Japanese

 

 

 (International Conference on Electronics Packaging)

 

    General Chair    Committee    Registration Form    Registration Fees  

 

 Advanced Program    Poster Session    Invited Speeches    Plant Tour 

                 Advanced Program(PDF)
 

 Kyoto Hotel List (New)

 

 Author's person click here, please. [How to Paper](English)

[How to Paper](Japanese)

 A submission time limit of a manuscript is February 20th.

 

Sponsored by:
Japan Institute of Electronics Packaging (JIEP)
IEEE CPMT Society Japan Chapter


JIEP   IEEE   CPMT   Kyoto International Conference Center    Hotel List    Mutual Cooperation: EMPC2009 (Italy)