19 Thu.
Room A TA-2: Taiwan Session-1
TA-1: 3D-1
9:00-10:40
TA1-1
TSV MEOL (Mid-End-Of-Line) and its
Assembly/Packaging Technology for 3D/2.5D Solutions
Seung Wook
YOON1, D.J. Na1, K. T. Kang2, W. K.
Choi1, C.B. Yong1, Y.C. Kim2 and Pandi C.
Marimuthu1 (1STATS ChipPAC Ltd, Singapore and
2STATS ChipPAC Korea Ltd., Korea)
TA1-2
Through-Package-Via formation technique
by laser ablation and reliability of TPVs in glass
Yoichiro
Sato1, Motoshi Ono2, Kaya Demir3, Kenji
Kitaoka2, Mitsuru Watanabe2, Vijay
Sukumaran3, Raghu Pucha3, Venky Sundaram3
and Rao R Tummala 3 (1AGC Electronics America,
USA, 2Asahi Glass Co., Ltd., Japan and 3Georgia
Institute of Technology, USA)
TA1-3
Effect of Underfill Properties on Fine
Pitch 3D-IC Package
Akihiro Horibe, Sayuri Kohara, Kuniaki
Sueoka, Keiji Matsumoto, Yasumitsu Orii and Fumiaki Yamada (ASET,
Japan)
TA1-4
High Thermal Conductive Inter Chip Fill
Material for 3D-IC
Yasuhiro Kawase1, Makoto
Ikemoto1, Toshiyuki Suzuki1, Tomohide
Murase1, Y. Matsushita1, Hideki
Kiritani1, T. Hirai1, Keiji Matsumoto2,
Akihiro Horibe2 and Yasumitsu Orii2
(1Mitsubishi Chemical Corporation and 2IBM Japan,
Ltd., Japan)
| 10:50-12:30 | TA2-1 | [Session Invited] Brightening the Future - Innovations on LED Technology Ming-Jer Kao (Industrial Technology Research Institute, Taiwan) |
| TA2-2 | Low temperature bonding
schemes for 3D chip stacking with fine pitch micro bump interconnections
Jing-Yao Chang, Yu-Min Lin, Chau-Jie Zhan, Shin-Yi Huang, Kuo-Shu Kao Chia-Wen Fan, Su-Ching Chung, Yu-Wei Huang, Tsung-Fu Yang and Tai-Hung Che (Industrial Technology Research Institute, Taiwan) | |
| TA2-3 | Thermal Performance of 3D
IC Package with Embedded TSVs Ra-Min Tain, Ming-Ji Dai, Yu-Lin Chao, Sheng-Liang Li, Heng-Chieh Chien, Sheng-Tsai Wu, Wei Li and Wei-Chung Lo (Industrial Technology Research Institute, Taiwan) | |
| TA2-4 |
TA-3: Taiwan Session-2
| 13:30-15:10 | TA3-1 | Thermal Management of a
TSV Interposer with Moore Law Chips on Both Sides for 3D IC Integration
SiP Heng Chieh Chien (Industrial Technology Research Institute, Taiwan) |
| TA3-2 | Active Layer of Organic
Photovoltaic Devices Based on Conjugated Polymer Blending with
PCBM Jheng-Jhih Pan (I-Shou University, Taiwan) | |
| TA3-3 | The study of photovoltaic
devices using electrospun conjugated polymer fibers Yi-Shiang Chen (I-Shou University, Taiwan) | |
| TA3-4 | Electrical characteristics
and reliability performance of a novel MOSFETs-embedded power module for
mobile applications Yin-Po Hung, Ren-Shin Cheng, Sheng-Che Hung, Fang-Jun Leu, Chih-Ming Tzeng, Jong-Shiou Peng, Yu-Mei Cheng, Tao-Chih Chang and Tai-Hong Chen (ITRI, Taiwan) |
TA4: 3D-2
| 15:40-17:20 | TA4-1 | [Session
Invited] Development of TSV/3D Memory+Logic SiP with 4k-IO Interconnects Hiroaki Ikeda, Shiro Uchiyama, Atsushi Sakai and Harufumi Kobayashi (ASET, Japan) |
| TA4-2 | Development of High
Producing Micro Solder Flip Chip Bonding Process Daisuke Sakurai1, Takatoshi Osumi1, Kazuya Ushirokawa1, Takashi Nakamura2 and Takatoshi Ishikawa2 (1Panasonic Corporation and 2Panasonic Factory Solutions Co., Ltd., Japan) | |
| TA4-3 | Modeling and
