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April 17 (Wed.)

 

Room A

Room B

 9:50

Opening Ceremony

 10:00

 WA1:High Speed / 
High Frequency  Packaging

  1. Directions in Rf Module Packaging (Session Invite)
    S.-K. Chiang, Prismark Partners / U.S.A.
  2. The High Frequency Package Using an Organic Material
    T. Fujii, Shinko Electric Industries / Japan
  3. The New Organic Laminate for Over GHz Packaging
    T. Seri, Kyocera / Japan
  4. Development of High Pin Count FCBGA(LTCC) for High Speed(2.5GBps) ASIC Application
    A. Kikuchi, Fujitsu / Japan
  5. The Study of RF Characteristics for QFP/BGA Applications
    C.-M. Ko, ASE TEST, Y.-J. Huang, S.-L. Fu, I-Shou University / Taiwan
  6. Evaluation of Propagation Characteristics in High-speed  Differential Signal Pair
    J. Kudo, T. Sudo, Toshiba / Japan
  7. Characteristic Impedance Control of Multilayer PWB in 
    Dual Stripline Structure

    I. Kaneda, Oki Printed Circuits / Japan
  8. The Spiral Inductor Design Consideration in Wafer Scale Package
    C. Azuma, Texas Instruments, Japan / Japan

 WB1: Pb-free Solders
  

  1. JIEP Low Temperature Soldering Project (Session Invite)
    K. Suganuma, Osaka University / Japan
  2. An Assessment of Lead-free Soldering for Automotive Applications : Influence of the Components Finishes on the Reliability of Solder Joints
    A. Guedon, E. Woirgard, C. Zardini, Universite Bordeaux 1 / France
  3. Comparison of Fractures by Mechanical Stress Test and Degradation by Thermal Stress Test in Lead-free Solders
    Y. Takenaka, Omron / Japan
  4. Joining Reliability of Sn-Ag-Cu Series Solder Alloys
    K. Kim, Osaka University / Japan
  5. Mechanical Characterization of Sn-Ag-Based Lead Free Solders
    M. Amagai, M. Watanabe, Texas Instruments, Japan
    M. Omiya, K. Kishimoto, Tokyo Institute of Technology / Japan
  6. A New Bumping Process Using Non-residue and Lead-free Solder Paste
    K. Saito ,T. Itoh, T. Suga, University of Tokyo / Japan
  7. Development of Thermodynamic Tool for Micro-soldering Alloy
    X. J. Liu, I. Ohnuma, R. Kainuma, H. Ohtani, K. Ishida, Tohoku University / Japan
  8. Segregation in Pb-free Solder Joints of Surface Mount Packages Caused by Wave-soldering Process
    T. Nakatsuka, Hitachi / Japan

 12:40

Lunch Time

 13:40


Invited Speeche

Device Packaging in the Year 2020
Dr. C. E. Bauer, TechLead Corporation / U.S.A.
 

 14:10


Asia Session

  1. Development of Microelectronic Packaging Technology in Tsinghua University
    Prof. J. Ma, Technology in Tsinghua University / China
  2. Introduction to Electronic Packaging Activities in Hong Kong
    Prof. J.-K. Kim, Hong Kong University of Science & Technology / Hong Kong
  3. Recent Packaging Technology Development Korea
    Dr. Y.-B. Sun, Kyonggi University / Korea
  4. Electronics, Optics & MEMS: Component and Microsystems  Packaging in Singapore - Technology Roadmap , Research  Collaborations & Relevance to Industry
    Dr. M. K. Iyer, Institute of Microelectronics / Singapore
  5. Taiwan Packaging Status
    Dr. S.-L. Fu, I-Shou University / Taiwan

16:40

AWARDING CEREMONY

16:55

18:00

20:00

 
WELCOME RECEPTION