2003 ICEP

International Conference on Electronics Packaging
(Formerly IEMT/IMC Symposium)

April 16-18, 2003


Dai-ichi Hotel Tokyo Seafort

Tennoz Isle, Tokyo, Japan


 Welcome to 2003 ICEP 


Advance Program

April 16 [HTML]       April 17 [HTML]       April 18 [HTML]      [PDF 40KB]



Fee        Form(English) [PDF 13KB]        Form(Japanese) [PDF 19KB]

Hotel Accommodations

Sponsored by
IMAPS Japan (International Microelectronics and
Packaging Society Japan) / JIEP  (Japan Institute 
of Electronics Packaging)
IEEE CPMT (Components, Packaging, and Manu-
facturing Technology) Society Japan