Award

ICEP2023 Outstanding Technical Paper Award

"Controlling Porosity During Transient Liquid Phase Bonding for High-Temperature Soldering Processes"
Nurul R. Abdul Razak^1,2, Xin F. Tan^1,3, Stuart D. McDonald¹, Michael J. Bermingham¹, Jeffery Venezuela¹, Tetsuro Nishimura⁴, Kazuhiro Nogita¹, ¹The University of Queensland / Australia, ²Universiti Malaysia Perlis / Malaysia, ³Kyushu University, ⁴Nihon Superior / Japan

"Fabrication of Flexible Integrated Circuits with FDSOI on Plastic Substrate for CMOS Image Sensors"
M. Goto, S. Imura, T. Sakai, H. Sato, NHK Science & Technology Research Laboratories / Japan

"Development of Laminate Materials with Low Df Using Novel Functionalized PPE"
H. Yamamoto¹, K. Iwase¹, H. Fukuoka¹, S. Otani¹, M. Harada², ¹Asahi Kasei, ²Kansai University / Japan

"Quantum Dot Color Conversion Film with Enhanced Color Rendering Performance"
Yuanjie Cheng, Jeffery C. C. Lo, Xing Qiu, Hua Xu, Mian Tao, S. W. Ricky Lee, Hong Kong University of Science & Technology / Hong Kong and China

"The Large-Area TIM Using Sn-Cu-Ni-Sb Quaternary IMC Joint Material"
Hiroaki Ikeda, Shigenobu Sekine, Napra / Japan

ICEP 2023 IEEE EPS Japan Chapter Young Award

"Fine-Pitch <111>-Oriented NT-Cu/SiO₂ Hybrid Joints with High Thermal Fatigue Resistance and Low Contact Resistivity"
Jia-Juen Ong, National Yang Ming Chiao Tung University / Taiwan

"Measurement of Thermal Strain of Metallized Silicon Nitride Substrate in Thermal Cycling Test by Digital Image Correlation Method"
Minh Chu Ngo, National Institute of Advanced Industrial Science and Technology / Japan

"Influence of Interfacial Interaction on The Reliability of the Bond Between Encapsulation Epoxy and Copper Substrate"
Shuaijie Zhao, Osaka University / Japan

"Effect of Ni Additive on Electroless Cu Quality for High Density Interconnect PCB Substrate"
Zheng Zhang, Osaka University / Japan

"Liquid Compression Mold Underfill Designed for One-Step Encapsulation in Overmold Process"
Yuto Shigeno, Namics / Japan

ICEP 2023 JIEP Poster Award

"Interconnection Properties of Epoxy-Based Conductive Adhesives by Chemically Controlled Sintering of Silver Micro-Fillers"
Takanori Fukushima, Masahiro Inoue, Gunma University / Japan

"High Thermal Conductive Composite Resin Filled with Spherical and Polyhedral Aluminum Nitrides"
Takefumi Iida, Atsushi Sakamoto, Isao Masada, Saiko Fujii, Go Hamasaka, Teruhiko Nawata, Tokuyama / Japan