1999 IEMT/IMC Symposium
Advance Program

April 21 (Wed.)

OPENING CEREMONY

9:50 - 10:10

WA1 Advanced Packages Ⅰ

10:10 - 12:40

Chairperson:
J.Verdaman (TechSerch International, Inc.)
H.Tomimuro (NTT Electronics Corporation)
[WA1-1]
Development of Ceramic CSP-Array Format Carrier and Assembly Technology
S.Uegaki, S.Matsuzono, S.Sato, T.Kubota, S.Matsuda
Kyocera Corporation / Japan
[WA1-2]
Development of Tape-stucked Wiring Boards
H.Tenmei, M.Ishino, M.Mita*
Hitachi Ltd., *Hitachi Cable Ltd. / Japan
[WA1-3]
Antenna-integrated Millimeter-Wave Module
N.Kakimoto
Sharp Corporation / Japan
[WA1-4]
Development of Mitsubishi Mold CSP Type Ⅱ
K.Harada, T.Iwasaki, S.Yamada, M.Yasunaga, Y.Takemoto, Y.Takata, T.Uebayashi, A.Sawai, M.Hisahara, Y.Noguchi, K.Imamura
Mitsubishi Electric Corporation / Japan
[WA1-5]
2metal T-BGA for Higher Pin Count Utilizing New TAB Process of Flip Chip Type
Y.Fukuzawa
Toshiba Corporation / Japan
[WA1-6]
Electrical Characterization & Resonance Analysis of Ball and Pin Grid Array Packages for high frequency applications
M.Iyer, Y.Qiu, K.Yaw, T.Tarter, G.Prasad
Institute of Microelectronics / Singapore

WB1 Underfill Materials

10:10 - 12:40

Chairperson:
H.Fujioka (Mitsubishi Electric Corporation)
H.Nishida (IBM Japan Ltd.)
[WB1-1]
Best Dispensing Practices for Flip Chip Underfill Manufacturing
A.Babiarz
ASYMTEK / U.S.A.
[WB1-2]
Encapsulants Microwave Curing for Electronic Packages
H.Quinones, A.Babiarz
ASYMTEK / U.S.A.
[WB1-3]
Study of the Underfill Material for Flip Chip Ball Grid Array (FC-BGA)
K.Terashima
Citizen Watch Corporation / Japan
[WB1-4]
Evaluation of Underfills Fluxes and Solder Resists for Flip Chip Applications by Single Lap Shear test
A.Tuominen, K.Yamamori*, T.Mugishima*
Tampere University of Technology / Finland, *Furukawa Electric Co., Ltd. / Japan
[WB1-5]
Flow Characteristics of Underfill Materials for Flip-Chips
H.Hozoji, S.Tsunoda, J.Saeki
Hitachi, Ltd. / Japan
[WB1-6]
High Reliability Underfill for Flip Chip on Board Applications
H.Tay, C.Cui
Institute of Microelectronics / Singapore

LUNCH TIME

12:40 - 14:00

Invited Speech

14:00 - 16:45

Chairperson:
Y.Fukuoka (Toshiba Corporation)
(1)
IMAPS Portfolio of Technologies for Future Applications
J.Cook
Promex Industries Inc./ U.S.A.
(2)
Electrically Conductive Adhesives : Basic Understanding and Fundamental Problems
J.Morris
State University of New York at Binghamton / U.S.A.
(3)
The Hyper Value-added Microelectronics System Integration Revolution for The Next Network Society by the Government-Universities-Industries Collaboration Scheme
M.Bonkohara
NEC Corporation / Japan

AWARDING CEREMONY

16:45 - 17:00

EVENING PARTY

17:20 - 19:30

April 22 (Thu.)

TA1 Advanced Packages Ⅱ

9:30 - 12:00

Chairperson:
R.Tummala (Georgia Institute of Technology)
Y.Fukuoka (Toshiba Corporation)
[TA1-1]
Organic Build-up Package for High Pin Count Flip Chip Application
S.Koyama
Shinko Electric Industries Co., Ltd. / Japan
[TA1-2]
Packaging Technologies for High-pin-count Organic Flip-chip BGA
Y.Tomita, Q.Wu, M.Watanabe, E.Hayashi, M.Okada, Y.Noguchi, H.Matsushima, S.Baba, Y.Takemoto
Mitsubishi Electric Corporation / Japan
[TA1-3]
Influence of Surface Treatment on Adhesion Strength in Organic and Ceramic Laminated BGA Package with High Thermal and Electrical Performances
H.Asai, N.Iwase
Toshiba Corporation / Japan
[TA1-4]
Advanced Low Cost Packaging of EP-BGA with B2itTM
T.Takano
Toshiba Corporation / Japan
[TA1-5]
Substrate Based Semiconductor Packaging ; Market Growth and Technology Trends (Special Lecture)
C.Bauer
TechLead Corporation / U.S.A.

