April 16 (Wed.)

Room A

Room B

9:30

WA1:Advanced Packaging

1. Fluidic Self Assembly as Applied to Electronics Packaging
   G.Gengel, Alien Technology / U.S.A.
    
2. Improvements in the Reliability of 48 μm Laser Microvias for the Surface Laminar Circuit
   T.Yamada, IBM Japan / Japan
    
3. Development of Fine Pitch Lead Frames and Die tools
   M.Kitajima, Shinko Electric Industries / Japan
    
4. A Placement Technique for Wafer Scale Integrated Circuit
   A.Kanasugi, Tokyo Denki University / Japan

WB1: Design and Testing

1. Improvement of Reliability Test for Laser LIT Repair on XGA LCD Module
   T.Wada, International Display Technology / Japan
    
2. A Study on Newly Developed Flatbed Type By-pass Capacitor for Effective Reducing Semiconductor Radiation Noise
   C.Igarashi, Tohoku Ricoh / Japan
    
3. Ultra Fine Pitch Probing Technology to Realize High Performance Wafer Testing
   M.Tanioka, Y.Shirai, K.Kojima, K.Takahashi, Association of Super-Advanced Electronics Technologies / Japan
    
4. New Probe Tip Fabricated by LIGA Process for Cleaning-free Test
   T.Haga, Sumitomo Electric Industries / Japan

11:10

BREAK

11:20

5. Low Temperature Si Direct Bonding Using Plasma-assisted Method
   T.H.Kim, M.M.R.Howlader, T.Suga, University of Tokyo / Japan
    
6. Study on Assembly Technologies in Chip on Film (COF) Package
   D.H.Y.Kuo, J.Liu, D.Chen, G.S.Shen, M.L.Huang, Chipmos Technologies, C.L.Chung, S.L.Fu, I-Shou University / Taiwan
    
7. Low Temperature Bonding of Silicon/Quartz and Quartz/Quartz Wafers by Surface Activated Bonding Process
   M.M.R.Howlader, T.H.Kim, T.Suga, University of Tokyo / Japan
    
8. High Density Wiring Technology and Evaluation with Cu/Photosensitive-BCB Multi-layer Structure
   K.Nakayama, Dai Nippon Printing / Japan

5. Electric Field Application Method Effective for Pin Open Detection Based on Supply Current in CMOS Logic Circuits
   M.Hashizume, M.Ichimiya, H.Yotsuyanagi, T.Tamesada, The University of Tokushima / Japan
    
6. Visualization of Solder Joint Shape by Super-immersion Ultrasound
   H.Tohmyoh, M.Saka, Tohoku University / Japan
    
7. Method for Monitoring Solder Paste Printing Process
   T.Liukkonen, Nokia, A.Tuominen, Tampere University of Technology / Finland
    
8. Thermal Performance of Flip Chip Packages: Numerical Study of Thermo-mechanical Interactions
   M.-L.Sham, J.-K.Kim, Hong Kong University of Science Technology / Hong Kong, J.-H.Park, Sejong University / Korea

13:00

 
Lunch Time
 

15:00

WELCOME SPEECH

15:05
15:15

AWARDING CEREMONY

15:20

Invited Speech

1. IMAPS - Status and Future Directions
   Dr. Peter Barnwell
   President, IMAPS North America / U.S.A.
    
2. Advanced Flip Chip Technology and its Application in Europe
   Dr. Elke Zakel
   Pac Tech - Packaging Technologies GmbH / Germany

17:00
 

18:00


20:00

 
WELCOME RECEPTION
The Harbor Circus