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2001 ICEP |
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ベストペーパー賞およびIEEE CPMT Young Award |
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(2002 ICEPにおいて授与) |
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| ベストペーパー賞 (5件) | |
| (1) |
Micro Bump Interconnections and Encapsulation Technologies on 3D
Stacked LSI Y. Tomita, T. Morifuji, T. Ando, M. Tago, R. Kajiwara, Y. Nemoto, T. Fujii, T. Sato, K. Takahashi Association of Super-Advanced Electronics Technologies(ASE T) / Japan |
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From CSP to WLP J. Simon Technische Universtitat Berlin / Ger many |
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Development of the MEMS Methodology to Micro Heat Sinks M.-H. Tseng, C.-Y. Wang, H.-C. Chien, C.-Y. Wang, W.-W. Ke Industrial Technology Research Institute / Taiwan |
| (4) |
Drop-simulation of Electronic Boards Mounted with CSPs I. Hirata, Y. Yoshida, I. Morisaki NEC / Japan |
| (5) |
Development of Flip-chip Mounting Process by Metallic Joint which Uses
Supersonic Wave Energy K. Higashi, K. Ushirakawa, K. Tomita Matsushita Electric Industrial / Japan |
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| 2. IEEE CPMT Young Award (3件) | |
| (1) |
Evaluation on the Properties of Sn-Ag-Bi Solder with Low Melting H. Shimokawa，T. Soga, T. Nakatsuka, K. Serizawa Hitachi / Japan |
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Giga-π: A Low-cost and Compact Parallel Optical Link Module for Very Short
Reach Interconnect T. Sakamoto, N. Tanaka, N. Kukutsu NTT / Japan |
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Development of the Non-flux Solder Joint Technology R. Okada, R. Kimura, T. Hosomi, S. Ito Sumitomo Bakelite / Japan |
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