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ICEP2011 Advanced Program
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April 13
Advanced Program (PDF)
| Room-A |
Room-B |
Room-C |
Room-D |
WA1:
MFG-1 |
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WC1:
Thermal Management-1 |
WD1:
DMR-R-1 |
WA2:
MFG-2 |
WB2:
RF |
WC2:
Thermal Management-2 |
WD2:
DMR-R-2 |
Keynote Speeches
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April 14
Advanced Program (PDF)
| Room-A |
Room-B |
Room-C |
Room-D |
Keynote Speeches
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TA1:
Korea Session-1 |
TB1:
MFG-3 |
TC1:
DMR-M |
TD1:
Advanced PKG-1 |
TA2:
Korea Session-2 |
TB2:
MFG-4 |
TC2:
Thermal Management-3 |
TD2:
Advanced PKG-2 |
TA3:
3D/TSV-1 |
TB3:
Thermal Management-4 |
TC3:
Optoelectronics-1 |
TD3:
MEMS-1, BEANS-1 |
TA4:
3D/TSV-2 |
TB4:
Thermal Management-5 |
TC4:
Optoelectronics-2 |
TD4:
MEMS-2, BEANS-2 |
TA5:
Interconnection-1 |
TB5:
MFG-5 |
TC5:
Automotive |
TD5:
MEMS-3, BEANS-3 |
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April 15
Advanced Program (PDF)
| Room-A |
Room-B |
Room-C |
Room-D |
FA1:
Interconnection-2 |
FB1:
Substrate-1 |
FC1:
MFG-6 |
FD1:
Printed-1 |
FA2:
Interconnection-3 |
FB2:
Substrate-2 |
FC2:
DMR-E-1 |
FD2:
Printed-2 |
FA3:
Interconnection-4 |
FB3:
MEMS-4 |
FC3:
DMR-E-2 |
FD3:
Printed-3 |
FA4:
Interconnection-5 |
FB4:
MEMS-5 |
FC4:
DMR-E-3 |
FD4:
Printed-4 |
FA5:
interconnection-6 |
FB5:
MEMS-6 |
FC5:
DMR-E-4 |
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