ICEP 2006 Advance Program

April 19 April 20 April 21
 

Room A

Room B
10:00

　

WA1: MEMS & Optoelectronics

WB1: Interconnection
12:05

Lunch Time
13:35

　

Welcome Speech
13:45

　

Awarding Ceremony
14:05


Focused Seminar: SiP Progress in Japan and USA
 

1.  Portable Electronic Products driven by SiP and High-dense Module Technologies
    U. Ueda, SemiConsult / Japan
 
2. The New Markets for SiP
    E. J .Vardaman, TechSearch International / USA
 
15:25  
15:35

　


Invited Speech
 

1. What's the Jisso Technology for Next Generation Automotive Electronics
    Dr. Masayuki Hattori, Toyota Motor Corporation
 
2. Advanced semiconductor packaging technology
    Dr. Jungihl Kim, Amkor Technology Korea, Inc.
 
17:35  
18:00

20:00

Welcome Reception

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