ICEP2016 Advance Program
April 20| A | B | C | D | E | |
| 10:30 12:10 |
WA1: iMAPS
Session WA1-1 <Session Invited> What’s Driving the Growth in SiP? Jan Vardaman, Techsearch International / USA WA1-2 <Session Invited> New Generation Embedded SiP Technology Chienfan Chen, ASE Group / Taiwan WA1-3 <Session Invited> Beyond cell phones: Issues in Higher Level Integration in High Performance Microwave Devices Susan Trulli, Raytheon / USA WA1-4 Panel Discussion: What Needs to Be Done for the Next Wave of Market/Technology Trends for Integrated Packaging |
WB1:
DMR-Mechanical WB1-1 Investigation of Thermal Cycling Maximum Temperature Effect on Fatigue Life of WLCSP Min-Hsuan Hsu, Kuo-Ning Chiang, National Tsing Hua Univ. / Taiwan WB1-2 Non-destructive Testing Method for Chip Warpage -Applications of Synchrotron Radiation X-ray Hsueh-Hsien Hsu1, Chang-Meng Wang2, Hsin-Yi Lee3, Albert T. Wu1,1National Central Univ., 2Shenmao Technology, 3National Synchrotron Radiation Research Center / Taiwan WB1-3 Cancelled To Predict Component Reliability for Active Safety Devices under Automotive Application Nikhil Govindaiah1, Marc Dressler2, Martin Bittlingmaier2, Uwe Zundel2, Arjun Yadur1, 1Robert Bosch Engineering and Business Solutions / India, 2Robert Bosch / Germany |
WC1:
RF WC1-1 Negative Group Delay Characteristics of Embedded Transmission Line with Half- wavelength Type F-SIR Structure Yoshiki Kayano1, Hiroshi Inoue2, 1Akita Univ., 2The Open Univ. of Japan / Japan WC1-2 A Design Method of Matching Circuits for a Compact Diplexer Using SAW Filters Shinpei Oshima1, Tomonori Oshima1, Koji Wada2, 1National Institute of Technology, Oyama College, 2The Univ. of Electro-Communications / Japan WC1-3 Ultra Thin Low ESL and Ultra Wide Broadband Silicon Capacitors Catherine Bunel, Franck Murray, IPDiA / France WC1-4 Transmission Characteristics of Wearable Transmitter and Stationary Receiver through Human Body Dairoku Muramatsu, Naruto Arai, Ken Sasaki, The Univ. of Tokyo / Japan |
WD1:
Substrate
and Interposers WD1-1 High Performance Insulating Adhesive Film for High-Frequency Applications Hisao Kondo, Masaki Yoshida, Munetoshi Kusama, Shin Teraki NAMICS / Japan WD1-2 Challenge to Zero CTE and Small Cure Shrinkage Organic Substrate Core Material for thin CSP Package Norihiko Sakamoto, Shin Takanezawa, Shinji Tsuchikawa, Masaaki Takekoshi, Kenichi Oohashi, Koji Morita, Hitachi Chemical / Japan WD1-3 Ultra Low Loss Build-up Film for Fine Pitch Applications Aya Kasahara, Tetsuro Iwakura, Yusuke Kondo, Tetsuro Irino, Hiroshi Shimizu, Hitachi Chemical / Japan WD1-4 Reliability Test for Integrated Glass Interposer Ching Kuan Lee1, Jen-Chun Wang1, Yu-Min Lin1, Chau-Jie Zhan1, Wen-Wei Shen1, Huan-Chun Fu1, Yuan-Chang Lee1, Chia-Wen Chiang1, Su-Ching Chung1, Su-Mei Chen1, Chia-Wen Fan1, Hsiang-Hung Chang1, Wei-Chung Lo1, Yung Jean Lu2, 1Industrial Technology Research Institute, 2Corning / Taiwan |
WE1:
Optelectronics
WE1-1 <Session Invited> Optical Multi-Chip Module for Servers and Cloud Shigeru Nakagawa, IBM Japan / Japan WE1-2 Fundamental Study on Simplified Temperature Prediction Method for LED Akira Horii, Tomoyuki Hatakeyama, Risako Kibushi, Masaru Ishizuka , Toyama Prefectural Univ. / Japan WE1-3 Numerical Prediction and Experimental Validation of Multiple Phosphor White LED Spectrum Jeffery C. C. Lo, S. W. Ricky Lee, Xungao Guo, Huishan Zhao, Hong Kong Univ. of Science and Technology / Hong Kong WE1-4 Study on Current and Junction Temperature Stress Aging Effect for Accelerated aging test of Light Emitting Diodes Chih-Ju Chan, Feng-Mao Hsu, Yen-Fu Su, Kuo-Ning Chiang, National Tsing Hua Univ. / Taiwan |
| 12:10 13:10 |
Lunch Time | ||||
| 13:10 13:50 |
Award Ceremony | ||||
| 13:50 14:50 |
Keynote
Lecture System Scaling for New Era of Automotive Electronics – An Ultimate System Integration Opportunity Rao R Tummala, Georgia Institute of Technology |
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| 14:50 15:50 |
Poster Session / Break | ||||
| 15:50 16:50 |
Keynote
Lecture System Design Challenges for Future Consumer Devices:From Glass to ChromeBooks Eric Shiu, Google Inc. |
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| 16:50 17:50 |
Keynote
Lecture The Frontiers of Information Technology Dario Gil, IBM Research |
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| 18:30 20:30 |
Welcome
Reception The Sapporo Beer Garden |
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April 21
| A | B | C | D | E | |
| 9:30 11:10 |
TA1:
Edge
Devices TA1-1 <Session Invited> Consumers & Wearables Drive Digital Health in New Directions! Matthew Hudes, Deloitte / USA TA1-2 <Session Invited> Advances in Autonomous Driving & V2X Technologies Dwight Howard, Delphi / USA TA1-3 <Session Invited> Wearable Electronics & Big Data = High Volume, High Mix Manufacturing! Charles E. Bauer, TechLead / USA TA1-4 <Session Invited> TBDNeuromorphic Devices for Cognitive Computing Yasumitsu Orii, IBM Research Tokyo / Japan |
TB1:
Printed
Electronics-1 TB1-1 <Session Invited> (50 min.) Printing Technology for Electronics Tadahiro Furukawa, Yamagata Univ. / Japan TB1-2 <Session Invited> (50 min.) Multi-functional Printing Steve Ready, PARCS A Xerox / USA |
TC1:
Thermal
