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Information
2021 International Conference on Electronics Packaging
(ICEP 2021)
Date: May 12-14, 2021
Venue: The National Museum of Emerging Science and Innovation, Tokyo
Keynote Lecture Cancellation
There was an unfortunate last-minute cancellation of keynote lecture by Dr. Belgacem Haba from Xperi due to unfortunate circumstances.
ICEP 2021 Transitions to an All-Online Event
Due to ongoing COVID-19 uncertainty and travel restrictions, the ICEP Organizing Committee has decided that ICEP 2021 will be held as an all-online event, instead of on-site and in-person meeting originally planned to take place in Tokyo.
Thank you for your understanding and cooperation.
December 1, 2020
Notice
Call for Papers
We are waiting for your abstract submission.
Information of call for papers: English ver.
Please prepare an abstract using the attached template to help us better evaluate your submission.
The abstract should contain about 1page of text and 1 page for supporting figures and tables, with a totallength of 2 pages at maximum.Figures and tables to support the point of the paper will receive positive considerations. Your abstract will be used for review purpose only and will not be included in the conference proceeding.
Excursion
According to the present status of COVID-19 over the world, the ICEP organizing committee has decided to cancel this year's excursion. Please look forward to next year's event.
Official Sponsors
Sponsor: JIEP (The Japan Institute of Electronics Packaging)
Technical Co-Sponsors: IEEE EPS Japan Chapter and iMAPS
