Welcome to ICEP2008

          We look forward to welcoming you to the International Conference on Electronic Packaging (ICEP) 2008 at Odaiba, Tokyo. ICEP 2008 will focus on diverse JISSO technologies in order to create tremendous possibilities for electronics materials, components, and packaging. The Organizing Committee has rescheduled the conference from April to June so that it will almost coincide with the JPCA show, which is one of the biggest electronic circuit exhibitions in Japan. This is a golden opportunity for you to get the latest information about cutting-edge technologies, including those still at the R&D stage, and to find out about newly developed products. 

          This annual conference, launched in 2001, is now in its eighth year. The conference covers almost all JISSO technology, from packaging materials to high-performance electronic components. Prior to 2000, we held the IEMT/IMC Symposium four times (1997-2000), following the merger of IEMT (by the IEEE CPMT Society of Japan) and IMC (by ISHM Japan). The 2008 conference will focus on advanced packaging technology for future innovative electronic products. The technical program consists of the following topics: Surface Activated Bonding, Interconnection, Advanced Packages, 3D Packaging, Materials and Processing, Substrates/Interposers, High Frequency Technology, MEMS and Sensor, Optoelectronics, LEDs, Simulation, Test and Analysis and Trend. Invited speakers from the United States and Japan will present next-generation high-density packaging technologies for today and the future. In addition to oral presentations, there will be poster sessions. The Poster Award will be introduced this year for younger presenters.

          The conference will offer you a chance to network with fellow professionals in the field of JISSO technologies and in related fields. We are confident that the conference will provide excellent opportunities for participants to exchange information and network globally. We are looking forward to seeing you at the conference.

     Hironori Asai
     General Chairperson
     ICEP 2008