Management-1 TC1-1 no-show paper Finned Heat Sinks for Cooling Outdoor Electronics under Natural Convection Lian-Tuu Yeh, Thermal Consultant / USA TC1-2 Thermal Performance Evaluation of Dual-side Cooling for a Three-dimensional (3D) Chip Stack : Additional cooling from the laminate (substrate) side Keiji Matsumoto, Hiroyuki Mori, Yasumitsu Orii, IBM Research-Tokyo / Japan TC1-3 Immersion Cooling of Electronics utilizing Lotus-type Porous Copper Kazuhisa Yuki1, Tomohiro Hara1, Soichiro Ikezawa1, Kentaro Anju1, Koichi Suzuki1, Tetsuro Ogushi2, Takuya Ide3, Masaaki Murakami3, 1Tokyo Univ. of Science-Yamaguchi, 2Hiroshima International Univ., 3Lotus Alloy / Japan TC1-4 Evaluation of Pressure Drop Characteristics around Axial Cooling Fans with Electrical Components Takashi Fukue1, Koichi Hirose1, Tomoyuki Hatakeyama2, Masaru Ishizuka2, Katsuhiro Koizumi3, 1Iwate Univ., 2Toyama Prefectural Unive., 3Cosel / Japan |
TD1:
Advanced
Packaging-1 TD1-1 <Session Invited> FO-WLP as a Disruptive Technology and the Impact on the Industry Infrastructure Jan Vardaman, Techserch / USA TD1-2 A Cost Analysis of RDL-first and Mold-first Fan-out Wafer Level Packaging Amy Palesko Lujan, SavanSys Solutions / USA TD1-3 Compression Molding Solutions for Various High end Package and Cost Savings for Standard Package Applications Muneo Miura, TOWA / Japan TD1-4 Cancelled PoP-t Package Trend and Challenge Daniel Fann, Powertech Technology / Taiwan |
TE1:
Materials
and Process-1 TE1-1 Direct Bonding and Debonding of Glass Wafers for Handling of Ultra-thin glass sheets Kai Takeuchi, Masahisa Fujino, Tadatomo Suga, The Univ. of Tokyo / Japan TE1-2 Low Temperature direct Bonding of PEEK and Pt through VUV/FAB Surface Treatments Weixin Fu1, Akitsu Shigetou2, Shuichi Shoji1, Jun Mizuno1, 1Waseda Univ., 2National Institute for Materials Science / Japan TE1-3 Low Temperature Bonding using Microscale Cu Particles Coated with Thin Sn Layers at 200°C Xiangdong Liu, Siliang He, Hiroshi Nishikawa, Osaka Univ. / Japan TE1-4 Room Temperature Bonding of Polymethylglutarimide for Layer Transfer Method Takashi Matsumae, Tadatomo Suga, The Univ. of Tokyo / Japan |
| 11:10 11:20 |
Break | ||||
| 11:20 13:00 |
TA2: BEOL
Session TA2-1 <Session Invited> Nanocarbon Interconnects: Current status and prospects Shintaro Sato, Fujitsu Laboratories, AIST / Japan TA2-2 Three-Dimensional Integration Technology of Separate SOI Layers for Photodetectors and Signal Processors of CMOS Image Sensors Masahide Goto1, Kei Hagiwara1, Yuki Honda1, Masakazu Nanba1, Yoshinori Iguchi1, Takuya Saraya2, Masaharu Kobayashi2, Eiji Higurashi2, Hiroshi Toshiyoshi2, Toshiro Hiramoto2, 1NHK Science and Technology Research Laboratories, 2The Univ. of Tokyo / Japan TA2-3 Electrical Characteristics of Bumpless Interconnects for Through Silicon Via (TSV) and Wafer-On-Wafer (WOW) Integration Y.S. Kim1,2, S. Kodama1,2, N. Maeda1,2, K. Fujimoto1,3, Y. Mizushima1,4, A. Kawai2, T.C. Hsu5, P. Tzeng5, T.K. Ku5, T. Ohba1, 1Tokyo Institute of Technology, 2DISCO, 3Dai Nippon Printing, 4Fujitsu Laboratories / Japan, 5Industrial Technology Research Institute / Taiwan TA2-4 Application Dependency of 3-D Integrated Hybrid Solid-State Drive System with Through- Silicon Via Technology Yusuke Sugiyama, Tomoaki Yamada, Chihiro Matsui, Takahiro Onagi, Ken Takeuchi, Chuo Univ. / Japan |
TB2:
Printed
Electronics-2 TB2-1 <Session Invited> Printable and Ultra-flexible Temperature Sensor Based on Polymer Tomoyuki Yokota, Takao Someya, The Univ. of Tokyo / Japan TB2-2 <Session Invited> High Stability of Silver Nanowire Based Electrodes for Bio-sensors Teppei Araki, Shusuke Yoshimoto, Takafumi Uemura, Masaya Kondo, Tsuyoshi Sekitani, Osaka Univ. / Japan TB2-3<Session Invited> Practical Use of a Gravure Offset Printing Technology in the Printed Electronics Hiramatsu Kenta, Miyaji Toshiya, SCREEN Holdings / Japan TB2-4 <Session Invited> High Resolution Printing Processes with High Throughput, Enhanced Step Coverage, and High Design Flexibility Yasuyuki Kusaka, Hirobumi Ushijima, National Institute of Advanced Science and Technology / Japan |
TC2:
Thermal
Management-2 TC2-1 Accurate Thermal Boundary Condition to Predict Hot Spot Temperature using Electro-Thermal Analysis Risako Kibushi, Tomoyuki Hatakeyama, Shinji Nakagawa, Masaru Ishizuka, Toyama Prefectural Univ. / Japan TC2-2 Thermal Analysis of a Battery in an Electronic Device for an Outdoor Application Nitesh Kumar Sardana, Ritwik Alok Pattnayak, Susyamala Pavan Kumar Busam, Chandan Kumar Ghosh, Laxmidhar Biswal, Robert Bosch Engineering and Business Solutions / India TC2-3 Study of Relationship between Copper Patterns and Temperature Rise of Printed Circuit Board for Small Surface Mount Electronic Devices using Constriction Thermal Resistance Yoshinori Aruga1, Koichi Hirasawa1, Hirotoshi Aoki1, Yasushi Ohashi1, Tomoyuki Hatakeyama2, Shinji Nakagawa2, Masaru Ishizuka2, 1KOA, 2Toyama Prefectural Univ. / Japan TC2-4 Effects of Substrate Dimensions and Boundary Conditions on the Heat Spreading of LED Package Shi-Wei Ricky Lee1, Zhenhuan Tian1, Minshu Zhang2, An Xie2, 1Hong Kong Univ. of Science and Technology, 2Xia Men Univ. of Technology / Hong Kong |
TD2:
Advanced
