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| Sessions and Keywords: |
| 1. Advanced Packaging Area Array Packages, SiP, PoP, PiP, Wafer Level Packaging, System Integration, LCD Modules, MCM, System on Package |
| 2. Substrate Laminates, Interposers, Fine Pitch, Build-up Substrates, Flexible Printed Circuits, Embedded, Conductive Paste, Thin Core, Coreless, Low CTE, Thin Film Wiring |
| 3. Design, Modeling, and Reliability Signal Integrity, Power Integrity, High Speed Board Design, Reliability, Failure Analysis, Testing, Evaluation, EDA |
| 4. Thermal Management Advanced Cooling Modules, Fans and Blowers, Heat Pipes, Heat Sinks, Micro and Nano Scale Heat Transfer, Optical Devices, Power Devices, Thermal Interface Materials, Thermal Measurements, Thermoelectrics |
| 5. Manufacturing and Process Flip Chip, Plating, Inkjet, Process Control, Equipment, Thin Films, Underfills, Encapsulation, Molding, Fluxes |
| 6. Interconnection Flip Chip, Wire Bonding, Soldering, Bump Formation, Chip Package Interaction, Low k, NCF/NCP, ACF/ACP, Leadframe, Surface Finishes, BGA, Fluxless Joining |
| 7. Optoelectronics Photonic Devices, Optical Fibers, Waveguides, Optical Interconnects, Transceivers, Connectors, LD/PD, LED, OE/EO, TOSA/ROSA, WDM, Optical Wiring Boards |
| 8. Printed Electronics Inkjet, Screen Printing, Conductive Wiring, Insulation, Printed Organic TFT, Device Applications |
| 9. 3D and TSV Silicon Stacking, Chip on Chip, Chip on Wafer, Wafer on Wafer, TSV, Via Formation and Filling, Wafer Thinning, Wireless Interconnection, 3D LSI Design and CAD System |
| 10. MEMS/Sensor MEMS/Sensor Devices, Process, Assembly and Packaging, System Integration, MOEMS |
| 11. Self-organization/Self-assembly Nano Materials/Devices, Self-organization/Self-assembly, Dissipative Structures, Hierarchical Structures, Bottom-up Manufacturing Bio-mimetic, Nature-oriented Processes/Design/Applications |
| 12. Emerging Technologies Nano Technology, Nano Imprint, Organic Semiconductors |
| 13. RF RFID, High Frequency Devices, Packaging, Filters, EMI, EMC, Antennas |
| 14. Automotive Electronics Power Devices, Power Electronics, ECU, Sensors, Lead Free Solder, Wire Harness |
| 15. Energy and Environment PV, Lead Free, Fuel Cells, Power Electronics, Power Devices, Energy Efficient Package Design |
| 16. Metrology Current Density, Power Map, Thermal Map |
| 17. Others Market Trends, Environmentally Conscious Product and Processes, Cost Analysis |
| Abstract Deadline and Paper
Submission : Authors must submit a 300-word abstract in PDF or MS Word format through the JIEP web site by November It is recommended to attach one piece of figure, picture or table. Registration TOP Notification of acceptance by the beginning of December, 2011. Final manuscript to be submitted by February 13, 2012. |
| Best Paper Awards
: The JIEP will present the Best Paper Awards to selected outstanding papers. |
| Young Awards
: The IEEE CPMT Society Japan Chapter will present the Young Awards to young parson under 35 years old. |
| Organizing Committee
: General Chair: Yasumitsu Orii (IBM Japan) Vice General Chair: Yasuhiro Ando (Fujikura), Yoshio Nogami (Toray Engineering), Shintaro Yamamichi (Renesas Electronics) |
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Technical Program Committee
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