ICEP 2011 Awards
ICEP 2011 Outstanding Technical Paper Award
| “Development of Wafer-Level Underfill Bonding Process
for 3D Chip Stacking” T.-F. Yang, K.-S. Kao, R.-C. Cheng, J.-Y. Chang, C.-J. Zhan Industrial Technology Research Institute |
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| “Investigation of PWB Laminate Resin and Its Relation
with the Pad Cratering Resistance” C. Yang, F. Song, S. W. R. Lee Hong Kong University of Science & Technology |
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| “Single-Phase Heat Transfer Performance of
Minichannel Cooling Fins for the Next Generation Power Devices” K. Yuki, K. Suzuki Tokyo University of Science |
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| “Silicon
Microparticle Ejection Using Mist-jet Technology” Y. Yokoyama1, T. Murakami1, T. Tokunaga1, T. Itoh1,2 1BEANS Project, 2Reserch Center for Ubiquitous MEMS and Micro Engineering |
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| “Microstructual Analysis of Wiskers Nucleated from
Lead-Free Tin-copper Plating Films by Mechanical Stress” Y. Mizuguchi1, Y. Murakami1, S. Tomiya 1, T. Asai2, T. Kiga2 1 Sony, 2Sony EMCS |
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ICEP 2011 IEEE CPMT Chapter Young Award
| “Cooling
Performance of a Two Phase (Vapor-Liquid) Flow Cooling System” Masaki Chiba NEC Corporation |
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| “Low-Loss Chip Assembly for Low-Power Optical I/O on
Waveguide - Integrated Organic Substrate” Masao Tokunari IBM Japan |
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| “Electrical Insulation Materials with Ultralow
CTE” Tomoaki Katagiri Sekisui Chemical |
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| “A Novel
Magnetic Shield Structure for MRAMs with Perpendicular Magnetic
Anisotropy” Takahito Watanabe Renesas Electronics |
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| “Material Technology of Conductive Wiring by Ink-jet
Print” Maki Inada Hitachi Chemical |
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ICEP 2011 JIEP Poster Award
| “All-Wet
Cu-TSV Fabrication Process Using Electroless Barrier and Seed
Layers” R. Arima 1, F. Inoue1, T. Yokoyama1, H. Miyake1 , S. Tanaka2, T. Terui2, T. Shimizu1, S. Shingubara1 1Kansai University, 2National Institute of Information and Communication Technology |
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