Packaging-2 TD2-1 Reliable 4 Million Micro Bumps at 7.6-um Pitch Interconnection Technology for 3D Stacked 16 Million Pixel Image Sensor Yoshiaki Takemoto, Naohiro Takazawa, Mitsuhiro Tsukimura, Haruhisa Saito, Toru Kondo, Hideki Kato, Jun Aoki, Kenji Kobayashi, Shunsuke Suzuki, Yuichi Gomi, Seisuke Matsuda, Yoshitaka Tadaki, Olympus / Japan TD2-2 Electromigration in Microbumps with Cu-Sn Intermetallic Compounds Yi-Cheng Chu1, Chau-Jie Zhan1, Han-Wen Lin2, Yu-wei Huang2,Chih Chen1, 1National Chiao Tung Univ., 2Industrial Technology Research Institute / Taiwan TD2-3 Effects of Solder Wettability of Resist Materials on Solder Filling with Injection Molded Solder (IMS) Technology Toyohiro Aoki, Takashi Hisada, Eiji Nakamura, Hiroyuki Mori, Yasumitsu Orii, IBM Japan / Japan TD2-4 Fine Pitch Micro-Bump forming by Printing Hiroaki Ikeda1,2, Shigenobu Sekine1, Ryuji Kimura1, Koichi Shimokawa1, Keiji Okada1, Hiroaki Shindo1, Tatsuya Ooi1, Rei Tamaki1, Makoto Nagata2, 1Napra, 2Kobe Univ. / Japan |
TE2:
Materials
and Process-2 TE2-1 Low Temperature Sintering of Silver Nanoparticle Paste for Electronic Packaging Hongqiang Zhang1, Guisheng Zou1, Lei Liu1, Aiping Wu1, Y. Norman Zhou1,2, 1Tsinghua Univ. / China, 2Univ. of Waterloo / Canada TE2-2 Development of a Ag/glass Die Attach Adhesive for High Power and High Use Temperature Applications Maciej Patelka, Noriyuki Sakai , Cathy Trumble, NAMICS North American R&D Center / USA TE2-3 On-Demand Gold Laser-Plating onto Stainless Steel for Electrical Contacts Mitsugu Yamaguchi1, Nobuyuki Miyagi2, Mamoru Mita3, Kazuhiko Yamasaki1, Katsuhiro Maekawa1, 1Ibaraki Univ., 2Ibaraki Giken, 3M&M Research Laboratory / Japan TE2-4 Self-Healing Stretchable Wiring Using Conductive Magnetic Powder Shinya Toda, Kensuke Kanda, Takayuki Fujita, Kazusuke Maenaka, Univ. of Hyogo / Japan |
| 13:00 14:00 |
Lunch
Time |
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| 14:00 15:40 |
TA3: iNEMI
Session TA3-1 <Session Invited> An Overview of the Photonics Systems Manufacturing Consortium - A participant in the Americal Institute for Manufacturing - Integrated Photonics Institute Richard F. Otte3, Robert Pfahl1, Lionel Kimerling2, Bill Bottoms4, John MacWilliams5, Rich Grzybowski6, Randolph Kirchain2, Elsa Olivetti2, 1iNemi, 2Massachusetts Institute of Technology, 3Promex Industries, 4Third Millennium Test Solutions, 5Bishop & Associates, 6Macom / USA TA3-2 Recent Trends of Packaging Warpage and Measurement Metrologies Wei Keat Loh1, Ron Kulterman2, Haley Fu4, Masahiro Tsuriya5, 1Intel Technology / Malaysia, 2Flextronic / USA, 3iNEMI / China, Japan TA3-3 How the Mold Compound Thermal Expansion Overrules the Solder Composition Choice in Board Level Reliability Performance B. Vandevelde1, L. Degrendele2, M. Cauwe2, B. Allaert3, R. Lauwaert4, G. Willems1, 1Imec, 2Imec CMST, 3Connect Group, 4Interflux Electronics / Belgium TA3-4 Framework for Implementing Material Alternatives Assessment Haley Fu1, Stephen Tisdale2, Mark Schaffer1, 1International Electronics Manufacturing Initiative, 2Intel / USA |
TB3:
Printed Electronics-3
TB3-1 < <Session Invited> Novel Wiring Structure for 3D- Conformable Devices Susumu Sawada, Yoshihiro Tomita, Koichi Hirano, Hiromi Morita, Takashi Ichiryu, Masanori Nomura, Koji Kawakita, Panasonic / Japan TB3-2 <Session Invited> Direct Electrode Patterning on Layered GaN on Sapphire Substrate by Using Needle-type Dispenser System of Ag Nanoinks Yukiyasu Kashiwagi1, Masashi Saitoh1, Takahiro Hasegawa1, Kimihiro Matsukawa1, Tasuku Shigemune2, Atsushi Koizumi2, Takanori Kojima2, Yasufumi Fujiwara2, Hiroshi Kakiuchi3, Nobuyoshi Aoyagi3, Yukio Yoshida3, Masami Nakamoto1, 1Osaka Municipal Technical Research Institute, 2Osaka Univ., 3Daiken Chemical / Japan TB3-3 The Secret of Cool Plasma Sintering for Low-temperature Bulk Formation from Copper Nanoparticles Naoki Shirakawa, National Institute of Advanced Industrial Science and Technology / Japan TB3-4 <Session Invited> Variation in electrical conductivity of stretchable printed wires and electrodes due to fatigue damage in several situations Masahiro Inoue, Yasunori Tada, Yosuke Itabashi, Ryo Kimura, Shuhei Taya, Gunma Univ. / Japan |
TC3:
Thermal
Management-3 TC3-1 Thermal Characterization of Capacitors Zoltan Sarkany1,2, Gabor Farkas1,2, Marta Rencz1,2, 1Mentor Graphics, 2Budapest Univ. of Technology and Economics / Hungary TC3-2 Approaches for Improving Peak Temperature Detection Capability of Infrared Thermograph Koichi Hirasawa1, Yoshinori Aruga1, Yasushi Ohashi1, Hirotoshi Aoki1, Toshio Tomimura2, 1KOA, 2Kumamoto Univ. / Japan TC3-3 Basic Study on Reduction of Measurement Time for Evaluating Thermophysical Properties of Insulated Heat Dissipation Sheet based on Quasi-Steady State Measurement Jumpei Hatakeyama, Koichi Hirose, Michimasa Uchidate, Takashi Fukue, Iwate Univ. / Japan TC3-4 Thermal Resistance Evaluation by High-temperature Transient Thermal Analysis Method for SiC Power Modules Fumiki Kato, Hiroshi Nakagawa, Hiroshi Yamaguchi, Hiroshi Sato, National Institute of Advanced Industrial Science and Technology / Japan |
TD3: 3DIC
