9:30 -- 12:00  TA1: Pb-free Solders and Soldering

Chairperson: J. Simon (FhG-IZM)
                 H. Fujioka (Mitsubishi Electric Corporation)

1. Elastic Modulus and Poisson Ratio Tin-based Solders with Ultrasonic Pulse Echo Method
      H. Tanaka, L. F. Qun^*, O. Munekata^**, T. Taguchi^**, T. Narita^*
      Hokkaido Industrial Research Institute, ^*Hokkaido University, ^**Senju Metal Industry Co., Ltd. / Japan
2. Kinetics in Sn-Ag Solder/IMC/Metallization Joint During Thermal Aging
      J. G. Duh, C. S. Huang, Y. G. Lee
      National Tsing Hua University / Taiwan
3. Phase Equilibria and Thermodynamic Properties of Sn-Ag Based Pb-free Solder Allovs
      I. Ohnuma, X. J. Liu, H. Ohtani, K. Ishida
      Tohoku University / Japan
4. Characteristics of Sn-Ag-Cu Solder and Interfacial Structyre of Solder/Metallization
      T. Shono
      Fujitsu Ltd. / Japan
5. 5. Joint Reliability of BGA with Pb Free Solder Bumps
      K. Imamura
      Fujitsu Ltd. / Japan
6. Ag-Sn Solder Bump using 2-step Plating Process
      M. Miyata
      Toshiba Corporation / Japan

13:00 -- 15:05  TA2: Materials & Components

Chairperson: C. Huang (Electro-Science Laboratories, Inc.)
                 I. Kaneko (Musashi Institute of Technology)

1. New Founctional Devices Using by Compound Oxide Semiconductors
      O. Abe, Y. Taketa
      Nihon University / Japan
2. Applications of Newly Developed Positive Photosensitive Block Co-polyimides to CSP
      S. Matsumoto
      PI R&D Co., Ltd. / Japan
3. Development of Polyfumarates as Low Dielectric Materials for High Frequency Band
      M. Takei
      Nippon Oil & Fats Corporation / Japan
4. Chayacteristics of RuO₂/CB UV Resin System Thick Film Resistors
      K. Aoki, A. Zaki , I. Kaneko
      Musashi Institute of Technology / Japan
5. Electrical Properties of Ru-Based Resistors Buried in the Low Temperature Cofirable Ceramic Substrates
      S-L. Fu, C-S. Hsi
      I-Shou University / Taiwan, R. O. C.

15:25 -- 17:30  TA3: Trends

Chairperson: S. Denda (CQ Publishing Co., Ltd.)
                 Y. Takahashi (Oki Electric Industry Co., Ltd.)

1. System-on-a-Package (SOP) Research and Education at the Georgia Institute of Technology Packaging Research Center (Session Invited)
      R. Tummala
      Georgia Institute of Technology / U.S.A.
2. Outsourcing Software Development for Assembly and Packaging Manufacturing
      K. K. Verma
      BCA International / U.S.A.
3. Wafer Level Packaging: A New　Market Trend for CSPs
      E. J. Vardaman
      TechSearch International / U.S.A.
4. Patenting for Packaging and Interconnections in Microelectronics
      J. Happonen, K. Maattanen^*, A. Tuominen^**
      Nokia Mobile Phones Ltd., ^*Nokia Didplay Products, ^**Tempere University of Technology / Finland
5. Packaging MEMS, The Great Challenge of the 21st Century (Session Invited)
      C. E. Bauer
      TechLead Corporation / U.S.A.

9:30 -- 12:00  TB1: Substrates (1)

Chairperson: M. K. Iyer (Institute of Microelectronics)
                 S. Uegaki (Kyocera Corporation)

1. Fine Via Pattern Formation by Resolution Enhancement Lithography Assisted by Chemical Shrink
      T. Toyoshima
      Mitsubishi Electric Corporation / Japan
2. Build Up Substrate Consisting of Filled Vias
      S. Koyama
      Shinko Electric Industrial / Japan
3. Organic Multi Layered Substrate Having Similar Construction to Ceramic M.L.S.
      K. Hayashi
      Kyocera Corporation / Japan
4. Roll to Roll Processing of New Chemical Etching Solution for Polyimide Film
      M. Akita, T. Urashima
      Toray Engineering Co., Ltd. / Japan
5. The Adhesion of Copper on Reinforced Core Material Using Sputtered Interface Metallic Layers
      P. Jalonen, A. Tuominen, E. Ristolainen
      Tampere University of Technology / Finland
6. Alternatives to HASL Processes
      K. Y. N. Joseph
      Alpha PC Fab of Cookson Electronics Division / Hong Kong

13:00 -- 15:05  TB2: Optoelectronics Technologies

Chairperson: R. J. Ross (RJR Polymers Inc.)
                 Y. Ando (NTT Corporation)

1. The Status and Future of Optical Packaging Technology (Session Invited)
      O. Mikami
      Tokai University / Japan
2. Optical Packaging for Parallel Optical Interconnect Module (ParaBIT-1)
      M. Usui, N. Sato, A. Ohki, N. Matsuura, K. Enbutsu, M. Amano, M. Hikita, K. Katsura, Y. Ando
      NTT Corporation / Japan
3. An Optical Right-angle-turn Connector in a New Packaging Configuration using an Optical Fiber Wiring Board with an "Aperture" for Optical-I/O Interface Multichip Modules
      S. Koike, Y. Kawajiri, Y. Ishii, Y. Arai, Y. Ando
      NTT Corporation / Japan
4. Unique LED Dot Matrix Module by VPES^(R) (Vacuum Printing Encapsulation System) and High Reliability Transparent Liquid Epoxy Resin
      A. Okuno, N. Oyama, Y. Miyawaki
      JAPAN REC Co., Ltd. / Japan
5. Polymer-Jetted and Polymer-Dispensed Microlenses for Optical Interconnects
      Y. Ishii, S. Koike, Y. Arai, Y. Audo
      NTT Corporation / Japan

15:25 -- 17:55  TB3: Substrates (2)

Chairperson: A. Tuominen (Tampere University of Technology)
                 K. Hayashi (TDK Corporation)

1. Investigation of Materials of Advanced ALIVH Substrate for High Frequency Application
      S. Kokufu
      Matsushita Electric Industrial Co., Ltd. / Japan
2. Next Generation ALIVH^(R) Substrate for Bare Chip Mounting
      S. Ochi
      Matsushita Electric Industrial Co., Ltd. / Japan
3. Transmission Characteristics of ALIVH-FB Substrate
      N. Okazaki
      Matsushita Electric Industrial Co., Ltd. / Japan
4. Highly Heat-Resistant Laminate(BN300) and Its Application for Packaging Substrates
      K. Hirota
      Mitsui Chemicals Inc. / Japan
5. High-density, Fine-pitch Multilayer Technology for Ultra-high-pin-count Packages
      K. Kikuchi, T. Shimoto, K. Matsui
      NEC Corporation / Japan
6. High Density PWB by the B²it^TM+Laser Technique
      Y. Yamamoto
      Toshiba Corporation / Japan