TB1 Materials Ⅰ

9:30 - 12:00

Chairperson:
K.Yokouchi (FUJITSU Laboratories Ltd.)
Y.Kunimatsu (Kyocera Corporation)
[TB1-1]
Preparation of SiC films on Al2O3 Substrates
K.Kamimura, H.Ito, S.Okada, M.Nakao, Y.Onuma
Shinsyu University / Japan
[TB1-2]
Glass Ceramic Package for Mobile Communication Applications
S.Hamano
Kyocera Corporation / Japan
[TB1-3]
Mass Production Technology for Reflow Process Mounting by Lead Free Solder
H.Kuwata
Matsushita Electronics Industrial Co., Ltd. / Japan
[TB1-4]
Solder Properties for Lead-free Solder of Sn-Ag system Solder
M.Miyazaki
Oki Electric Industry Co., Ltd. / Japan
[TB1-5]
Development of Conductive Silver Paste for B2itTM (Buried Bump Interconnection Technology)
K.Shima
Mitsui Chemicals Inc. / Japan
[TB1-6]
A New High Performance Heatspreader Material and Application for Packaging of Electronics Devices
Y.Nishibayashi
Sumitomo Electric Industries, Ltd. / Japan

LUNCH TIME

12:00 - 13:00

TA2 Optoelectronics Technologies

13:00 - 14:40

Chairperson:
Y.Ando (NTT Corporation)
E.Takagi (Toshiba Corporation)
[TA2-1]
Proposal of Optoelectronic Substrate with Film/Z-connection
T.Yoshimura, J.Roman, Y.Takahashi, M.Lee, B.Chou, S.Beilin, W.Wang, M.Inao
Fujitsu Computer Packaging Technologies, Inc. / U.S.A.
[TA2-2]
Opto Electronics Device 1μm Bonding Technology
A.Yamauchi
Toray Engineering Co., Ltd. / Japan
[TA2-3]
60GHz Band Electroabsorption Modulator Module with Build-in Matching Circuit
N.Mineo, K.Yamada, K.Nakamura, Y.Shibuya, S.Sakai, K.Nagai
Oki Electric Industry Co., Ltd. / Japan
[TA2-4]
Transferred Microsolder Bump Technology for Microelectronics Packaging
N.Koshoubu, S.Ishizawa, M.Hosoya, H.Tsunetsugu
NTT Corporation / Japan

TB2 High Performance Design and Simulation

13:00 - 14:40

Chairperson:
H.Nishida (IBM Japan Ltd.)
T.Takei (Oki Electric Industry Co., Ltd.)
[TB2-1]
Electrode Film Thickness and Electrical Equivalent Resistance for AT-cut Bar Resonators
M.Nakazawa, D.Okada, K.Nagamine, H.Imai, Y.Onuma, S.Denda
Shinsyu University / Japan
[TB2-2]
Shape Evolution of Electrodeposited Bumps into Deep Cavity for Wafer Level CSP
K.Hayashi, Z.Tanaka, K.Fukui*, M.Ayama*, K.Kondo
University of Okayama, *Himeji Institute of Technology / Japan
[TB2-3]
Thermal Fatigue Reliability Assessment for Solder Joints of BGA Assembly
Q.Yu, M.Shiratori
Yokohama National University / Japan
[TB2-4]
Moisture Diffusion Modeling and Moisture Properties Characterisation for Electronic Packaging
E.Wong, K.Chan, T.Tee, R.Rajoo
Institute of Microelectronics / Singapore

COFFEE BREAK

14:40 - 14:55

TA3 Substrates

14:55 - 17:50

Chairperson:
C.Bauer (TechLead Corporation)
K.Matsui (NEC Corporation)
[TA3-1]
Low CTE & High Elastic Modulus Substrate for Mounting Semiconductor
N.Takano
Hitachi Chemical Co., Ltd. / Japan
[TA3-2]
Multilayer High Density Interconnect Flex
B.Chou, S.Beilin, H.Jiang, M.Lee, M.McCormack, M.Peters, Y.Takahashi, V.Wang
Fujitsu Computer Packaging Technologies, Inc. / U.S.A.
[TA3-3]
Development of Multilayer Printed Circuit Board with Interstitial Via Holes using Single Stop Laminate Press Process
R.Enomoto
Ibiden Co., Ltd. / Japan
[TA3-4]
High Density Build-up Technology for Flip Chip Applications
M.Asai
Ibiden Co., Ltd. / Japan
[TA3-5]
BCB for Bumping/Redistribution and Wafer Scale CSP Applications
K.Ohba, P.Garrou*, D.Scheck*, J.Im*
Dow Chemical Japan / Japan, *Dow Chemical / U.S.A.
[TA3-6]
High Softening Point Borosilicate Glass for Glass-Ceramic/Copper Multilayer Substrate
H.Tanei, S.Iwanaga, M.Nakamura, M.Okamoto, N.Ami, S.Ishihara, F.Kobayashi, F.Tagami
Hitachi Ltd. / Japan
[TA3-7]
PWB-Compatible integral passive Advances at PRC (Invited)
R.Tummala
Georgia Institute of Technology / U.S.A.