Packaging-1 TD3-1 Back-Via 3D Integration Technologies by Temporary Bonding with Thermoplastic Adhesives and Visible-Laser Debonding Mariappan Murugesan1, Takafumi Fukushima1, Jicheol Bea1, Hiroyuki Hashimoto1, Sanghoon Lee1,2, Makoto Motoyoshi1,2, Tetsu Tanaka1, Kangwook Lee1, Mitsumasa Koyanagi1, 1Tohoku Univ., 2Tohoku-MicroTec / Japan TD3-2 Investigation on Microstructure and Resistivity in Cu-TSVs for 3D Packaging Akira Satou1,2, Hiroyuki Kadota2, Takashi Inami1, Masahiko Itou1, Jin Onuki1, 1Ibaraki Univ., 2Hitachi Power Solutions / Japan TD3-3 No Pumping at 450℃ with Electrodeposited Copper TSV Kazuo Kondo, Fine Feature Electrodeposition Research Ceneter / Japan TD3-4 Bonding condition design methodology using Sn-Ag thin film for 3DIC Yoshiharu Iwata, Naoki Narita, Takumi Shigemoto, Kiyoto Yoneta, Takahiro Yamamoto, Ryohei Satoh, Osaka Univ. / Japan |
TE3:
Materials
and Process-3 TE3-1 Study on the Mitigation Solder of the External Stress Type Whisker Hiroyuki Iwamoto, Osamu Munekata, kaichi Tsuruta, Senju Metal Industry / Japan TE3-2 Front-side Metallization of Silane-compound-modified Si by Electroless deposition of Ni(P) and Interfacial Characterizations Kuei-Chang Lai1, Pei-Yu Wu1, Tzu-Chien Wei2, Tseng-Chieh Pan2, Chih-Ming Chen1, 1National Chung Hsing Univ., 2National Tsing-Hua Univ. Taiwan / Taiwan TE3-3 Fine Line/Space IC Substrate Made by Selectively Fully Additive Process Shin-Hua Chao, Chao-Fu Weng, Advanced Semiconductor Engineering / Taiwan TE3-4 Cancelled Fabrication of highly (111) oriented in nanotwinned Cu by pulsed electroplating and its application in microelectronic packaging Chia-Ling Lu1, Han-Wen Lin1, Chih Chen1, Jui-Chao Kuo2, King-Ning Tu3, 1National Chiao Tung Univ., 2National Cheng Kung Univ. / Taiwan, 3Univ. of California at Los Angeles / USA |
| 15:40 16:40 |
Poster
Session / Break |
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| 16:40 18:45 |
TA4: Taiwan
Session TA4-1 <Session Invited> Heterogeneous Integration: sensors and computing platform Shen-Li Fu1, Wei-Chung Lo2, 1I-Shou Univ., 2Industrial Technology Research Institute / Taiwan TA4-2 <Session Invited> Innovated 20”x20” Panel Size Glass Manufacturing Technology for SiP Application Yu-Hua Chen, Yu-Chung Hsieh, Wei-Di Lin, Chun-Hsien Chien, Unimicron Technology / Taiwan TA4-3 <Session Invited> Development of 3D IC Technologies for Heterogeneous Integration and Neural Sensing Applications Kuan-Neng Chen, National Chiao Tung Univ. / Taiwan TA4-4 <Session Invited> Mechanical Properties of Intermetallics in Solder Joints C. R. Kao, National Taiwan Univ. / Taiwan TA4-5 <Session Invited> Advanced Design for Optical Devices’ Thermal Fluid Coupling Dissipating Chung-Ting Wang1, Ping-Feng Yang1, Chi-Hui Chien2, Wei-Chi Lee2, Ying-Xu Lu2, Bo-Syun Chen2, Yu-Yan Chen2, 1Advanced Semiconductor Engineering, 2National Sun Yat-Sen Univ. / Taiwan |
TB4:
Printed
Electronics-4 TB4-1 Effect of Process Parameters on Hard Coating Film Characteristics in Roll-to-Roll Printing Process System Dongseok Shin, Sang Myung Lee, Ilgu Yun, Yonsei Univ. / Korea TB4-2 Characterization Methodology of Transparent Hard Coating Film on Transparent Substrates using Capacitance-Voltage Measurement Sang Myung Lee, Dongseok Shin, Ilgu Yun, Yonsei Univ. / Korea TB4-3 Reliability Design on Wearable Device for Initial Osteoarthritis (OA) on Knee Joints Hsiang-Chen Hsu, Pin-Chieh Wang, Jia-Jung Wang, Shen-Li Fu, I-Shou Univ. / Taiwan TB4-4 Low Temperature Interconnect Fabrication on PDMS Polymeric Substrates using Ag Nanoparticles and Submicron Particles Sin-Yong Liang1, Yu-Siang Fang1, Po-Hao Chiang1, Jenn-Ming Song1, Lung-Tai Chen2, 1National Chung Hsing Univ., 2Industrial Technology Research Institute / Taiwan |
TC4:
Interconnection-1 TC4-1 no-show paper Mechanical Properties of SnAgCu- SnBi Composition Composited Solder Joints using Bending Test Fengjiang Wang1,2, Ying Huang1, Chengchao Du1, 1Jiangsu Univ. of Science and Technology, 2Harbin Institute of Technology / China TC4-2 Influence of Bi additions on the Distinct βSn Grain Structure of Sn-0.7Cu-0.05Ni-xBi (x = 0-4wt%) Sergey Belyakov1, Takatoshi Nishimura2, Keith Sweatman2, Kazuhiro Nogita3, Christopher Gourlay1, 1Imperial College London / UK, 2Nihon Superior / Japan, 3Univ. of Queensland / Australia TC4-3 Interaction between Micro Cu Bumps and Substrate with Thin Ni/Thick Au SF in TCNCP FC Packaging Weihong Zhang, Lingling Ji, Zhimin Liu, Tonglong Zhang, Nantong Fujitsu Microelectronics / China TC4-5 Mechanical Fatigue Assessment of SAC305 Solder Joints under Harmonic Vibrations Jean-Baptiste Libot1,2, Lionel Arnaud1, Olivier Dalverny1, Joel Alexis1, Philippe Milesi2, Frédéric Dulondel2, 1Univ. of Toulouse, 2SAFRAN Sagem / France TC4-4 Cancelled Challenges and Solutions in Enabling A System-in-Package (SiP) Fern Nee Tan, Intel Microelectronics (M) / Malaysia |
TD4: 3DIC
Packaging-2 TD4-1 Characterization of Elastic-Plastic Properties of Intermetallic Compounds Ruei-You Hong1, Hsien-Chie Cheng2, Hsuan-Chi Hu1, Wen-Hwa Chen1, 1National Tsing Hua Univ., 2Feng Chia Univ. / Taiwan TD4-2 Morphological Evolution Induced by Volume Shrinkage in Micro Joints Hong-Wei Yang, C. Robert Kao, National Taiwan Univ. / Taiwan TD4-3 Electrochemical Corrosion of Interconnect Materials by Residual Reductants Ming-Yan Lai1, Jenn-Ming Song1, Jing-Yuan Lin2, 1National Chung Hsing Univ., 2Industrial Technology Research Institute / Taiwan TD4-4 Evaluation of Strength Test of Cu TSV Chips Using Acoustic Emission Method F.C. Lu1, H.T. Keng1, H.Y. Liu1, M.Y. Tsai1, P.C. Lin2, 1Chang Gung Univ., 2Nanya Technology / Taiwan TD4-5 Cancelled Thin Wafer handling technologies for TSV packaging Amandine Pizzagalli, Yole Developpement / France |
