|
April 15 (Fri.) |
| Room A |
Room B |
|
9:30-11:10
FA1: MEMS
| 1. |
Bonding Processes and Mechanisms for Ionic and Piezoelectric Wafers |
|
M. Howlader, T. Suga, University of Tokyo (Japan) |
| 2. |
Direct Patterning by Ink-jet Printing Using Nano
Paste |
|
H. Saito, M. Ueda, Y. Matsuba, K. Oyama, Harima Chemicals (Japan) |
| 3. |
All-wet Chemical Patterning of Copper Circuit on Flexible Polymide Substrate |
|
S. Ikeda, K. Akamatsu, H. Nawafune, Konan University, H. Yanagimoto,
Mitsuboshi Belting (Japan) |
| 4. |
Fine Pitch Micro-bumps and Micro-wires Patterned by Super Inkjet Technology |
|
K. Murata, National Institute of Advanced Industrial Science and Technology (Japan) |
|
9:30-11:10
FB1: High Speed / EMC Boards Design
| 1. |
Novel Differential Via Transitions for High-Speed Printed Circuit Boards |
|
T. Kushta, K. Narita, NEC, T. Kaneko, S. Ogou,
NEC Electronics (Japan) |
| 2. |
Design Impact on Signal Integrity for High Density Organic Substrate |
|
G. Yamada, H. Mori, Y. Yamaji, S. Suminaga,
IBM Japan, M. Shiroshita, Kyocera SLC Technologies (Japan) |
| 3. |
High-speed Signaling Interconnects using Flat-surface and Low-dielectric-loss Resin |
|
A. Morimoto, M. Sugimura, A. Kawate, M. Kawasaki, Y. Wakizaka, T. Ohmi,
Tohoku University (Japan) |
| 4. |
Analysis of signal transmission on PCB with Partially Low Conductive Power/Ground Planes |
|
H. Kikuchi, NEC Toppan Circuit Solutions (Japan) |
|
|
11:10-11:20
Break |
|
11:20-13:00
FA2: Simulation
| 1. |
Development of High-speed Thermal Management Method for Electronic Package with Heat Spreader |
|
S. Hayashi, Osaka University (Japan) |
| 2. |
Drop Impact Life Prediction Model for Lead-free BGA Packages and Modules |
|
J. Luan, T.Y. Tee, K.Y. Goh, H.S. Ng, STMicroelectronics (Singapore) |
| 3. |
Integrated Modal Analysis and Spectrum Analysis of PCB Subassembly Dynamic Responses |
|
J. Luan, T.Y. Tee, STMicroelectronics (Singapore) |
| 4. |
Fatigue Life Prediction Models for Lead-free BGA packages and Modules |
|
H. S. Ng, K.Y. Goh, T.Y. Tee, STMicroelectronics (Singapore) |
|
11:20-13:00
FB2: Materials
| 1. |
New Sintering Method for LTCC |
|
Y.-B. Sun, J. -H. Ahn, Kyonggi University (Korea) |
| 2. |
Fabrication of Photo Patternable Composite Sheet and High Aspect Ratio Forming |
|
Y. Kamata, F. Uchikoba, Nihon University (Japan) |
| 3. |
A Study on the RuO2 System Pb-free Thick Film Resistors |
|
N. Kato, I. Kaneko, M. Akiya, Musashi Institute of
Technology, T. Higuchi, T. Iwano, Tanaka Kikinzoku Kogyo K.K. (Japan) |
| 4. |
Solvent or Alkaline? Which is in Harmony with the Environment |
|
S. Bernhard, Huntsman Advanced Materials (Japan) |
|
|
13:00-14:00
Lunch Time |
|
14:00-17:05
FA3: Substrates / Interposer
| 1. |
LTCC Substrate with Embedded High Value Inductor for Micro DC-DC Converter |
|
T. Mikura, K. Nakahara, K. Ikeda, K. Furukuwa, K. Onitsuka,
Kyocera (Japan) |
| 2. |
Development of LTCC for High Frequency Modules |
|
S. Yamamoto, Kyocera (Japan) |
| 3. |
Replica Printed Composite Sheet Using Micro Pattered Dry Film as Master Die |
|
R. Nagashima, F. Uchikoba, Nihon University (Japan) |
| 4. |
Evaluation of Inductors and Capacitors Embedded in Low Temperature Co-fired Ceramic Substrates |
|
H. Tomokage, Fukuoka University, W. Choi, Fukuoka Industry, Science and Technology
Foundation, H. Onaga, S. Ono, Fukuoka University, S. Yoshida,
Saga Electronics (Japan) |
|
(Break 10minuts) |
| 5. |
Impulse Breakdown Characteristics between Printed Wires on a Printed Circuit Board |
|
M. Kando, Tokai University (Japan) |
| 6. |
Observation of Filled Via Fabrication Mechanism by Analyzing Micro Via Feature |
|
T. Haze, Samsung Electro - Mechanics (Korea) |
| 7. |
A Study on High-frequency Properties of Via-Holes in Organic Substrates |
|
Y. Shimada, Hitachi Chemical (Japan) |
|
14:00-17:05
FB3: Reliability II
| 1. |
Finland Evaluation of Lead-free Solder Joint Reliability using X-ray Equipment |
|
S. Honko, Tampere University of Technology, T. Wahlman,
Western Finland Educational Training Center, Paavo Jalonen, Satakunta
Polytechnic, J. Maattanen, Tampere University of Technology (Finland) |
| 2. |
Measurement of Radiated Near Magnetic Field from Resistors Mounted on PCB |
|
A. Ito, T. Kasuga, Akita University, A. Ohisi,
Alpha Electronics, H. Inoue, Akita University (Japan) |
| 3. |
Evaluation of ILD Cracks and Development of Non-damage Probing |
|
J. Yorita, T. Haga. Y. Hirata, S. Shimada, Sumitomo Electric Industries (Japan) |
| 4. |
Space Charge Observation of Insulating Materials for Printed Circuit Boards |
|
K. Fukunaga, K. Okamoto, T. Maeno, National Institute of Information and Communications Technology (Japan) |
|
(Break 10minuts) |
| 5. |
Vectorless Open Pin Detection Method for Logic Circuits |
|
M. Hashizume, M. Ichimiya, H. Yotsuyanagi, T. Tamesada,
The University of Tokushima (Japan) |
| 6. |
Imprint Patterned Substrates for Ultra-Fine Pitch Flip Chip |
|
C.E. Bauer, TechLead, C. Davidson, Dimensional Circuits (USA) |
| 7. |
Influence of Chemical Structure on Polyimide Ultra-thin Film |
|
Y. Chiao, C.-L. Chung, S.-L. Fu, I-Shou University (Taiwan) |
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