TB3 Materials Ⅱ

14:55 - 17:50

Chairperson:
M.Tsukamoto (Matsushita Electric Industrial Co., Ltd.)
K.Yokouchi (FUJITSU Laboratories Ltd.)
[TB3-1]
Characterization of Molding Compound for Package Warpage and Solder Joint Reliability in CSP
M.Amagai
Texas Instruments, Japan / Japan
[TB3-2]
Investigation of the Interface between Surface Treated Copper Leadframe and Epoxy Resin
S.Utsumi, N.Moriga, K.Tada, H.Fujioka
Mitsubishi Electric Corp. / Japan
[TB3-3]
Self-Extinguishing Epoxy Molding Compound for IC Package with No Flame Retardants
M.Iji, Y.Kiuchi
NEC Corporation / Japan
[TB3-4]
Packaging Materials for Face Down Type CSPs
Y.Okugawa
Sumitomo Bakelite Co., Ltd. / Japan
[TB3-5]
Development of full-mold type power HICs using a thermoplastic resin
S.Ota
Sanyo Electric Co., Ltd. / Japan
[TB3-6]
Low Cost Flip Chip Processing and Reliability of Fast Flow, Snap Cure Underfills
L.Crane, P.Houston*, D.Baldwin*, M.Konarski
Loctite Corporation, *Georgia Institute of Technology / U.S.A.
[TB3-7]
Aspects of LTCC Utilization for Microtechnical Application
R.Bauer, L.Rebenklau, K.Wolter, W.Sauer
Dresden University of Technology / Germany

INTERNATIONAL PARTY

18:15 - 19:45

April 23 (Fri.)

FA1 Interconnection Technologies Ⅰ

9:30 - 12:00

Chairperson:
E.Takagi (Toshiba Corporation)
I.Watanabe (Hitachi Chemical Co., Ltd.)
[FA1-1]
Problems and Approaches to Microbonding with Ni/Au Plate
Y.Obara
Super Solder Technologies Inc. / Japan
[FA1-2]
Reliability of Eutectic SnPb-bumped Flip Chip components on FR5 board
J.Maattanen, P.Palm, A.Tuominen*
Elcoteq Network Corporation, *Tampere University of Technology / Finland
[FA1-3]
Exceeding the Tg of the underfill material in FCOB circuits -the impact on solder bump lifetime under thermal cycling
J.Liu, J.Nysaether*
IVF - The Swedish Institute of Production Engineering Research / Sweden, *University of Oslo / Norway
[FA1-4]
Flip Chip Bonding Technology employing Photosensitive Adhesive Resins
T.Funaya, K.Matsui
NEC Corporation / Japan
[FA1-5]
Reduced Mask Level Interconnection Process
G.Vishwanadam, C.Wong, S.Sathappan
Institute of Microelectronics / Singapore
[FA1-6]
The Wafer Scale Package for DRAM and Other Applications: UltraCSP
T.Goodman, S.Barrett
Flip Chip Technologies / U.S.A.

FB1 Reliability and Testing Methodology Ⅰ

9:30 - 12:00

Chairperson:
T.Takei (Oki Electric Industry Co., Ltd.)
H.Shigi (Hitachi, Ltd.)
[FB1-1]
Segregation of Tin Lead Structures in Old Solder in Sem Analysis vs. Temperature Cycling
K.Maattanen, J.Happonen*, A.Tuominen**
Nokia Display Products, *Nokia Mobile Phones, **Tampere University of Technology / Finland
[FB1-2]
Verification of a Governing Parameter for Electromigration Damage in Metal Lines
K.Sasagawa, N.Nakamura, M.Saka, H.Abe
Tohoku University / Japan
[FB1-3]
Board Level Reliability of CSP's Investigated with the Micro DAC Method
J.Simon, D.Vogel, B.Michel
Franhofer Institute Reliability and Microintegration / Germany
[FB1-4]
A TEM Observation for Solder Joints of the Electronic Device
H.Matsuki, H.Ibuka*, K.Saka*, Y.Araki**, T.Kawahara
Fujitsu Limited, *Nagoya University, **Fujitsu Media device Limited / Japan
[FB1-5]
Wavelet Analysis of Discharge Current in Surface Dielectric Breakdown of Contaminated Printed Wiring Board under DC Magnetic Field
B.Du, S.Kobayashi
Niigata College of Technology / Japan
[FB1-6]
Detection of Early Ionic Migration by C and Tan σ between Conductors on Printed Circuit Board at Low Frequency
Y.Yamano, T.Tsukui*
Chiba University, *Toukai University / Japan