TE4:
Materials
and Process-4 TE4-1 <Session Invited> Using FEA to Determine Test Speed for High Speed Shear Test on BGA based on Field Conditions Cheryl Selvanayagam, Advanced Micro Devices / Singapore TE4-2 Resolution of Contamination on Controller IC Bond Pads for High Pb Multi-Stack MCM Clip QFN Lorraine R. Duldulao, Ruby Ann M. Camenforte, Roxanna S. Caguioa, Jason B. Colte, Texas Instruments / Philippines TE4-3 Resolving Key Manufacturing Challenges in Flip Chip QFN Package James Raymond Baello, Jason Colte, Robinson Quiazon, Texas Instruments / Philippines TE4-4 no-show paper Effect of Co Addition on Interface Reaction between Sn-Ag-Cu Solder and Cu Substrate Jianxin Wang1,2, Yun Zhou1, Taikun Fan1, Qing Zhu1, 1Jiangsu Univ. of Science and Technology, 2Nanjing Univ. of Aeronautics and Astronautics / China TE4-5 First-principles Density Function Calculations of Physical Properties of Triclinic Cu7In3 Ching-Feng Yu1, Hsien-Chie Cheng2, Wen-Hwa Chen1, 1National Tsing Hua Univ., 2Feng Chia Univ. / Taiwan TE4-6 Cancelled Effect of multiple reflow cycles on Package solder joint strength Anocha Sriyarunya, Cypress Semiconductor (Thailand) / Thailand |
April 22
| A | B | C | D | E | |
| 9:30 11:10 |
FB1:
Power
Electronics Integration-1 FB1-1 <Session Invited> Design and Integration of a 10 kV Silicon Carbide (SiC) MOSFET Power Module Christina Dimarino, Virginia Tech / USA FB1-2 Additive Manufacturing of Magnetic Components for Power Electronics Integration Yi Yan1, Khai.D.T. Ngo1, Yunhui Mei2, Guo-Quan Lu1,2, 1Virginia Tech / USA, 2Tianjin Univ. / China FB1-3 Power Cycling Test and Failure Mode Analysis of High-power Module Li-Ling Liao1,2, Chun-Kai Liu1, Kuo-Ning Chiang2, 1Industrial Technology Research Institute, 2National Tsing Hua University, Taiwan FB1-4 Investigation of Connecting Techniques for High Temperature Application on Power Modules Fumiyoshi Kawashiro1,2, Yoshiki Endo1, Tatsuo Tonedachi1, Hiroshi Nishikawa2, 1Toshiba Corporation Semiconductor & Storage Products, 2Osaka Univ. / Japan |
FC1:
N-MEMS-1 FC1-1 Design of Electromagnetic Induction Type MEMS Motor with Multilayer Ceramic Three-Dimensional Coil M. Takato, Y. Yokozeki, K. Mishima, Y. Han, K. Saito, F. Uchikoba, Nihon Univ. / Japan FC1-2 Development of Metal-Bonded Langevin Transducer using LiNbO3 Hiroshi Ito, Hikaru Jimbo, Koichi Shiotani, Nagahide Sakai, Olympus / Japan FC1-3 Bare Chip Mount of Neural Networks IC on MEMS Microrobot Yuxuan Han, Kazuki Sugita, Daisuke Tanaka, Minami Takato, Ken Saito, Fumio Uchikoba, Nihon Univ. / Japan FC1-4 Development of Electromagnetic Induction Type MEMS Air Turbine Generator with Ball Bearing K. Mishima, Y. Yokozeki, Y. Han, M. Takato, K. Saito, F. Uchikoba, Nihon Univ. / Japan |
FD1:
Interconnection-2
FD1-1 Stress Evaluation of Flip Chip Bonding Die by Thermal Compression Bonding using Raman Spectroscopy Mototaka Ito, Uchida Uchida, Ryuichi Sugie, Toray Research Center / Japan FD1-2 Evaluation of Relationship between Residual Stress of ICs and Package Warpage Caused by Flip-Chip Bonding Toshio Enami1, Osamu Horiuchi2, Young-Gun Han2, Hajime Tomokage2, 1Sekisui Chemical, 2Fukuoka Univ. / Japan FD1-3 Novel Processing Scheme for Embedding and Interconnection of Ultra-thin IC Devices in Flexible Chip Foil Packages and Recurrent Bending Reliability Analysis Christof Landesberger1, Nagarajan Palavesam1,2, Waltraud Hell1, Andreas Drost1, Robert Faul1, Horst Gieser1, Detlef Bonfert1, Karlheinz Bock2, Christoph Kutter1, 1Fraunhofer Research Institution for Microsystems and Solid State Technologies, 2Technische Universität Dresden / Germany FD1-4 A Novel Approach for Forming Ductile Cu-to-Cu Interconnection Che-yu Yeh, Yi-kai Kuo, Shih-kang Lin, National Cheng Kung Univ. / Taiwan |
FE1:
Materials
and Process-5 FE1-1 Warpage Characterization Analysis for Embedded Package Technology Tang-Yuan Chen, Meng Kai-Shih, Ming-Hung Chen, Wei-Chung Chen, Shoji Uegaki, Chin-Li Kao, Ping-Feng Yang, Chin-Pin Hung, Advanced Semiconductor Engineering / Taiwan FE1-2 Development of a Simple Cup Method for Water Vapor Transmission Rate Measurements under High-temperature Condition Shinya Iizuka1, Kazuhide Murata1, Masahiro Sekine1,2, Chiaki Sato3, 1Saitama Industrial Technology Center, 2Waseda Unive., 3Tokyo Institute of Technology / Japan FE1-3 Novel Copper Surface Preparation Processes for Copper Alloy Lead Frame Lamination Pretreatment in Embedded Packaging Device Wei-Chung Chen, Chiu-Wen Lee, Lu-Fu Lin, Yen-Fu Liu, Hau Cheng, Te-Jung Hsu, Kun-Ting Tsai, Ming-Hung Chen, Tang-Yuan Chen, Pin-Feng Yang, Shoji Uegaki, Chih-Pin Hung, Advanced Semiconductor Engineering / Taiwan FE1-4 Cancelled Wafer-level Plasma Abnormality Detection using a Wide-angle Lens for Optical Emission Spectroscopy Applied to Plasma Manufacturing System In Joong Kim, Ilgu Yun, Yonsei Univ. / Korea |
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| 11:10 11:20 |
Break | ||||
| 11:20 13:00 |
FA2: Korea
