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Abstract Submission and Deadline
The abstract submission deadline is October 31, 2024.
The abstract deadline has been extended until November 7, 2024.
ICEP-IAAC 2025 abstract template and detailed instructions
Abstract Template Download: click here
We would like to ask you to prepare an abstract using the attached template. The abstract should contain about 1 page of text and 1 page for supporting figures and tables, with a total length of 2 pages at maximum. You must include the novel, original, and unpublished contents and state the purposes, methods, results, and conclusions clearly in the abstract. The abstract, deviating apparently from the official format, may be rejected automatically.
Technical experts assigned by the conference technical committee will review your abstract, and their comments will be used in the selection process. Your abstract will be used for review purpose only and will not be included in the conference proceeding.
Notification of acceptance/rejection will be sent to authors by December 15, 2024.
Final Paper Submission and Deadline
Once an abstract has been accepted, a final 2-page paper in double column format will be required by January 31, 2025.
Only papers submitted by the due date will be considered for the conference awards.
Accepted and presented papers will be published in the conference proceedings and submitted to IEEE Xplore as well as other Abstracting and Indexing (A&I) databases (EI Compendex and INSPEC).
The authors are required to release the copyright of all submitted contents in their final manuscripts.
IEEE reserves the right to exclude a paper from distribution after the conference, including IEEE Xplore® Digital Library, if the paper is not presented by the author at the conference.
Registration Fees
Member of JIEP / IEEE / IMAPS: 45,000 JPY (including reception and the proceedings)
Non-Member: 60,000 JPY (including reception and the proceedings)
Students: 20,000 JPY (including reception and the proceedings)
Major Topics
Advanced Packaging-2.xD/3D, TSV/TGV
-Substrates/interposers/RDL
-Fan-out/in packaging
-Wafer/panel level packaging
-Automotive and IoT applications
-High-performance computing
-Heterogeneous integration technologies
-Chiplet packaging
-Hybrid bonding
-Other related technologies
Emerging Technologies
-Health/medical care and cosmetics devices
-Stretchable/flexible electronics
-Sensor and MEMS/NEMS/MOEMS packaging
-Batteries and eco-friendly devices
-Advanced MEMS/NEMS/MOEMS technologies
-Packaging for quantum computing
-Other related technologies
High-Speed, Wireless & Components
-3D-printed components
-Antennas, RFs, and sensor modules
-Highspeed applications (5G, LTE etc.)
-Automotive and IoT applications
-Other related technologies
Power Electronics
-Power device and module fabrication (HEMT, diode, IPM etc.)
-Advanced Inverter & converter
-Super capacitor
-Harsh environment tolerant device & module
-Si-based MOSFET, BJT, IGBT
-Other relating technologies
Thermal Management
-Advanced cooling technologies
-Thermal management structures (heat sinks, pipes, etc.)
-Simulation, measurement, and evaluation methods
-Other related technologies
Interconnections
-Interconnection methods (flip-chip, wire-bonding etc.)
-2.xD/3D, TSV/TGV, fan-out/in interconnections
-Embedded systems
-Power electronics interconnections
-Bio/medical and eco-friendly devices
-Hybrid bonding
-Other related technologies
Materials and Processes
-Homo/heterogeneous bonding/assembly
-Substrates, interposers and panels
-Metallic materials & processes (plating, soldering etc.)
-Organic semiconductors (OLED, OFET, OPV etc.)
-Power electronic/battery materials & processes
-Optoelectronic materials & processes
-Additive manufacturing (compound, paste, 3D printing etc.)
-Die to Wafer, Wafer to Wafer, Debonding
-Other related technologies
Design, Modeling, and Reliability
-2.xD/3D, TSV/TGV, WLCSP, Fan-out/in
-Advanced reliability evaluation (PDfR etc.)
-High performance board design
-Novel test methods and life models (LCA, TCAD etc.)
-Other related technologies
Optoelectronics
-3D/silicon photonics technologies
-Optical connectors, waveguides, & transceivers
-Device fabrication (LED, laser, sensor, etc.)
-Mid/on-board module fabrication
-Optical wafer/chip-scale packaging
-Co-packaged optics
-Other related technologies
Other Upcoming Technologies
-New system concept & design
-Any other topics related to ICEP scope