With the progress of high-speed, high frequency, low power, and high density electronics packaging, a defective communication and performance deterioration are becoming remarkable because of the unnecessary electromagnetic energy and electromagnetic interference between the equipment or between the circuits. This problem is deeply related with a wide field like parts, materials, simulations, measurements and standards, etc. Therefore, it is indispensable to use an approach that firmly catches the electromagnetic characteristics in the packaging design. This technical committee aims to share the technical concern and the trend survey in the electromagnetic characteristics of electronics packaging, to promote research and technology innovation, and then to contribute to the development of the industry, through various academic activities. These activities include a "Summer Seminar" with the lecturers who are active in this field, an open meeting on “High-speed high frequency electronics packaging", as well as the meetings on "EMC Modeling" and "Low Noise Packaging". |