Session-1 FA2-1 <Session Invited> Preparation and Properties of Passivation Layers for Thin Film Solar Cells Ho Jung Chang, Sang Hee Lee, Byung Min Park, Sae Chan Mun, Jae Jin Jung, Jaeho Pyee, Dankook Univ. / Korea FA2-2 <Session Invited> Electrochemical Evaluation of Copper Etchant to Avoid the Galvanic Etching in Cu/Au Pads Jae-Ho Lee1, Jong-Chan Choi1, Jinuk Lee2, 1Hongik Univ., 2Samsung Electro-Mechanics / Korea FA1-3 <Session Invited> Effect of environment on direct bonding at room temperature: Origin of solid adhesion under inhomogeneous medium Doo-In Kim, Taehoon Kim, Myung Yung Jeong, Pusan National Univ. / Korea FA1-4 <Session Invited> Plasma assisted low temperature Cu-Cu bonding for 3D IC Sungdong Kim, Seoul National Univ. of Science and Technology / Korea |
FB2:
Power
Electronics Integration-2 FB2-1 Reliability of Pressureless Sintered Nanosilver for Attaching IGBT Devices Shancan Fu, Yijing Xie, Yunhui Mei, Tianjin Univ. / China FB2-2 Double-sided Joining IGBT Devices by Pressureless Sintering of Nanosilver Paste Haidong Yan, Shancan Fu, Yunhui Mei, Tianjin Univ., / China FB2-3 Bonding Process without Pressure using a Chestnut-burr-like Particle Paste for Power Electronics Myong-Hoon Roh1, Hiroshi Nishikawa1, Seiichiro Tsutsumi1, Naruhiko Nishiwaki2, Keiichi Ito2, Koji Ishikawa2, Akihiro Katsuya2, Nobuo Kamada3, Mutsuo Saito3, 1Osaka Univ., 2NHK SPRING, 3KAKEN TECH / Japan FB2-4 Cancelled Influence of Sintering Conditions on Mechanical Property Variations of Sintered Material Shota Okuno1, Hirotaka Morita1, Qiang Yu1, Yusuke Nakata2, 1Yokohama National Univ., 2Calsonic Kansei / Japan |
FC2:
N-MEMS-2 FC2-1 Neural Networks IC for Locomotion Rhythm Generator Emulating Living Organism Daisuke Tanaka, Kazuki Sugita, Yuxuan Han, Minami Takato, Fumio Uchikobar, Ken Saito, Nihon Univ. / Japan FC2-2 Room-temperature Wafer Bonding using Smooth Gold Thin Films for Wafer-level MEMS Packaging Yutaka Kunimune1, Ken Okumura1, Eiji Higurashi1, Tadatomo Suga1, Kei Hagiwara2, 1The Univ. of Tokyo, 2NHK Science and Technology Research Laboratories / Japan FC2-3 ST-quartz/LiTaO3 Direct Bonding Using SiO2 Amorphous Layers with VUV/O3 Pre-treatment for a Novel 5G Surface Acoustic Wave Device Haruka Suzaki, Hiroyuki Kuwae, Akiko Okada, Bo Ma, Shuichi Shoji, Jun Mizuno, Waseda Univ. / Japan FC2-4 VUV/O3 Assisted Single Crystal Quartz Bonding with Amorphous SiO2 Intermediated Layers for Manufacturing Optical Low Pass Filter Ma Bo, Hiroyuki Kuwae, Akiko Okada, Weixin Fu, Shuichi Shoji, Jun Mizuno, Waseda Univ. / Japan |
FD2:
Interconnection-3 FD2-1 <Session Invited> Ultra Thermal Stable Cu-to-Cu Interconnection Shih-kang Lin, Che-yu Yeh, Mei-jun Wang, Hao-miao Chang, National Cheng Kung Univ. / Taiwan FD2-2 Advanced Cu-Cu Thermocompression Bonding Methodology for Future 3DICs Hajime Mitsuishi1, Takashi Tsuto1, Masashi Okada1, Isao Sugaya1, Kaoru Ohmori1, Minoru Fukuda1, Kazuya Okamoto1,2, 1Nikon, 2Osaka Univ. / Japan FD2-3 Influence of Pretreatment on Copper Direct Bonding Po-Hao Chiang, Jenn-Ming Song, National Chung Hsing Univ. / Taiwan FD3-4 Bonding of Copper Pillars Using Electroless Ni Plating Sean Yang, Han-Tang Hong, Yan-Bin Chen, C. Robert Kao, National Taiwan Univ. / Taiwan |
FE2:
Materials
and Process-6 FE2-1 Partial Discharges in Ceramic Substrates - Correlation of Electric Field Strength Simulations with Phase Resolved Partial Discharge Measurements Christoph Friedrich Bayer, Uwe Waltrich, Amal Soueidan, Eberhard Baer, Andreas Schletz, Fraunhofer Institute for Integrated Systems and Device Technology / Germany FE2-2 Enhancement of the Partial Discharge Inception Voltage of Ceramic Substrates for Power Modules by Trench Coating Uwe Waltrich1, Christoph Friedrich Bayer1, Martin Reger2, Andreas Meyer2, Xinhe Tang2, Andreas Schletz1, 1Fraunhofer Institute for Integrated Systems and Device Technology, 2Rogers Germany / Germany FE2-3 Study on Effect of Thermo- Structural loading on the PCB during Selective Soldering Process using Finite Element Analysis Subraya Krishna Bhat1, Raghavendra Deshpande2, Peter Beck3, Sudarshan Hegde2, Y.S. Upadhyaya1, Chandan Kumar Ghosh2, 1Manipal Univ., 2Robert Bosch Engineering and Business Solutions / India, 3Robert Bosch / Hungary FE2-4 Viscoelastic Analysis of Multistage Stacked Via Structure in Build-up Substrate Hideaki Nagaoka, Tomoyuki Akahoshi, Masaharu Furuyama, Daisuke Mizutani, Fujitsu Laboratories / Japan |
| 13:00 14:00 |
Lunch Time | ||||
| 14:00 16:05 |
FA4: Korea
Session-2 FA4-1 <Session Invited> Stretchable Interconnection Formed with Metal Films on Polydimethylsiloxane Substrates for Stretchable Device Applications Tae Sung Oh, Donghyun Park, Dae Ung Park, Kee-Sun Han, Soo Jin Shin, Hyun-Ah Oh, Hongik Univ. / Korea FA4-2 <Session Invited> Mechanical Reliability of Advanced Thin Films for Flexible Devices Taek-Soo Kim, KAIST / Korea FA4-3 <Sesison Invited> Module packaging effects on MEMS sensor performance Yeong K Kim1, Hyun Jin Kang1, Joon Ki Kim2, 1Inha Univ., 2Korea Institute of Industrial Technology / Korea |
FB3:
Power
