| ベストペーパー賞 | |||
|
(1) |
Embeddeed Capacitor Formed on PWB for Next Generation Package | ||
| Y.Horikawa, A.Takano, A.Rokugawa, T.Iizima, Shinko Electric Industries/Japan | |||
|
(2) |
Common-mode Current due to a Trace on a PCB
with a Guard-band -Experiment and FDTD Modeling- |
||
| Y.Kayano, M.Tanaka, H.Inoue, Akita University/Japan J.L.Drewniak, University of Missouri-Rolla/USA |
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|
(3) |
Bouncing of Molten Solder Droplets during Solder Bump Formztion | ||
| W.Hsiao, J.H.Chun, Massachusetts Institute of Technology/USA | |||
|
(4) |
Simultaneous Formation of Wiring and Via Using Photoinduced Selective Plating | ||
| T.Hiraoka, Y.Hotta, K.Asakawa, S.Matake, Toshiba/Japan | |||
| ヤングアワード | |||
|
(1) |
The New Organic Laminate for Over GHz Packaging | ||
| T.Seri, S.Kamoi, K.Kume, K.Hayashi, Kyocera/Japan | |||
|
(2) |
Joining Reliability of Sn-Ag-Cu Series Solder Alloys | ||
| K.S.Kim, S.H.Huh, K.Suganuma, Osaka University/Japan | |||
|
(3) |
Micro-mirror Molding Technology for Optp-electronic Hybrid Modules | ||
| M.Oda, H.Kouta, S.Kitajo, NEC/Japan | |||
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