Optimization of Signal Integrity on Vertical Side-Chip Interconnection
Jackson Kong1, Bok Eng Cheah1 and Ai Heong Tan1,2 (1Intel Microelectronics (M) Sdn. Bhd. and 2Universiti Sains Malaysia, Malaysia) | |
| TA4-4 | A Electrical Test Circuit
for Detecting Interconnect Open Defects in 3D ICs Tomoaki Konishi, H. Yotsuyanagi and M.Hashizum (The University of Tokushima, japan) |
Room B
TB1: Printed-1
| 9:00-10:40 | TB1-1 | [Session
Invited] Printed transistors for ambient electronics Takao Someya (The University of Tokyo, Japan) |
| TB1-2 | [Session
Invited] Broad Implications Arising from Novel Sintering Process and Conductive Inks for Printed Electronics Stan Farnsworth (NovaCentrix, USA) |
TB2: Printed-2
| 10:50-12:30 | TB2-1 | [Session
Invited] Fabrication of wire bonding pad by ink-jet printing using NanoPaste Satoshi Hisanaga, Masayuki Ueda, Nobuto Terada and Yorishige Matsub (Harima Chemicals, Inc., Japan) |
| TB2-2 | [Session
Invited] Bondability of Copper Wires onto a Laser-Sintered Silver Pad Kazuhiko Yamasaki1, Sumihiro Takahashi1, Mamoru Mita2 and Katsuhiro Maekawa1 (1Ibaraki University and 2M&M Research Laboratory, Japan) | |
| TB2-3 | [Session
Invited] Silver Nano Paste as Alternative to High Temperature Lead Solder and Example of Die Attachment Using the Paste Y. Hisaeda, Keiichi Endoh and S. Kurita (DOWA Electronics Materials Co.,Ltd., japan) | |
| TB2-4 | [Session
Invited] Composition of the nanoparticle for Printed Electoronics Hidekazu Hayama (KRI, Inc., Japan) |
TB3: Printed-3
| 13:30-15:10 | TB3-1 | [Session
Invited] Fine pitch copper wiring printed by Super inkjet Kazuhiro Murata1,2, Naoki Shirakawa1, Katsuhiro Nakamura2 and Kazuyuki Masuda3 (1AIST, 2IOX Co., Ltd. and 3SIJTechnology, Inc., Japan) |
| TB3-2 | [Session
Invited] Compact gravure printing equipment Mini Lab Fine for new devices at Research and Development Yasuhisa Hashiguchi (Nihon Denshi Seiki Co., Ltd., Japan) | |
| TB3-3 | [Session
Invited] High Density Screen Printing Technology Hiroki Sato, Y. Sato, Y. Odaira and Y. Taga (Micro-tec Co.,Ltd, japan) | |
| TB3-4 | Development of Copper
Materials and Processing for Printed Electronics Kyoko Kuroda, Hideo Nakako, Maki Inada, Takaaki Noudou and Yasushi Kumashiro (Hitachi Chemical Co., Ltd, Japan) |
TB4: Interconnection-1
| 15:40-16:30 | TB4-1 | [Session
Invited] Low loop reverse wire bonding for LED packaging with wafer level phosphor printing S. W. Ricky Lee (Hong Kong University of Science & Technology, Hong Kong) |
| TB4-2 | [Session
Invited] RFID Tag Device Connection Technology Trends with New Connection Material Concept Tetsuya Onishi (GJ Tech., Hong Kong) | |
| TB4-3 | Preparation of Cu
Nano-particle in Toluene Used for Conductive Ink Song Li1, Peng Liu1 and Qiong Chen2 (1Wuhan University of Technology, 2ISCAR INT'L CO. LTD, China) | |
| TB4-4 | Disapperance of Sn Layer
and Microstructure Evolution of Intermetallic Compounds in Nano-scale
Solder Thickness Cu-Sn-Cu Sandwich Structure Qingqian Li, Pei QIN, Sha Xu and Y. C. Chan (City University of Hong Kong, Hong Kong) |
Room C
TC1: RF
| 9:00-10:40 | TC1-1 | Effect of Periodic
Dielectric Material Placed over PCB on EM Noise Shielding