Electronics Integration-3 FB3-1 Thermo-mechanical Reliability of High-temperature Power Modules with Metal-ceramic Substrates and Sintered Silver Joints Shan Gao1, Seiya Yuki1,2, Hideyo Osanai2, Weizhen Sun1, Khai D. Ngo1, Guo-Quan Lu1, 1Virginia Tech / USA, 2DOWA Metaltech / Japan FB3-2 Thermal Cycling Lifetime Estimation of Sintered Metal Die Attachment Tomohisa Suzuki1, Yusuke Yasuda1, Takeshi Terasaki1, Toshiaki Morita1, Yuki Kawana2, Dai Ishikawa2, Masato Nishimura2, Hideo Nakako2, Kazuhiko Kurafuchi2, 1Hitachi, 2Hitachi Chemical / Japan FB3-3 Higher Thermal Cycling Reliability of Power Semiconductor Module for Power Converters Akira Morozumi1, Hiroaki Hokazono1, Yoshitaka Nishimura1, Yoshiharu Kariya2, Eiji Mochizuki1, Yoshikazu Takahashi1, 1Fuji Electric, 2Shibaura Institute of Technology / Japan FB3-4 Thermal Compression Bonding for Power IC Attachment Using Pure Zn Chih-Hao Fan, Ting-Jui Wu, Jenn-Ming Song, National Chung Hsing Univ. / Taiwan |
FC3:
DMR-Electrical
FC3-1 A Built-in Electrical Test Circuit for Detecting Open Leads in Assembled PCB Circuits Takumi Miyabe1, Masaki Hashizume1, Hiroyuki Yotsuyanagi1, Shyue-Kung Lu2, Zvi Roth3, 1Tokushima Univ. / Japan, 2National Taiwan Univ. of Science and Technology / Taiwan, 3Florida Atlantic Univ. / USA FC3-2 Study on Electrical Characteristics of Micron-order Wiring with Nano-scale Conductive Metal Particle Masaya Tanaka, Tsuyoshi Tsunoda, and Shuji Sagara, Dai Nippon Printing / Japan FC3-3 Transmission Model of Human Body Communication Incorporating Size and Distance between the Two Electrodes of a Transmitter Naruto Arai, Dairoku Muramatsu, Ken Sasaki, The Univ. of Tokyo / Japan FC3-4 Cancelled High Performance Full System Power Delivery Design on System on Package (SoP) Heng Chuan Shu, Li Chuang Quek, Jon Sern Lim, Chun Heng Lee, Intel Microelectronics (M) / Malaysia FC3-5 Cancelled Multi Chip Package (MCP) Design Tradeoff with Smart Footprint Smart Footprint Concept Howe Yin Loo, Intel Microelectronics (M) / Malaysia |
FD3:
Interconnection-4 FD3-1 The Corrosion Behavior of Ag Alloy Wire Bond on Al Pad in Molding Compounds of Various Chlorine Contents under Biased-HAST Ying-Ta Chiu1, Tzu-Hsing Chiang1, Ping-Feng Yang1, Louie Huang1, Chih-Pin Hung1, Shoji Uegaki2, Kwang-Lung Lin3, 1ASE Group / Taiwan, 2ASE Group / Japan, 3National Cheng Kung University / Taiwan FD3-2 Effect of Ag-4Pd Alloy Bonding Wire Properties and Structure on Bond Strengths and Reliability Jun Cao1,2, JunLing Fan3, WenBin Gao1, 1HeNan Polytechnic Univ., 2HeNan YOUK Electronic Material, 3Jiaozuo Unive. / China FD3-3 Relationship between Mechanical and Electrical Properties of Cu Wire and Al Pad Bonding Yuji Ishida1, Kenji Sunahara2, 1Yaskawa Electric, 2Fukuoka Institute of Technology / Japan FD3-4 Enabling Cu Wire in 3D Stack Package Ruby Ann M. Camenforte1, Ray Fredric de Asis1, Mahmud Chowdhury2, 1Texas Instruments / Philippines, 2Texas Instruments / USA FD3-5 Cancelled Solder Joint Reliability Investigation Of Chip Scale Package With Plastic Core Solder Balls On Thermomechanically Loaded PCBs Fama Ghaffari Ashtiani, Alen Jose George, Robert Bosch GmbH / Germany |
FE3:
Materials
and Process-7 FE3-1 Epoxy Molding Compound for Fingerprint Sensor Junichi Tabei, Hideaki Sasajima, Takeshi Mori, Sumitomo Bakelite / Japan FE3-2 The Novel Liquid Molding Compound for Fan-out Wafer Level Package Katsushi Kan1, Yosuke Oi1, Yasuhito Fujii1, Masato Miwa2, Michiyasu Sugahara2, 1Nagase ChemteX, 2Nagase & / Japan FE3-3 Ultra Thick Photo Resist for FO-WLP Keiichi Satou, Makoto Katsurayama, Akito Hiro, Hirokazu Sakakibara, Kenji Okamoto, Kouichi Hasegawa, JSR / Japan FE3-4 Investigation of Electrochromic Properties of Novel Tungsten Trioxide Nano-structure Preparation Using Hydrothermal Process Jia-Cian Hsieh, Wen-Jen Liu, I-Shou Univ. / Taiwan FE3-5 Cancelled Buffer Reservoir in Mold Chase as an Effective Solution to Wire Shorted to Wire Ping Ying Kok, Min Foh Suu, Chokkan Thavathason, Infineon Technologies (M) / Malaysia |
Poster Session
P01 P02 P03 P04 P05 P06 P07 P08 P09 P10 P11 P12 P13 P14 P15 P16 P17 P18 P19 P20 P21 P22 P23 P24 P25 P26 P27 P28 P29 P30 P31 P32 P33 P34 P35 |
Electrical Analysis of Low Distortion Transmission Design and Stacking TSVs on Silicon Interposer Chih-Wen Kuo1, Hung-Chun Kuo1, Chen-Chao Wang2, 1National Sun Yat-sen Univ., 2Advanced Semiconductor Engineering / Taiwan Photolithography Study for Advanced Packaging Technologies Hiromi Suda, Masaki Mizutani, Shin-Ichiro Hirai, Ken-Ichiro Mori, Seiya Miura, CANON / Japan Robust Packaging Solutions through Innovative Designs in Clip-QFN no-show paper Roxanna Samson-Caguioa, Ruby Ann Merto-Camenforte, Lorraine Duldulao, Texas Instruments Philippines / Philippines Print Lead QFN Package no-show paper Ping Wu, Peng Liu, Bo Zhao, QingChun He, George Ye, Freescale Semiconductor / China New Process Flow to Make QFN Package with Stand-off no-show paper Ping Wu, Peng Liu, Bo Zhao, QingChun He, George Ye, Freescale Semiconductor / China Through Mold Via (TMV) by Gas-Aided Laser Hsiang-Chen Hsu1, Shih-Jeh Wu1, Wen-Fei Lin1, Chi-Shiung Hsi2, Hsing-Yi Pao2, Pin-Chieh Wang1, 1I-Shou Univ., 2National United Univ. / Taiwan Automatic Alignment System for Wafer Based on Machine Vision no-show paper Hailong Liao, Dasong Ge, Junhui Li, Wenhui Zhu, Central South University / China Study of QFP E-pad Package VS. PCB Land Pattern Design Soldering and Reliability no-show paper Pai-Chou Liu, Sung-Mao Wu, National Univ. of Kaohsiung / Taiwan Novel