Abstract Submission and Deadline

The abstract submission deadline is October 31 November 10, 2018.

In an effort to improve the conference quality, we would like to ask you to prepare an abstract using the attached template to help us better evaluate your submission. The abstract should contain about 1 page of text and 1 page for supporting figures and tables, with a total length of 2 pages at maximum.

Figures and tables to support the point of the paper will receive positive considerations. Technical experts assigned by the conference technical committee will review your abstract, and their comments will be used in the selection process. Your abstract will be used for review purpose only and will not be included in the conference proceeding.

Thank you very much for your contribution!

Abstract Template click here

Call for Papers English ver.   Japanese ver.

Final Manuscript Submission and Deadline

Paper Submission
1) The submission system will be open from February 12th, 2019 until February 22, 2019.
The deadline for final submission (completion of all steps below) is February 22, 2019.

2) Your full paper will be included in IEEE Xplore after presenting at ICEP 2019.

3) IEEE is very strict about the requirements for converting application files to full-text PDF for inclusion in IEEE Xplore. IEEE PDF eXpress Plus is available to check your PDF or convert your paper to PDF format.

Registration Fees

Member of JIEP / IEEE / IMAPS: 41,000 JPY (including reception and the proceedings)
Non Member: 55,000 JPY (including reception and the proceedings)
Students: 12,000 JPY (including reception and the proceedings)

Major Topics

Advanced Packaging 2.5D/3D, Advanced CSP and POP,Advanced Flip-Chip, Automotive, Embedded and Advanced Substrates, Fan-Out, Heterogeneous Integration and SiP, High Performance Computing and Data Center, Interposers, TemporaryBonding/De-Bonding, TSV/TGV, WaferLevel & Panel Level Process, Wafer Level Packaging, Wearable & IoT, Wireless Interconnection

Design, Modeling, and Reliability Advanced Package Reliability (TSV/TGV, 2.5D/3D Packaging, WCSP, Fan-Out, Embedded Technologies), Automotive Reliability Requirements, Challenges in SiP Reliability, Drop and Dynamic Mechanical Reliability, Failure Analysis Techniques and Materials Characterization, Fracture and Warpage in Packages, High Voltage Packaging and IoT Reliability, High-Speed Board Design, Interconnect Reliability (Flip-Chip, Wire-Bond), Mechanical Design and Reliability, Physics of Failure, Probabilistic Design for Reliability (PDfR), Reliability Test Methods and Life Models, Signal and Power Integrity, System Level Reliability (Testing, Modeling), TCAD

Emerging Technologies 3D Printing, Anti-Counterfeiting, Bendable electronics, Biomimetics, Biosensors, Compact & Autonomous Sensor Packaging, Components for Internet of Things (IoT) and Smart Electronics, Device Applications, Disposable / Dissolvable Packaging, Flexible electronics, Future diagnostic and treatment solutions, Hearingaids, Heterogeneous Integration, Implantable defibrillators, Implantable Device Packaging, Inkjet, Interventional catheters, Materials and Approaches to Interconnects and Packaging, Medical Electronics, Micro opto electro mechanical systems (MOEMS), Micro electro mechanical systems (MEMS), Micro fluidics, Nano Imprint, Nano-Battery, Nano electro mechanical systems (NEMS), Neurostimulator and drugdelivery, New Additive Packaging Process Technologies and Materials, New Materials and Methods for Packaging Micro fluidics, Novel Substrates, Organic Semiconductors, Packaging for Wireless, Photovoltaic, Pillcams, Redundancy, Repair, Security, Self-Alignment and Assembly, Self-Healing, Sensor Devices, Stretchable electronics, Structural Electronics, Ultrasound transducers, Wafer Level Integrated Silicon Photonics, Wearable Electronics, Wireless communications

