| Welcome to 2003 ICEP | |
| On behalf of the Conference Organizing Committee, I cordially welcome you to 2003 International Conference on Electronics Packaging (ICEP) which is jointly sponsored by IEEE CPMT (Components,
Packaging, and Manufacturing Technology) Society Japan and IMAPS Japan (International Microelectronics and Packaging Society Japan) / JIEP (Japan Institute of Electronics Packaging).
We will provide you with a way to integrate the existing diversity of microelectronics packaging technologies. Don't miss this valuable opportunity to add the latest information to your research and development activities or professional skills. In the Conference, invited speeches concerning the leading edge technologies both in U.S.A. and Europe will be given. Sessions for individual technologies like 3D packaging, Advanced packaging, Substrate, LTCC (low temperature co-firable ceramics), Materials, Lead-free solders, Plating, Flip-chip technologies, Design and Testing, Thermal management, Reliability, etc. with many papers will be presented for your choice. In addition to the conference, the "Microelectronics Show" will be held at "Tokyo Ryutsu Center" which provides you with the latest information on materials, equipment and commercialized technologies in the field of your interest. I would like to express my heartiest gratitude to the entire Organizing Committee members who have worked hard to make this Conference the most successful event. It will be a valuable opportunity you won't want to miss. See you at Tennoz Isle in Tokyo! Kaoru Hashimoto |
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GENERAL INFORMATION |
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| International Conference on Electronics Packaging (ICEP), which is the largest international conference in Japan focused on the field of electronics packaging has been held annually for two decades. The conference consists of fourteen technological topics and participants can easily collect the latest information on electronics packaging field. Major trends concerning IT and ecological design will be highlighted. This golden opportunity guarantees you to be able to gather a wealth of valuable information and fruitful discussion with fellow professionals on the latest developments in electronic packaging. Access to the conference site from Shibuya and Shinjuku has become far easier thanks to Tokyo Waterfront Area Rapid Transit (Rinkai line), a new rail line connecting Tennoz Isle Station. This promises to make your visit to Tokyo more convenient and productive. |
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CONFERENCE |
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| Ninety-three papers will be presented in 14 technical sessions; Advanced Packaging, Design and Testing, Substrates, Optoelectronics, Interconnection, Materials, Reliability and Thermal Management, Plating and Wafer Treatment, Simulation, 3D Packaging, Pd-free Solder, LTCC, Flip-chip, and High Speed/ High Frequency Packaging. Guest speakers will also focus on advanced packaging technologies in the afternoon of
April 16.
Room-A, Room-B |
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WELCOME SPEECH |
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| The welcome speech will be scheduled at the beginning of the
afternoon session on April 16. Mr. Hashimoto, the general chairperson for 2003 ICEP, will welcome the participants and comment on the significance of the conference.
3:00 p.m., Wednesday, April 16 |
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AWARDING CEREMONY |
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| 2002 ICEP technical program committee carefully examined and
screened all the papers presented at the last conference. The committee selected several excellent papers. The
authors of those papers will be congratulated at this ceremony by the President of JIEP. The "Young Award" has been established in order to encourage the work of young researchers. The award is intended for those aged under thirty-five. Those distinguished younger researchers will be also congratulated by the General Chairperson of IEEE CPMT Japan Chapter. 3:05 p.m., Wednesday, April 16 |
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WELCOME RECEPTION |
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| A welcome reception will be held after the opening day session at the Harbor Circus, which is at Dai-ichi Hotel Tokyo Seafort. Almost all of the conference participants attend the
reception. This is an excellent chance to cultivate relationships with counterparts from Japan and
around the world and to exchange useful information. A ticket is included with your conference registration. Additional tickets may be ordered
using the registration form.
6:00-8:00 p.m., Wednesday, April 16 |
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INTERNATIONAL RECEPTION |
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| All participants from overseas are welcome to attend the International Reception. This is an informal event where you can relax and develop friendships with fellow professionals from around the world. Evening, Thursday, April 17 |