Room A
Poster
Session
| poster session | P01 | A Global Supply Chain Collaboration to
Synergize Technology Achievement for Green QFN
Qualification Jeffrey ChangBing Lee, Graver Chang, Cherie Chen and Jandel Lin (IST-Integrated Service Technology, Taiwan |
| P02 | Electrical Characterization of PDN
Impedance of 3D Stacked SiP with a Widebus Structure Hiroki Takatani1, Yosuke Tanaka1, Yoshiaki Oizono1, Yoshitaka Nabeshima1,Takafumi Okumura1, Toshio Sudo1, Atsushi Sakai2, Shiro Uchiyama2 and Hiroaki Ikeda2 (1Shibaura-Institute of Technology and 2ASET, Japan) | |
| P03 | Thermal Properties of A BGA Package
with Silicon Substrate Ziyu Liu (Tsinghua University, China) | |
| P04 | Novel V-groove Structure Packaging and
Thermal Analysis of AlGaN/GaN Power HEMT Stone Cheng, Chi-Ying Li, Chia-Hung Liu and Po-Chien Chou (National Chiao Tung University, Taiwan) | |
| P05 | Fabrication and Characterization of
Flexible Silicon Memory Jae-sung Lim, Ju-Hyung Kim, Hyun-Ju Kim, Jin-Wook Jung and Hyouk Lee (HANA Micron, Korea) | |
| P06 | The Bonding of InP/Si at Room
Temperature Takashi Matsumae and T. Suga (The University of Tokyo, Japan) | |
| P07 | Investigation on Mechanical Properties
and Bonding Parameters of Copper Wire Bonding Jun Cao1,2, Yutian Ding1 and S. W. Ricky Lee2 (1Lanzhou University of Technology, China and 2Hong Kong University of Science & Technology, Hong Kong) | |
| P08 | Microstructures and Joint Strength of
Vacuum Jointed Cu with Sn-Cu Alloys Masumi Hayakawa1, Ikuo Shohji1, Shinji Koyama1, Hideaki Nara2, Noboru Otomo2 and Masahisa Uenishi2 (1 Gunma University and 2ATAGO MFG, Japan) | |
| P09 | Low-Temperature Bonding Technique by
Sintering of Cu Nanoparticles Toshitaka Ishizaki and Ryota Watanabe (Toyota Central R&D Labs, Japan) | |
| P10 | Investigation of Impact Properties of
Lead-free Solders using Micro-size Specimens Yuichiro Toyama and Ikuo Shohji (Gunma University, Japan) | |
| P11 | SnAgCu and SnPb Solder Joint Strength
under Multiple Reflow Anocha Sriyarunya1, Jiraporn Tondtan1, Witoon Kittidecha1 and Hasmani Tukiman2 (1Spansion (Thailand), Thailand and 2Spansion (KualaLumpur), Malaysia) | |
| P12 | Effect of Phosphorus Additions on
Microstructure and Heat/Humidity Performance of Sn-Zn-Bi-In Lead-free
Solder Alloy Shaoxing Ji (National Institute for Materials Science, Japan) | |
| P13 | Effect of microstructural evolution on
electrical conductivity of electrically conductive adhesives containing Ag
micro-fillers Masahiro Inoue1, Hiroaki Muta1, Shinsuke Yamanaka1 and Johan Liu2,3 (1Osaka University, Japan, 2Chalmers University of Technology, Sweden and 3Shanghai University, China) | |
| P14 | Nonlinear Thermal Stress and Creep
Strain Analyses of a 3D IC Integration SiP with TSVs for Network System
Application Shang-Tsai Wu, John H. Lau, Heng-Chieh Chien and Ra-Min Tai (ITRI, Taiwan) | |
| P15 | Analysis of Stress Buffer Effect of
Polyimide on Thermo-mechanical Stress of ELK Layer in Flip-chip Packages
Motohiro Niwa1, Kazutoshi Sakamaki2 and Yoshiharu Kariya3 (1Asahi Kasei E-materials, 2Graduate school of Shibaura Institute of Technology and 3Shibaura institute of technolog, Japan) | |