LUNCH TIME

12:00 - 13:00

FA2 Reliability and Testing Methodology Ⅱ

13:00 - 14:40

Chairperson:
K.Hayashi (TDK Corporation)
M.Tsukamoto (Matsushita Electric Industrial Co., Ltd.)
[FA2-1]
Novel Anisotropic Conductive Film for Base Die Testing
F.Eriguchi, M.Yamaguchi, F.Asai, Y.Hotta
Nitto Denko Corporation / Japan
[FA2-2]
Thermal Deformation Analysis of Printed Circuit Connector Due to Current Flow by Using Holography
M.Taniguchi, T.Takagi*
Meijo University, *Nihon University / Japan
[FA2-3]
Development of Burn-in Test Socket far 0.5mm Pitch LGA
M.Sakata
Furukawa Electric Co., Ltd. / Japan
[FA2-4]
Gate-Level Current Simulation Using Event-Driven Technique
J.Wang
National Center for High-Performance Computing / Taiwan

FB2 Trends

13:00 - 14:40

Chairperson:
Y.Kunimatsu (Kyocera Corporation)
K.Yamamura (Sharp Corporation)
[FB2-1]
Competitive Assessment of Chip Scale Packages
C.Bauer
TechLead Corporation / U.S.A.
[FB2-2]
Selection of Interconnection Technology in MCM Project
L.Pykari, A.Tuominen*, E.Ristolainen*
Nokia Mobile Phones, *Tampere University of Technology / Finland
[FB2-3]
Factors Influencing on the Design of Portable Computers
S.Denda
Shinsyu University / Japan
[FB2-4]
Market Trend for High Pin Count Packaging
J.Vardaman
TechSarch International, Inc. / U.S.A.

COFFEE BREAK

14:40 - 15:00

FA3 Interconnection Technologies Ⅱ

15:00 - 17:05

Chairperson:
J.Liu (IVF-The Swedish Institute of Production Engineering Ressarch)
I.Watanabe (Hitachi Chemical Co., Ltd.)
[FA3-1]
The Development of the IC Bonding Technique Using FTT Bump
Y.Yagi
Matsushita Electronic Components Co., Ltd. / Japan
[FA3-2]
Shape Evolution of Electrodeposited Bumps with Additive and its Application
K.Kondo, T.Monden, M.Eguchi, Z.Tanaka
University of Okayama / Japan
[FA3-3]
Reliability Investigations of Hard Core Solder Bumps using Mechanical Palladium Bumps and SnPB Solder
H.Oppermann, C.Kallmayer, R.Kalicki, M.Klein, R.Aschenbrenner, H.Reichi
FhG-IZM / Germany
[FA3-4]
Development of High Volume Solder Bump Formation Method
N.Oroku
Hitachi, Ltd. / Japan
[FA3-5]
Solder Bump Forming using Ball Mounting Technology
M.Tago, Y.Ueoka, Y.Kato, E.Kono, K.Furuya, S.Morishige
NEC Corporation / Japan

FB3 ACF/ACP

15:00 - 17:05

Chairperson:
H.Oppermann (FhG-IZM)
H.Shigi (Hitachi, Ltd.)
[FB3-1]
Development of Novel Anisotropic Conductive Film(ACE)
M. Yamaguchi, F. Asai, F. Eriguchi, Y. Hotta
Nitto Denko Corporation / Japan
[FB3-2]
Development of Flip Chip Attach Technology Using Au Ball Bumps and Anisotropic Conductive Paste
T. Motomura, H. Hirai, O. Shimada, Y. Fukuoka
Toshiba Corporation / Japan
[FB3-3]
A Small Multi Chip Camera Module Utilizing ACP Interconnection Method
J. Karasawa
Toshiba Corporation / Japan
[FB3-4]
Enhancement of connection reliability of ACE joints in flip-chip interconnection onto organic substrates
A. Nagai, K. Takemura, I. Watanabe
Hitachi Chemical Co., Ltd. / Japan
[FB3-5]
Novel Anisotropically Conductive Film for Flip Chip Attach
M. Holloway
Loctite RD&E / Ireland

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