PC Miniature Board Cancelled Chan Kim Lee, Wee Hoe, Say Thong Tan, Siang Yeong Tan, Choy Mei Yeow, Chow Soon Lim, Khai Ern See, Intel Malaysia / Malaysia Investigation on Graphene/Ag Nano-Particles Composite Ink for Flexible Electronics no-show paper Hu He, Zhuo Chen, Yanni Li, Fuliang Wang, Wenhui Zhu, Central South Univ. / China A Novel High Electrically Conductive Silver Paste Jia-Min Lin, Wei-Nung Chen, Chiao-Yang Lin, Ching-Fen Lin, Jiin-Chyuan Chang, Solar Applied Materials Technology / Taiwan Large Area Direct Transfer Technique for Graphene onto Substrates using Self-Assembly Monolayer Masahisa Fujino, Kentro Abe, Tadatomo Suga, Univ. Tokyo / Japan The Advantages of Slow Cure NCP in Flip Chip Package Yoshihide Fukuhara, Masaaki Hoshiyama, Toshikazu Hocchi, Yuusuke Kamata, Hisotatsu Ikarasi, Ruka Iwaya, NAMICS / Japan Effects of Additive Formula and Plating Current Density on the Interfacial Reactions between Sn and Cu Electroplated Layer Hsuan Lee, Wei-Ping Dow, Chih-Ming Chen, National Chung Hsing Univ. / Taiwan Comparison of Thermal Stress Concentration and Profile between Power Cycling Test and Thermal Cycling Test for Power Device Heat Dissipation Structures using Ag Sintering Chip-attachment Kensuke Osonoe1, Takahiro Asai1, Masaaki Aoki1,2, Hitoshi Kida2, Nobuhiko Nakano1, 1Keio Univ., 2Alent Japan / Japan Thermal Deformation Measurement for High-power Light Emitting Diodes using Digital Image Correlation Method with Spectrograph Technique no-show paper Hideyuki Taguchi1, Kenichi Ikeda1, Katsuya Morino1, Shugo Miyake2, 1Kobelco Research Institute, 2Kobe City College of Technology / Japan Heat Transfer Analysis in the Thermal Compression Bonding for CoW Process Noboru Asahi, Masatsugu Nimura, Toray Engineering / Japan System Power Integrity and Radiation Analysis of Packaging by CMOS Inverter Pei-Chen Kuo, Yu-Yung Wu, Sung-Mao Wu,National Univ. of Kaohsiung / Taiwan Importance of Switched-Mode Power Supply IC Model for Conductive EMI Noise Simulation Asuma Imamura1, Mitsuharu Umekawa2, 1ROHM, 2Keysight Technologies Japan / Japan Development of Low-power and Ultra-small Wireless Sensor Nodes for Bio-logical Information Monitoring Koichi Serizawa1,2, Jian Lu1, Hiroyuki Kuwabara1,2, Lan Zhang1, Ryoichi Maeda1, Masanori Hayase2, 1National Institute of Advanced Industrial Science and Technology, 2Tokyo Univ. of Science Japan Electromagnetic Characteristics of Body Area Network Using Magnetically-Coupled Wearable Coils Worn on Bent Arm Yusuke Fujita1, Fukuro Koshiji1, Kohji Koshiji2, 1Tokyo Polytechnic Univ., 2Tokyo Univ. of Science / Japan Broadband Antenna with Asymmetrical Radiating Elements for Cognitive Radio System Tomohiro Yamada1, Shota Zempo1, Fukuro Koshiji1, Kohji Koshiji2, 1Tokyo Polytechnic Univ., 2Tokyo Univ. of Science / Japan Study of Dye Sensitized Solar Cell Application of TiO2 Films by Atmospheric Pressure Plasma Deposition Method Wei-Chun Chou, Wen-Jen Liu, I-Shou Univ. / Taiwan Study of Dye Sensitized Solar Cell Application of TiO2 Nanostructured Films Synthesis by Hydrothermal Process Ming-Hung Chung, Wen-Jen Liu, I-Shou Univ. / Taiwan Preparation and Characterization of Biomimetic Superhydrophobic Expanded Graphite /Carbon Nanotube /Polymer Composites Chih-Feng Wang, Wen-Ning Wang, Sheng-Yi Yang, Liang-Ting Chen, Hsin-Yi Tsai, I-Shou Univ. / Taiwan Fabrication of Biomimetic Superhydrophobic Surfaces through a One Step Solution-immersion Process on Galvanized Iron Substrates Chih-Feng Wang, Li-Zhen Huang, Liang-Ting Chen, Sheng-Yi Yang, Chiung-Chih Shih, I-Shou Univ. / Taiwan Preparation of Fluorescent Ceramic Nanofibers by Electrospinning and Heat Treatment Chun-Liang Chang, Jui-Wen Liang, Wei Chen, Sheng-Li Fu, I-Shou Univ. / Taiwan Exploring Optical Characteristics of Carbon-doped TiO2 Nanofibers by Electrospinning and Heat Treatment with Different Atmospheres Yu-Min Chen, Cho-Liang Chung, Sheng-Hung Shin, Sheng-Li Fu, I-Shou Univ. / Taiwan A comparison study of electromigration in In-48Sn solder interconnects with Cu and Au/Ni/Cu pads Yi Li1, Y.C. Chan1, Fengshun Wu2, 1City Univ. of Hong Kong / Hong Kong, 2Huazhong Univ. of Science and Technology / China Molding Technology Development on MCM Isolation Packages Cancelled Chia-Yu Chang, Texas Instruments / Philippine Experimental Study on Dipping Speed & Dipping Depth Effect for the Dipping Process Tao Wang, Xiaorui Zhang, Junhui Li, Wenhui Zhu, Central South Univ. / China Cancelled Effects of Electroplating Additives on Copper to Copper Direct BondingCancelled Hsuan-Ling Hsu, Chih-Ming Chen, National Chung Hsing Univ. / Taiwan Low Temperature Sapphire-Sapphire Bonding using Amorphous Al2O3 Intermediate Layers Cancelled Akiko Okada, Shuichi Shoji, Jun Mizuno, Waseda Univ. / Japan The Role of Ultrasonics in Formation of Bonding for Solid State Solder InterconnectionsCancelled Zhuo Chen, Xiaorui Zhang, Hu He, Wenhui Zhu, Central South Univ. / China Thermal Conductivity of α-quartz Thin Film and Thermal Resistance over the Interface with the Bulk Cu Substrates: a non-equilibrium Molecular Dynamics Study Sen Cao, Central South Univ. / China Cancelled |
*The content of the program may be subject to change without any prior notice. Please check the ICEP web site for an ipdated version.