2002 ICEP
ベストペーパー賞およびヤングアワード 
(2003 ICEPにおいて授与)

ベストペーパー賞

(1)

Embeddeed Capacitor Formed on PWB for Next Generation Package
  Y.Horikawa, A.Takano, A.Rokugawa, T.Iizima, Shinko Electric Industries/Japan

(2)

Common-mode Current due to a Trace on a PCB with a Guard-band
-Experiment and FDTD Modeling-
    Y.Kayano, M.Tanaka, H.Inoue, Akita University/Japan
J.L.Drewniak, University of Missouri-Rolla/USA

(3)

Bouncing of Molten Solder Droplets during Solder Bump Formztion
    W.Hsiao, J.H.Chun, Massachusetts Institute of Technology/USA

(4)

Simultaneous Formation of Wiring and Via Using Photoinduced Selective Plating
    T.Hiraoka, Y.Hotta, K.Asakawa, S.Matake, Toshiba/Japan
   
ヤングアワード

(1)

The New Organic Laminate for Over GHz Packaging
    T.Seri, S.Kamoi, K.Kume, K.Hayashi, Kyocera/Japan

(2)

Joining Reliability of Sn-Ag-Cu Series Solder Alloys
    K.S.Kim, S.H.Huh, K.Suganuma, Osaka University/Japan

(3)

Micro-mirror Molding Technology for Optp-electronic Hybrid Modules
    M.Oda, H.Kouta, S.Kitajo, NEC/Japan
2002ICEP受賞者と贈賞者のみなさん
受賞者と贈賞者のみなさん

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