2022 International Conference on Electronics Packaging
(ICEP 2022)
Date: May 11-14, 2022
Venue: Sapporo Community Plaza, Hokkaido
Style: Hybrid conference (combining on-site and online presentations)


Call for Papers
Due to numerous requests, the abstract submission deadline has been extended to December 8, 2021.
We are waiting for your abstract submission.
Information of call for papers:English ver.
The abstract submission deadline is November 30, December 8, 2021.

Please prepare an abstract using the attached template to help us better evaluate your submission.
The abstract should contain about 1 page of text and 1 page for supporting figures and tables, with a total length of 2 pages at maximum. Figures and tables to support the point of the paper will receive positive considerations. Your abstract will be used for review purpose only and will not be included in the conference proceeding.

Thank you very much for your contribution!