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     Microelectronic packaging of semiconductor devices is at a crossroad. Conventional scaling of integrated circuitry, which has dominated this industry for over 40 years, has effectively ended. Innovation in materials, design, and packaging will be the engine that will drive the continued performance/cost improvement curve that our customers have come to expect. In this paper, we will examine industry direction in packaging at a high level, and then take a detailed look from an IBM perspective. The latter clearly has a mid- to high-end focus, with an emphasis on the server application application space, although IBM does participate in both games and ASICs markets. From that perspective, we observe a triple convergence of challenges: i) power / thermal management, ii) thermo-mechanical chip-package interaction, and exponential growth in electrical signal bandwidth. These challenges are made more complex by external forces, such as the requirement toward Pb-free materials; use of energy saving system on/off algorithms, and the like.
     After exploring the drivers behind the triple convergence, we discuss key examples of technology solutions now being developed to address each of these key challenges, looking at both IBM as well as industry approaches. As noted in last year�fs keynote address, it is observed that conventional corporate R&D is in general ill-prepared to fund the scope of projects required to address these challenges. Several development business models aimed at addressing this issue will be briefly contrasted. Specifically, IBM and New York State, US have recently announced plans to launch a collaborative Advanced Packaging Development Center, in coordinate with the College of Nanoscale Science & Engineering (CNSE) at Albany State University. The new center will leverage multi-party joint development alliances, similar to the highly successful semiconductor R&D center already established at CNSE. Details of the new Center�fs mission and status will be discussed.

     This paper will discuss memory package technology trend as introducing some new memory package solutions and next generation package. 
Currently FBGA(Fine Pitch Ball Grid Array) as commodity memory package is popular in PC/server application area etc. On the other hand, packaging trend for mobile phone, smart phone or digital consumer application requires smaller, thinner and more multi-die/package solution as MCP, PoP and SiP from space or height constraint on application board. But these are still evolved or innovated toward much smaller, much thinner and much multi-die package.
     As "Much smaller package technology", this candidate is ideally WLCSP(Wafer level Chip Scale Package). But this CSP is not with big position due to less size compatibility and standardization issue. ALCSP(Advanced Laminated CSP) is introduced here as suitable CSP for semiconductor memory without wafer yield concern on behalf of WLCSP.
     As "Much thinner package technology", this requires much thinner die thickness. The thinner package and die are, the more package warpage and memory characteristics instability as refresh time of DRAM are influenced. These might come from mechanical stress due to the difference among thermal expansion characteristics of imbalanced package structure. Here is some package structure approaches to improve and minimize package warpage or memory characteristics influence.
     As "Much multi-die package technology", innovative new packaging technology with TSV CoC(Chip on Chip technology with Through Silicon Via) will lead future advanced packaging on behalf of MCP(Multi Chip Package) and SiP(System in Package). Here is new ultra large capacity DRAM consist of multi DRAM cores and interface chip with Copper base TSV interconnection.

     Ever since the industrial revolution, human civilization has continued to evolve through the invention and spread of technology, be it means of transportation such as automobiles, ships, and planes, or other developments such as communications, broadcasting, and electronics products. In particular, a ubiquitous society centered around developments like the Internet and mobile phones has brought the world closer together. The energy driving all of these developments is solar power and the Earth�fs minerals. As the world�fs population increases and civilization�fs growth slows down, humankind is facing the depletion of fossil fuels and minerals. Today, it has become crucial that we strive to efficiently create electricity from the sun, wind, water, and heat, and distribute this electricity evenly throughout the world. Key to this will be highly efficient solar cells and storage batteries, as well as low-load turbines. In this lecture, we would like to talk about the outlook for solar power generation, what must be done to spread its use, and how this can be done. We will also touch on how electronic packaging technology holds the key to supporting solar power generation.