2003 ICEP

International Conference on Electronics Packaging
(Formerly IEMT/IMC Symposium)

April 16-18, 2003
 

Dai-ichi Hotel Tokyo Seafort

Tennoz Isle, Tokyo, Japan
 

 Welcome to 2003 ICEP 

 

Advance Program

April 16 [HTML]       April 17 [HTML]       April 18 [HTML]      [PDF 40KB]
 

Registration

Fee        Form(English) [PDF 13KB]        Form(Japanese) [PDF 19KB]

Hotel Accommodations

 
Sponsored by
IMAPS Japan (International Microelectronics and
Packaging Society Japan) / JIEP  (Japan Institute 
of Electronics Packaging)
IEEE CPMT (Components, Packaging, and Manu-
facturing Technology) Society Japan