Room A

Room B

8:50

　FA1: Si Through Hole Technology

　FB1: Interconnection

FA2: Latest JISSO Application

Lunch Time

FA3: Recent Progress of the Surface
Activated Bonding Technology
in Electronic Packaging

(17:20)

FB3: Substrate & Interposer, Practical/
Profittable Approach

17:45

FB4: Advanced Substrate & Interposer