5. Development of Low Cost Flip Chip Technologies
      Y. Orii
      IBM Japan, Ltd. / Japan
6. Improvement of Solder Ball Joint Reliability and Its Practical Application in BGA Packages
      T. Ogashiwa, T. Arikawa, M. Watanabe^*, K. Ano*, A. Inoue^**
      Tanaka Denshi Kogyo K.K., ^*Texas Instruments Japan Ltd., ^**Tohoku University / Japan

9:30 -- 12:00  FB1: Thermal Management

Chairperson: A. J. Babiarz (Asymtek Marketing Communications)
                 S. Kitajo (NEC Corporation)

1. Modeling of Heat Dissipation from Modules and Printed Wiring Boards (Session Invited)
      W. Nakayama, N. Yoneda^*
      ThermTech International, ^*Hitachi, Ltd. / Japan
2. Thermal Performance of LTCC and Ceramic Materials
      D. I. Amey, M. Y. Keating^*, M. A. Smith^**, S. J. Horowitz^**, C. R. S. Needes^**
      DuPont Microcircuit Materials, ^*DuPont Central Research & Development, ^**DuPont Microcircuit Materials / U.S.A.
3. Optimization of System Fan Placement
      D. G. Wang
      NCR Corp. / U.S.A.
4. Heatsink Enhancement Using Integral Heatpipe
      D. Copeland
      Showa Aluminum Corporation / Japan
5. Thermal Evaluation and Modelling of MEMS Packages
      M. Rencz, V. Szekely^*, Zs. Kohari^*, B. Courtois^**
      Micred Ltd, ^*Technical University Budapest / Hungary, ^**TIMA Laboratory / France
6. Lead-Free Solder Alloys for IGBT Power Modules: Thermal Fatigue Resistance Evaluation of the Die Attach
      J-M. Thebaud, E. Woirgard, C. Zardini, K. H. Sommer^*
      Universite Bordeaux 1 / France, ^*formerly with EUPEC / Germany

13:00--15:05  FB2: High Frequency Packaging

Chairperson: H. Tomimuro (NTT Electronics Corporation)
                 H. Sawai (Oki Electric Industry Co., Ltd.)

1. Radio Frequency Packaging (Session Invited)
      S-K. Chiang
      Prismark Partners LLC / U.S.A.
2. Fine Line Electrode for RF Circuits on the Glass-Ceramic Substrate
      K. Hayashi
      TDK Corporation / Japan
3. Green Tape(TM) LTCC Materials, Cost Effective Solutions for High Density Interconnect and RF Modules
      C. R. S. Needes, D. I. Amey, S. J. Horowitz
      DuPont Microcircuit Materials / U.S.A.
4. Development of Material for Multilayer Ceramic Substrate with Copper Wirnig in Millimeter Wave Applications
      Y. Terashi
      Kyocera Corporation / Japan
5. Antenna Integrated Millimeter Wave Transmission Module Technology
      N. Sakota, N. Kakimoto, K. Kitaoka, K. Yamamura, T. Nukii, A. Yamada, E. Suematsu
      Sharp Corporation / Japan

15:25 -- 17:55  FB3: High Performance Design

Chairperson: M. Rencz (Micred Ltd.)
                 H. Shigi (Hitach, Ltd.)

1. Power-Distribution-Plane Analysis for Multilayer Printed Circuit Boards with SPICE
      T. Harada, K. Asao, H. Sasaki, Y. Kami^*
      NEC Corporation, ^*The University of Electro-communications / Japan
2. A Study of PBGA Design for Multi-power Supply, Considering Compatibility with Applications
      K. Yonehara
      IBM Japan, Ltd. / Japan
3. Variation of Contact Resistance of Contacts Mounted on Printed Circuit Board Due to Thermal Deformation Observed by Holographic Technology
      M. Taniguchi, T. Takagi^*
      Meijo University, ^*Tohoku Bunka Gakuen University / Japan
4. PCBs Design Method for EMI Suppression using Simulation and Measurement of Power/Ground Plane Transmission Characteristic
      T. Taura
      NEC Corporation / Japan
5. Electro Magnetic Interference (EMI) & Thermal Analysis of Heat Sinks for High Performance Packaging Applications
      M. K. Iyer, P. Qu, P. D. Nath, I. Rasiah^*
      Institute of Microelectronics (IME), ^*Johnson Matthey (Singapore) / Singapore
6. Thermo-mechanical Analysis for Plasma Display Panel
      M. Lee
      LGE / Korea