High-Speed, Wireless & Components 3D Printed RF Components and Modules, 5G, Advanced Components (Materials,Structures), Ambient Intelligence, Antennas, Automotive Sensors, Beamforming, Design and Analysis of Power Delivery Systems, Electrical Modeling and Design, EMI, Fabrication and Characterization, Filters, Flexible Electronics, Full Duplex, High-Speed, High-Speed Data Transfer / Communications, High-Speed Systems (Design, Analysis), Imagers, Integrated Voltage Regulators (IVR), LTE, M2M Platforms, Massive MIMO, Microwave, Millimeter Wave, Mixed-Signal, mm Wave and THzT / RModules, Modules & Sub-Systems, Power and Signal Integrity, Power Management, Proximity Sensors, Radars, RF, RF to THz Devices & Passive Components, RFID and Tagging, RF-MEMS, RF-Opto, Small Cell, Wearable and Sensor Technologies for Internet of Things (IoT), Wireless Power, Wireless Sensor and Computing Nodes, WLAN

Interconnections 2.5D/3D, Automotive, Conductive Adhesives, Embedded Multi-die Interconnect Bridge, Embedded Systems, Energy Harvesting, Fan-Outand Fan-In, Flip-Chip (Bonding, Materials, Reliability), Harsh Environments, IMC Interconnect, Interconnects for Bio-Medical, RDL, Si/Glass/Organic Interposers, Solder Bumping and Cu Pillar, Thermal/Mechanical/Electrical Tests & Reliability, TSV/TGV (Fabrication, Characterization, Reliability), WaferLevel & Panel Level Interconnects, Wearables, Wirebonds (Process,Reliability), WLCSP

Materials and Processes 3D Materials & Processing, 3D Materials and Processing, Advanced Assembly Technology Solutions, Advancement in 3D Handling & Packages, Advances in RF Materials & Components, Battery Materials, Carbon Electronics, Dicing and Singulation, Embedded/Hybrid Package Manufacturing Process, Emerging Electronic Materials, Enhancement in Thermal Compression Bonding Processes, Flexible and Wearable Electronics, Healthcare/Fitness Component Assembly, Large/Ultra Large Package (SiP, SIM, MCP) Integration and Processing, Next Generation Packaging Substrates, Next Generation Substrates for Package Integration, Novel Assembly Technologies, Novel Fan-Out Interconnections, Novel Interconnect Materials, Optoelectronic Materials, Panel Level Manufacturing for WLP, Panel Processing & Materials, Performance Enhanced Materials (Adhesives, Underfills, TIMs, Dielectrics, Molding Compounds, Solder, TemporaryBond), Performance Enhanced Materials (Prepregs, Platingsolution, Photoresist), Performance Enhanced Printing WiringBoard (Fineline, LowCTE, Coreless, ThinCore), Thin Die/ThinMold/ThinPackage Handling and Assembly, Via Formation and Filling, Wafer Level Packaging, Warpage Control/Management in Board Level Assembly, Wearable/IoT Package Assembly

Optoelectronics 3D Photonics, Advanced Optical Connectors,High-Efficiency LEDs and High Power Lasers, Integrated Optical Sensors, Integrated Photonics Modules, Materials and Manufacturing Technology, Mid-Board/On-Board Optical Modules, Optical Chip-Scale and Heterogeneous Integration, Optical Interconnects, Optical Printed Circuit Board, Optical Waveguide Circuits, Optoelectronic Assembly and Reliability, Transceivers and Silicon Photonic Modules

Power Electronics Integration AC-DC Converters, Capacitors/Supercapacitors, DC-DC Converters, Devices and Components, Fast Recovery Diodes, GaNHEMTs, Hybrid System, Interconnects and Fuses, Inverters/converters for electric vehicles, Lamp Ballasts and LED Lighting, Magnetic materials and components, Mechatronic Integration, Motor Drives and Inverters, Packaging of high-temperature power electronics, Power Electronics for Utility Interface, Power Module, Power Silicon MOSFETs / BJTs / IGBTs, Sensors, SiC MOSFETs and BJTs, Systems and Components Reliability, Ultra High Power Density Integration

Thermal Management Advanced Cooling Modules, Fansand Blowers, HeatPipes, HeatSinks, Microand Nano Scale Heat Transfer, Thermal Issues in Devices, Thermal Measurements