Organizing Committee


We welcome you to ICEP-IAAC 2012 Joint Conference which will be held from April 17th to 20th at the Tokyo Big Site in Tokyo, Japan. This is a joint international conference of ICEP (sponsored by JIEP, IEEE-CPMT and IMAPS) and IMAPS All Asia Conference (sponsored by JIEP and IMAPS). ICEP 2012 is our 12th annual conference and this year, it is being held as a joint conference with 1st IAAC (IMAPS All Asia Conference). This was proposed by IMAPS HQ with the aim of facilitating the technical exchange of the state-of-the-art knowledge in research, development, manufacturing, and applications of electronic packaging in all Asian countries. The IAAC is planned to be held in rotation between Japan, Taiwan, and Korea. We hope the conference to be successful and to become an important and valuable resource under the cooperation of various Asian members.

ICEP-IAAC 2012 consists of four major parts:
● A tremendous technical program with over 120 high quality technical papers in 32 oral sessions and poster session. Contributions from more than 10 countries make ICEP-IAAC 2012 a truly global conference. Taiwan and Korean Special sessions are organized as well. The papers cover a wide spectrum of topics, including 3D packaging, Printed Electronics, MEMS, all types and levels of interconnections, Advanced Packaging, Substrate, Design, Modeling, and Reliability, Thermal Management, Manufacturing and Process, and RF.
● Three keynote presentations on Wednesday, April 18th.
● The IMAPS Global Business Council Forum on Tuesday, April 17th, featuring seven talks on “2.5D and 3D-IC packaging technology”
● The IAAC Special Session on Wednesday, April 18th, featuring 7 area (China, India, Japan, Korea, Malaysia, Singapore, Taiwan) representative’s talks regarding business, technology trend and society activities.

In addition to the conference, a dinner cruise is planned as a welcome reception event. You can enjoy your dinner with the most romantic view of Tokyo in the evening.

It's been a great pleasure to serve as the general chair of this 1st joint conference event. I am honored to be surrounded by a diligent and steadfast organizing committee and JIEP staff. The organizing Committee and I are very happy and excited to spread the JISSO technologies knowledge from Tokyo, Japan to world-wide in this revival year of 2012 after the Great East Japan Earthquake in 2011. We believe that ICEP-IAAC event will assist the revival of the Japan and its people from the disaster.

I thank you for taking the time from your busy schedule to attend ICEP-IAAC 2012. I sincerely hope you will have fruitful discussions, and wish you all a pleasant and enjoyable stay in Tokyo.

Yasumitsu Orii, IBM Japan
General Chairperson

Yasuhiro Ando
Fujikura
Vice General Chairperson

Yoshio Nogami
Toray Engineering
Vice General Chairperson
Operation Committee Chairperson

Shintaro Yamamichi
Renesas Electronics
Vice General Chairperson
Technical Program Committee Chairperson

 

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