| 1999 IEMT/IMC Symposium Program |
| April 21 (Wed.) | ||
|---|---|---|
| Room A | Room B | |
| 9:50 | Opening Ceremony | |
| 10:10 | WA1 Advanced Packages 1 |
WB1 Underfill Materials |
| 12:40 | Lunch Time | |
| 14:00 | Invited Speech | |
| 16:45 | Awarding Ceremony | |
| 17:20 | Evening Party | |
| 19:30 | ||
| April 22 (Thu.) | ||
|---|---|---|
| Room A | Room B | |
| 9:30 | TA1 Advanced Packages 2 |
TB1 Materials 1 |
| 12:00 | Lunch Time | |
| 13:00 | TA2 Optoelectronics Technologies |
TB2 High Performance Design and Simulation |
| 14:40 | Coffee Breake | |
| 14:55 | TA3 Substrates |
TB3 Materials 2 |
| 18:15 | International Party | |
| 19:45 | ||
| April 23 (Fri.) | ||
|---|---|---|
| Room A | Room B | |
| 9:30 | FA1 Interconnection Technologies 1 |
FB1 Reliability and Testing Methodology 1 |
| 12:00 | Lunch Time | |
| 13:00 | FA2 Reliability and Testing Methodology 2 |
FB2 Trends |
| 14:40 | Coffee Breake | |
| 15:00 | FA3 Interconnection Technologies 2 |
FB3 ACF/ACP |
| 17:05 | ||