Yoshiki Kayano and Hiroshi Inoue (Akita University, Japan) |
| TC1-2 | Examination of the
Reduction Technique of Radiation Noise from Power Supply Layers in PCB
Hitoshi Takakura and Shinichi Sasaki (Saga University, Japan) | |
| TC1-3 | A Broadband Antenna with
Fan-Shaped and Trapezoidal Elements for Ultra Wideband
Radio Fukuro Koshiji, Shunsuke Itaya and Yusuke Akiyama (Kokushikan University, Japan) | |
| TC1-4 | A Bent Unbalanced Dipole
Antenna with Semicircular and Trapezoidal Radiators for Ultra Wideband
Radio Yusuke AKIYAMA1, Fukuro KOSHIJI1 and Kohji KOSHIJI2 (1Kokushikan University and 2Tokyo University of Science, Japan) |
TC2: Thermal-1
| 10:50-12:30 | TC2-1 | Thermal Performance of
Various Heat Sinks Lian-Tuu Yeh (Huawei Technologies, USA) |
| TC2-2 | Thermal Characterization
of an Advanced 60 GHz CMOS Phased Array Transmitter System in Package
Module in natural convection Wei-Ren Ciou1, Hsien-Chie Cheng2,3, Wen-Hwa Chen1,4, Jing-Lin Kuo5 and Ruey-Beei Wu5 (1National Tsing Hua University, 2Feng Chia University, 3National Center for High-Performance Computing, 4National Applied Research Laboratories and 5National Taiwan University, Taiwan) | |
| TC2-3 | Thermal Design and
Implementation of Hybrid Cooling Systems for HPC Systems Jie Wei (Fujitsu Advanced Technologies Limited, Japan) | |
| TC2-4 | Sub-channel-inserted
Porous Heat Sink for Cooling Future Power Devices Kazuhisa Yuki and K. Suzuki(Tokyo University of Science, Japan) |
TC3: MFG-2
| 13:30-15:10 | TC3-1 | Coating Quality Monitoring
System Hiroshi Tsuruda and Koji Nishimura (Toray Engineering Co., Ltd., Japan) |
| TC3-2 | Effective Zeta Potential
to Chracterize Micromachined Glass Surface Yosuke Koga (Keio University, Japan) | |
| TC3-3 | Selective Formation of the
Metal Film by Electroless Plating Process to ITO Daisuke Asakawa and Tadashi Kurashina (Yamato Denki Co., Ltd., Japan) | |
| TC3-4 | Study on Palladium Removal
in the Semi-Additive Process Kumiko Ishikawa, Hideomi Takahashi, Aya Goto, Juichi Tanimoto and Shozo Seino (Ebara-Udylite Co.,Ltd., Japan) |
TC4: MFG-3
| 15:40-17:20 | TC4-1 | Homogenizing and Applying
Dielectric Film to Wafer Level Film Preparation Kazutaka Sueshige1, Keita Iimura1, Masaaki Ichiki1,2,4, Tadatomo Suga1 and Toshihiro Itoh3,4 (1the University of Tokyo, 2JST-PRESTO, 3AIST and 4 JST-CREST, Japan) |
| TC4-2 | Preparation and
characterization of PZT thin films on releasable substrate
ERIKA Komine1,Fumiaki Tomioka 1, Masaaki Ichik1,3,4, Tadatomo Suga1 and Toshihiro Itoh2,4 (1the University of Tokyo, 2AIST, 3JST-PRESTO and 4JST-CREST, Japan) | |
| TC4-3 | Fabrication of Lead-free
Dielectric Thin Film on Releasable Electrode
Structures Motoyuki Ozaki1, F. Tomioka1, Toshifumi Hosono1, Masaaki Ichiki1,3,4, Tadatomo Suga1 and Toshihiro Itoh2,4 (1the University of Tokyo, 2AIST, 3JST-Presto and 4JST-CREST, Japan) | |
| TC4-4 | Structure and Process for
Reducing Magnetic Minor Loop in Multilayer Ceramic Inductor
Minami Takato, Aki Kenmochi, Toshiki Fujino, Ken Saito and Fumio Uchikoba (Nihon University, Japan) |
Room D
TD1: MEMS-1
| 9:00-10:40 | TD1-1 | Parylene deposition aided
