About ICEP 2025

2025 International Conference on Electronics Packaging joined with iMAPS All Asia Conference (ICEP-IAAC 2025) from April 15 to 19, 2025 in Nagano, Japan.
ICEP is Japan's largest international conference on electronic packaging, attracting more than 360 attendees and hosting about 35 technical sessions. ICEP provides a strong platform to demonstrate your technologies and products and expand your customer network. JIEP jointly sponsors it, IEEE EPS Japan Chapter, and iMAPS. The conference has technical sessions covering a wide range of topics including advanced packaging, design, modeling and reliability, emerging technologies, high-speed, wireless & components, interconnections, materials and processes, optoelectronics, power electronics integration, and thermal management.

Since its inauguration in 2001, ICEP has developed into a highly reputed electronics packaging conference in Japan, attended by world-renowned experts in all aspects related to packaging technologies from all over the world.

Organization

General Chair
Taiji Sakai, TSMC Japan 3DIC R&D Center

General Vice Chair
Ryo Endoh, Rapidus
Takaaki Ishigure, Keio University
Yasuhiro Morikawa, ULVAC

Operation Committee Chair
Ryo Endoh, Rapidus

Operation Committee Vice Chair
Yoshitaka Adachi, OMRON
Kei Murayama, SHINKO ELECTRIC INDUSTRIES

Operation Committee Members
Yoshiyuki Arai, Toray Engineering
Yoshihito Iizawa, Mitsubishi Chemical
Kumiko Ioka, Toshiba
Yuki Ishikawa, Sanyu Rec
Kamogawa Osamu, Inotec Taiwan
Minami Kaneko, Nihon University
Hidetoshi Kitaura, Panasonic Industry
Masakazu Kobayashi, NAGASE
Yoshiteru Kono, OMRON
Naohiro Kumada, OKUNO Chemical Industries
Katsumi Miyama, Hokkaido University of Science
Mitsuyo Miyauchi , ALPHA-DESIGN
Miki Mori, HUAWEI TECHNOLOGIES JAPAN
Takumi Nishihara, OKUNO Chemical Industries
Yoshio Nogami, Nogami Inter Connect
Mizuho Oi, A.L.M.T.
Keishi Okamoto, Rapidus
Fumito Ootake, ULVAC
Jun Shirakami, DIC
Makoto Takahashi, Mitsubishi Chemical
Tomoyuki Uchida, Toray Research Center
Takahito Watanabe,IBM Japan
Noriyasu Yamane, Mitsubishi Chemical
Yamauchi Akira, National Institute of Technology, Gunma College
Futoshi Yoshimura, Toray Precision

Technical Program Committee Chair
Yasuhiro Morikawa, ULVAC

Technical Program Committee Vice Chair
Toyohiro Aoki, IBM Japan
Fumihiro Inoue, YOKOHAMA National University
Kai Takeuchi, Tohoku University

Technical Program Committee Members
Tomoyuki Abe, Samsung Japan
Takeru Amano, AIST
Masahiro Aoyagi, Kumamoto University
Chuantong Chen, Osaka University
Noriyuki Fujimori, OLYMPUS
Masahisa Fujino, Institute of Microelectronics, A*STAR
Norimasa Fukazawa, DIC
Go Hamasaka, Tokuyama
Koichi Hasegawa, JSR
Nobuaki Hashimoto, Suwa University of Seience
Tomoyuki Hatakeyama, Toyama Prefectural University
Seiichiro Higashi, Hiroshima University
Eiji Higurashi, Tohoku University
Koichi Hirano, Panasonic Holdings
Masahiro Inoue, Gunma University
Takashi Kasahara, Hosei University
Lim Ying Ying, AIST
Tadao Matsunaga, Tottori University
Risa Miyazawa, IBM Japan
Jun Mizuno, National Cheng Kung University
Yoji Nakajima, TOKYO ELECTRON
Masashi Nakazawa, Sony Semiconductor Solutions
Hiroshi Nishikawa, Osaka University
Takayuki Ohba, Tokyo Institute of Technology
Hideo Ohkuma, HTO
Tetsuya Onishi, Grand Joint Technology
Hitoshi Sakamoto, Huawei Technologies Japan
Marie Sano, Yokohama National University
Yoichiro Sato, AGC
Koichi Shibayama, Sekisui Chemical
Akitsu Shigetou, National Institute for Materials Science
Koichi Takemura, AIO Core
Naotaka Tanaka, Resonac
Yoshihiro Tomita, Intel
Fumio Uchikoba, Nihon University
Shoji Uegaki, Crane Research
Junsha Wang, Meisei University
Keiju Yamada, Toshiba
Kiyokazu Yasuda, Osaka University

Publication Chair
Kiyokazu Yasuda, Osaka University

Publication Vice Chair
Masahisa Fujino, Institute of Microelectronics, A*STAR

Finance Chair
Akira Yamauchi, National Institute of Technology, Gunma College

Advisory
Yasuhiro Ando, ABI Techno Lab
Kaoru Hashimoto, Nagano Jisso Forum
Kinya Ichikawa, TSMC Japan 3DIC R&D Center
Fumio Miyashiro, Yokohama Jisso Consortium
Hideyuki Nishida, NEP Tech. S&S
Atsushi Okuno, Green Planets
Yuzo Shimada, JJTTA
Katsuaki Suganuma, Osaka University
Shinichi Wakabayashi, CONNECTEC JAPAN
Kishio Yokouchi, Japan Jisso-Interconnect Solution Laboratory