|
10:00-12:05
WA1: Flip-chip
| 1. |
Flip Chip Solder Bumping by Newly Developed Ball Mounting Method |
|
K. Sato, Hitachi Metals (Japan) |
| 2. |
Advanced Non Conductive Paste for Lead Free Packages |
|
S. Kawamoto, Namics (Japan) |
| 3. |
Novel Conductive Adhesive for Bumpless Flip Chip Attach |
|
H. J. Neuhaus, Scimaxx Solutions (USA) |
| 4. |
Impact of Wet Processes on Corrosion of Lead-rich Solder Bumps |
|
M. Uchida, K. Higuchi, T. Togasaki, H. Takahashi, S. Kawano, M. Miyata, K. Nagamine, H. Ezawa,
Toshiba (Japan) |
| 5. |
Deformation of Conductive Particles and Contact Resistance of Flip Chip Joining Using Anisotropic Conductive Adhesive |
|
L. Cao, Z. Cheng, Z. Lai, Chalmers University of Technology (Sweden), J. Liu,
Shanghai University (China) |
|
10:00-12:05
WB1: Reliability I
| 1. |
Failure Analysis of Electrical Over-Stress(EOS) in Deep Sub-micro IC Devices |
|
C.-C. Cheng, I-Shou University, IKANOS
Communications, R. Aspacio, IKANOS Communications, Y.-J. Huang, S-L. Fu,
I-Shou University (Taiwan) |
| 2. |
Reliability of SMD Joints Soldered by SnAgCuxIn Pb-free Solders |
|
T. Nakatsuka, Hitachi (Japan) |
| 3. |
Optimization of resolution cycle time in customers handsets |
|
A. Mwegerano, P. Kytosaho, Nokia Mobile Phones,
A. Tuominen, University of Turku (Finland) |
| 4. |
The Reliability of Fine Pitch and Low Temperature Solder Joints Formed Using In and Sn Solder Bumps and Non-conductive Adhesive |
|
S.-M. Cheung, Z. Chen, Y.-H. Kim, Hanyang University (Korea) |
| 5. |
Effect of Drop Impact on an Insulin Pump |
|
B. Ma, Institute of Microsystems Huazhong University of Science and Technology (China) |
|
|
13:25-17:00
Invited Speeches
| 1. |
IMAPS and the Evolving Electronics Industry |
|
Dr. B. M. Romenesko, President, IMAPS North America (USA) |
| 2. |
Overview of Electronic Packaging Technology in Korea |
|
Prof. J. Yu, President, IMAPS Korea (Korea) |
| 3. |
SOP vs. SIP vs. SOC for Digital Convergence |
|
Prof. R. R. Tummala, Georgia Institute of Technology (USA) |
| 4. |
Multilayer Thin Film Technology - Enabling
Technology for SiP and "above-IC" Heterogenous SOC Solutions |
|
Dr. E. Beyne, IMEC (Belgium) |
| 5. |
The packaging, 10 years from now |
|
Dr. Y. Tsukada, Kyocera SLC Technologies (Japan) |
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