|General Chair :|
Takeshi Wada (ESL-Nippon Co.)
Vice General Chair :
Kaoru Hashimoto (FUJITSU Labs.)
Shinichi Nishi (Konica Corp.)
Message from the General Chair|
On behalf of the Symposium Committee, I cordially welcome you to the city of "Omiya" in Greater Tokyo for the fourth 2000
IEMT/IMC Symposium. We have been developing this event as an opportunity to present "Microelectronics Packaging in the
New Millennium". We will provide you with a way to integrate the existing diversity of microelectronics packaging
technologies, to go from "Chaos" to "Cosmos". Don't miss this valuable opportunity to add the latest information to your
reserch activities or professional skills.
In the Symposium invited speeches which foresee the key to bridge technologies in both of the 20th and 21st Centuries will
be given. Sessions for individual technologies like Advanced packaging, Board and Substrate, VLSI package,
Interconnection, Material & Components, Optoelectronics, Processing, Design & Simulation, Thermal management,
Reliability & Test, Environment-friendly packaging, etc. with many papers will be presented for your choice.
In addition to the event a traditional "Microelectronics Show" will be open at the same site which provides you the latest
information on commercialized technologies in the field of your interest. I express my heartiest gratitude to the entire Symposium Committee who have worked hard to make this Symposium the most
successful ever. It will be a valuable opportunity you won't want to miss. See you in Omiya!
- Sponsored by
- IMAPS (International Microelectronics and Packaging Society) Japan
- IEEE CPMT (Components, Packaging, and Manufacturing Technology) Society
Secretariat of IEMT/IMC Symposium ( IMAPS Japan )
3-12-2 Nishiogikita, Suginami-ku, Tokyo 167-0042 Japan
Phone: +81-3-5310-2010 Facsimile: +81-3-5310-2011
E-mail : email@example.com
ACCESS & LOCATION
2000 IEMT/IMC Symposium will be held
at "Sonic City" in Omiya City, near Tokyo,
Saitama Prefecture, Japan.
The 14th Microelectronics Show will be held on|
concurrently with symposium.
The show will provide an opportunity to view
the most recent packaging materials,
manufacturing equipments and related products.