ionic liquid on Polyethersulfone (PES) membrane for potential use in
nanofiltration Gunawan Setia Prihandana, Y. Nishinak, Hikaru Ito and Norihisa Miki (Keio University, Japan) |
| TD1-2 | Human Position Sensing
Device with High Conductive Polymer-coated Fibers Seiichi Takamatsu1, Takahiko Imai1, Takahiro Yamashita1 and Toshihiro Itoh2 (1BEANS Laboratory and 2AIST, Japan) | |
| TD1-3 | Selectively Controlled
Alignment of Single Carbon Nanotube Bundles by
Dielectrophoresis Takuma Chikamoto1, Yuichiro Shimada1, Mitsuo Umetsu2 and Masakazu Sugiyama3 (1BEANS PROJECT, 2The University of Tohoku and 3The University of Tokyo, Japan) | |
| TD1-4 | CMOS Neural Networks
Controlled MEMS Micro Robot Targeting System on Si Frame Ken Saito, Tatsuya Ogiwara, Sinpei Yamasaki, Kazuto Okazaki, Shiho Takahama, Minami Takato and Fumio Uchikoba (Nihon University, Japan) |
TD2: MEMS-2
| 9:00-10:40 | TD2-1 | Mechanical and Electrical
Characteristics of Direct Bonded Ge/Ge interface Yuta Sasaki1, Chenxi Wang1, Eiji Higurashi1, Tadatomo Suga1, Yasuo Doi1 and Iwao Hosako2 (1The Univ. of Tokyo and 2 National Institute of Information and Communication Technology, Japan) |
| TD2-2 | Surface Modification of
Poly (ethylene terephthalate) (PET) by VUV and VUV/O3
Treatments for Flexible Capacitive Tactile Sensors Takashi Kasahara, S. Shoji and J. Mizuno (Waseda University, Japan) | |
| TD2-3 | Residue-Free Plasma
Etching of Polyimide Coatings Benjamin Mimoun1, Hoa T. M. Pham2, Vincent Henneken2 and Ronald Dekker1,2 (1Delft University of Technology and 2Philips Research, The Netherlands) | |
| TD2-4 | New selective plasma
treatment solution for streamlining MEMS manufacturing processes
Ulrike Schoembs and M. Gabrie (SUSS MicroTec Lithography GmbH, Germany) |
TD3: DMR-1
| 13:30-15:10 | TD3-1 | Comparative Study of
Dendrite Formation on Solder Pads with ImAg and OSP Surface Finishes using
Water Drop Test Method Kun Tang, F. B. Song, S. W. Ricky Lee (Hong Kong University of Science and Technology, Hong Kong) |
| TD3-2 | Simulation of Post-Mold
Cure Process in IC Packag Huy-Tien Bui1, Sheng-Jye Hwang1, Huei-Huang Lee1 and Durn-Yuan Huan2 (1National Cheng Kung University and 2 University of Medical Technology, Taiwan) | |
| TD3-3 | Simulation Assisted
Physics of Failure based Reliability Assessment Mei-Ling Wu 1, Elviz George2 and Michael Pech2,3 (1National Sun Yat-Sen University, Taiwan, 2University of Maryland, USA and City University of Hong Kong, Hong Kong) | |
| TD3-4 | iNEMI Experimental
Investigation of Creep Corrosion Haley Fu and Masahiro Tsuriya (iNEMI, USA) |
TD4: DMR-2
| 15:40-16:55 | TD4-1 | External Stress Effect to
Electromigration on Thermal Annealed and Residual Stress Controlled
Aluminum Strip Hsiang-Hung Chang1,2, L. L. Liao2 and Kuo-Ning Chiang1 (1National Tsing Hua University and 2ITRI, Taiwan) |
| TD4-2 | Reliability of Pb-free
Solder fatigue under Thermalmechanical Conditions Yung-Wen Wang and and Mei-Ling Wu (National Sun Yat-Sen University, Taiwan) | |
| TD4-3 | Quick Assessment Approach
of Lead-free Solder Joint Fatigue under Mechanical
Bending Jia-Shen Lan and Mei-Ling Wu (National Sun Yat-Sen University, Taiwan) |