About ICEP 2024

ICEP 2024 will be held from April 17 to 20, 2024 in Toyama, Japan.
ICEP is the largest international conference on electronic packaging in Japan, attracting more than 360 attendees and hosting about 35 technical sessions. ICEP provides a strong platform to demonstrate your technologies and products as well as expand your customer network. It is jointly sponsored by JIEP, IEEE EPS Japan Chapter, and iMAPS. The conference has technical sessions covering a wide range of topics including advanced packaging, design, modeling and reliability, emerging technologies, high-speed, wireless & components, interconnections, materials and processes, optoelectronics, power electronics integration, and thermal management.

Since its inauguration in 2001, ICEP has developed into a highly reputed electronics packaging conference in Japan, attended by world-renowned experts in all aspects related to packaging technologies from all over the world.

Organization

General Chair
Tomoyuki Hatakeyama, Toyama Prefectural University

General Vice Chair
Yasuhiro Morikawa, ULVAC
Taiji Sakai, FICT
Shinya Takyu, LINTEC

Operation Committee Chair
Taiji Sakai, FICT

Operation Committee Vice Chair
Ryo Endoh, Toray Research Center
Mitsuyo Miyauchi, ALPHA-DESIGN

Operation Committee Members
Yoshitaka Adachi, OMRON
Yoshiyuki Arai, Toray Engineering
Jin Fujimura, ePRONICS
Hajime Hirata, Toray Engineering
Yoshihito Iizawa, Mitsubishi Chemical
Kumiko Ioka, Toshiba
Osamu Kamogawa, Air Water Materials
Minami Kaneko, Nihon University
Hidetoshi Kitaura, Panasonic Industry
Yoshiteru Kono, OMRON
Naohiro Kumada, OKUNO Chemical Industries
Katsumi Miyama, Hokkaido University of Science
Miki Mori, Huawei Technologies Japan
Kei Murayama, SHINKO ELECTRIC INDUSTRIES
Takumi Nishihara, OKUNO Chemical Industries
Yoshio Nogami, Nogami Interconnect
Keishi Okamoto, Rapidus
Fumito Ootake, ULVAC
Jun Shirakami, DIC
Tomoyuki Uchida, Toray Research Center
Takaaki Watanabe, Mitsubishi Chemical Corporation
Takahito Watanabe, IBM Japan
Noriyasu Yamane, Mitsubishi Chemical
Akira Yamauchi, Bondtec
Akira Yamauchi, National Institute of Technology, Gunma College
Futoshi Yoshimura, Toray Precision

Technical Program Committee Chair
Yasuhiro Morikawa, ULVAC

Technical Program Committee Vice Chair
Fumihiro Inoue, YOKOHAMA National University
Kai Takeuchi, Tohoku University

Technical Program Committee Members
Tomoyuki Abe, FUJITSU OPTICAL COMPONENTS
Takeru Amano, AIST
Toyohiro Aoki, IBM Japan
Masahiro Aoyagi, Kumamoto University
Chuantong Chen, Osaka University
Noriyuki Fujimori, Olympus
Masahisa Fujino, AIST
Norimasa Fukazawa, DIC
Go Hamasaka, Tokuyama
Koichi Hasegawa, JSR
Nobuaki Hashimoto, Suwa University of Seience
Eiji Higurashi, Tohoku University
Koichi Hirano, Panasonic Holdings Corporation
Hiroshi Hozoji, Ibaraki University
Toru Ikeda, Kagoshima University
Yoshinari Ikeda, Fuji Electric
Masahiro Inoue, Gunma University
Takashi Kasahara, Hosei University
Yu Kondo, Fujidenolo
Ying Ying Lim, Tokyo City University
Tadao Matsunaga, Tottori University
Risa Miyazawa, IBM
Jun Mizuno, National Cheng Kung University
Masashi Nakazawa, Sony Semiconductor Solutions
Hiroshi Nishikawa, Osaka University
Toshihisa Nonaka, Rapidus
Masaaki Oda, Printed Electronics Network
Takayuki Ohba, Tokyo Institute of Technology
Hideo Ohkuma, HTO
Kazuya Okamoto, Nippon Institute of Technology
Tetsuya Onishi, Grand Joint Technology
Yasumitsu Orii, Rapidus
Hitoshi Sakamoto, Huawei Technologies Japan
Yoichiro Sato, AGC
Koichi Shibayama, Sekisui Chemical
Akitsu Shigetou, National Institute for Materials Science
Osamu Suzuki, Rapidus
Koichi Takemura, AIO Core
Naotaka Tanaka, Resonac
Yoshihiro Tomita, Intel
Fumio Uchikoba, Nihon University
Shoji Uegaki, Crane Research
Junsha Wang, Meisei University
Hiroshi Yamada, Toshiba
Kiyokazu Yasuda, Osaka University

Publication Chair
Kiyokazu Yasuda, Osaka University

Finance Chair
Akira Yamauchi, National Institute of Technology, Gunma College

Promotion Chair
Yasumitsu Orii, Rapidus

Promotion Vice Chair
Akihiro Horibe, IBM Japan
Osamu Suzuki, Rapidus

International Technical Committee Members
Charles E. Bauer, TechLead
Sayoon Kang, KMEPS
C.Robert Kao, National Taiwan University
Taek-Soo Kim, KAIST
Jaeho Lee, Hongik University
Shi-Wei Ricky Lee, Hong Kong University of Sci & Tech
Shih-Kang Lin, National Cheng Kung University
Wei-Chung Lo, Industrial Technology Research Institute
Guo-Quan Lu, Virginia Tech
Jenn-Ming Song, National Chung Hsing University
Tianchun Ye, Institute of Microelectronics of Chinese Academy of Sciences

Advisory
Yasuhiro Ando, ABI Techno Lab
Yoshitaka Fukuoka, Worldwide Electronic Integrated Substrate Technology
Kaoru Hashimoto, Formally Meisei University
Fumio Miyashiro, Yokohama Jisso Consortium
Hideyuki Nishida, NEP Tech. S&S
Takashi Nukii, Kyoto University
Atsushi Okuno, Green Planets
Osamu Shimada, Dai Nippon Printing
Yuzo Shimada, Japan Jisso Technology Transfer Association
Katsuaki Suganuma, Osaka University
Shinichi Wakabayashi, Nagano Industrial and Commercial Encouragement Organization/ ConnecTec Japan
Kishio Yokouchi, JIS/Kanto Gakuin University