| P16 | Effect of Substrate Material on Thermal
Fatigue Life of Solder Joint of WLCSP Shinya Kitagoh1, Ikuo Shohji1, Makoto Miyazaki2, Jun Watanabe2 and Kenji Hatsuzawa2 (1Gunma University and 2Nagano OKI Electric, Japan) | |
| P17 | An Approach of Embedded Chip in
Substrate and its Reliability Dali Huang1, Xin Gu2, Qian Wang1, Pinghua Bao2, Jian Cai1 and Lingwen Kong2 (1Tsinghua University and 2 Shennan Cirsuit, China) | |
| P18 | Via Design Intellectual Property and
SSN Inhibition Solution in Packaging Substrate Chi-Lin Li, Ng Sin Shyh, Sung-Mao Wu, Po-Hui Yu and Yuan-Ming W (National University of Kaohsiung, Taiwan) | |
| P19 | Analysis Approaching of
Transformer-base Differential Inductor Yuan-Ming Wu, Ren-Fang Hsu and Sung-Mao Wu (National University of Kaohsiung, Taiwan) | |
| P20 | Critically Damped On-Chip PDN Impedance
for Minimizing Power Supply Noise Hiroki Otsuka, Genki Kubo, Ryota Kobayashi, Tatsuya Mido, Yoshinori Kobayashi, Hideyuki Fujii and Toshio Sudo (Shibaura-Institute of Technology, Japan) | |
| P21 | Digitization of Nonuniformity in the
Luster of Gold Plating and the Development of Compact-appearance
Inspection Apparatus Kazuhiro Nonaka1, Toshihiro Kamohara1, Keita Tosaka1, Toshiaki Koga1, Atsushi Kimura2 and Shusaku Moriyama2 (1AIST and 2Sumitomo Electric Printed Circuits, Japan) | |
| P22 | Reliability Evaluation for Cell Bonding
in Slat-type Solar Module Naoyuki Atsuta, M. Kawasugi, K. Nakakita and T. Terada (Toray Engineering, Japan) | |
| P23 | Block copolymer porous films for the
enhancement of thermoelectric properties Kunihisa Kato1,3, Yoshika Hatasako2, Yasukazu Nakata1, Yoshinori Suzuki4, Teruaki Hayakawa4, Chihaya Adachi3,5 and Koji Miyazaki2,3 (1LINTEC, 2Kyushu Institute of Technology, 3BEANS Laboratory, 4Tokyo Institute of Technology and 5Kyushu University, Japan) | |
| P24 | New Type Sensing Technology Using
Evanescent Electromagnetic Field Area-Security for Critical facilities
Yaso Kato (Aoyama Gakuin University, Japan) | |
| P25 | A High Linear Gilbert-cell Mixer Design
by Integrated Transformer-base Balun Yi-Ching Wu, Ping-Sheng Wu, Lung-Shu Huang, Sung-Mao Wu and Cheng-Fu Yang (National University of Kaohsiung, Taiwan) | |
| P26 | Input Impedance Characteristics of
Human Body Communication Transmitter Using Realistic Human
Model Dairoku Muramatsu1, Fukuro Koshiji2, Kohji Koshiji3 and Ken Sasaki1 (1The University of Tokyo, 2Kokushikan University and 3Tokyo University of Science, Japan) | |
| P27 | A 2 GHz to 20 GHz Wideband Antenna with
Low-VSWR Characteristics for Cognitive Radio System Yusuke Akiyama, Shunsuke Itaya and Fukuro Koshiji (Kokushikan University, Japan) | |
| P28 | Wireless power transfer with
electromagnetic resonance using spiral pattern formed on printed circuit
boar Soichiro Konno, Takahiko Yamamoto and Kohji Koshiji (Tokyo University of Science, Japan) | |
| P29 | Disapperance of Sn Layer and
Microstructure Evolution of Intermetallic Compounds in Nano-scale Solder
Thickness Cu-Sn-Cu Sandwich Structure Qingqian Li, Pei QIN, Sha Xu and Y. C. Chan (City University of Hong Kong, Hong Kong) |