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09:00
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FA1: Interconnection |
Chairperson: K. Hashimoto (Fujitsu
Laboratory)
M. Tsukamoto (The University of Tokyo) |
| 1. |
LCP / Cu Lamination by the Surface Activated Bonding (SAB)
K. Nanbu, Toyo Kohan / Japan |
| 2. |
Novel Material System Solution for Fine Pitch Non-metallurgical Flip Chip Interconnections
N. Tanaka, Hitachi, A. Nagai, M. Yasuda, Hitachi Chemical / Japan |
| 3. |
Interconnection Sheet for Ultra High Pin Counts Applications
T. Ochiai, K. Miwa, K. Taguchi, NGK Insulators / Japan |
| 4. |
Resin Encapsulated Flex Interconnection
K. Kawate, Sumitomo 3M / Japan |
| 5. |
Low Temperature Flip Chip Attachment for Flexible Display Applications
B. Vandecasteele, IMEC, J. Maattanen, Elcoteq Network / Finland,
T. Podprocky, J. Vanfleteren, IMEC / Belgium |
| 6. |
Development of Void Decrease Process in BGA/CSP Mounting
M. Takesue, Fujitsu / Japan |
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FB1: Highspeed Board Design |
Chairperson: P. Collander (Poltronic)
S. Hiura (Toshiba) |
| 1. |
Design for Enhanced Board Level Solder Joint Reliability of Very High Pin Count FCBGA Package
H.S. Ng, M. Lim, T.Y. Tee, STMicroelectronics / Singapore |
| 2. |
Electrical Modeling of FC-BGA for High Speed Package Applications
M.-K. Chen, C.-C. Tai, National Cheng Kung University,
Y.-J. Huang, S.-L. Fu, I-Shou University / Taiwan |
| 3. |
A Simulation Methodology and Design Practice for High Speed Parallel Bus Considering SSN
N. Takahashi, S. Suminaga, IBM Japan / Japan |
| 4. |
Compact Vertical Transitions for High-speed Printed Circuit Boards
T. Kushta, K. Narita, T. Saeki, H. Tohya, NEC / Japan |
| 5. |
Improvement of LAN Cable for 1Gbps Ethernet with High Frequency of 300MHz
O. Koyasu, K. Ohashi, Fujikura, Y. Akiyama, K. Otsuka, Meisei University / Japan |
| 6. |
Measurements of the Transmission Characteristics and the Electric Field Radiation of Various Parallel Pair Lines
T. Kasuga, E. Ohta, K. Takahashi, H. Inoue, Akita University / Japan |
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11:30 |
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LUNCH TIME |
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12:30
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FA2: MEMS Packaging |
Chairperson: A. Okuno (Sanyu Rec)
N. Hashimoto (Seiko Epson) |
| 1. |
Packaging and Assembly of MEMS Devices: A Major Impediment to the Industry
A. Morita, Prismark Partners / USA |
| 2. |
Aligned Room-temperature Wafer Bonding by Ar Beam Surface Activation for Wafer-scale MEMS Packaging
H. Takagi, National Institute of Advanced Industrial Science and Technology / Japan |
| 3. |
Novel Packaging Technology for MEMS Devices
M. Chino, T. Shimada, H. Tazawa, Misuzu Industries,
M. Urano, H. Ishii, T. Shimamura, K. Machida, NTT / Japan |
| 4. |
A Novel MEMS Optical Fiber Pressure Sensor Packaging Design
G. Wang, Y. Fu, M E Welland, H.P. Hodson, University of Cambridge, / UK, J. Ma, Tsinghua University / China |
| 5. |
Dicing Technology for the Next Generation
- The Stealth Dicing Technology
F. Fukuyo, Hamamatsu Photonics / Japan |
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FB2: Thermal Management |
Chairperson: H.-S. Ng (STMicroelectronics)
S. Kitajo (NEC) |
| 1. |
Evaluation by Simulation of the Aging State of a Thyristor System Used in a Power Plant
A. Guedon-Gracia, E. Woirgard, C. Zardini, Universite Bordeaux I,
G. Simon, EDF R&D site les Renardieres / France |
| 2. |
Wick Structure Effect on the Performance of Vapor Chambers
C.-W. Lin, J.-C. Shyu, L.-K. Yeh, S.-W. Chen, C.-T. Chou, M.-J. Tsai,
Industry Technology Research Institute / Taiwan |
| 3. |
Thermal Fatigue Life Prediction of Sn-3.0Ag-0.5Cu Solder Joint by Modified Coffin-Manson Equation
M. Yamabe, Toshiba / Japan |
| 4. |
Thermal Performance of Stacked CSPs
G. Gray, S. Krishnan, I. Osorio, Tessera / USA |
| 5. |
Comparative Study of Thermally Conductive Fillers in Underfills
W.-S. Lee, J. Yu, Korea Advanced Institute of Science and Technology,
T.Y. Lee, Hanbat University / Korea |
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14:35 |
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COFFEE BREAK |
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14:50
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FA3: System in Package |
Chairperson: S.-L. Fu (I-Shou University)
Y. Kodama (Kyocera SLC Technologies) |
| 1. |
First Single Module Demonstration of SOP with Digital, Optical and RF for Last Mile Broadband Applications
V. Sundaram, R.R. Tummala, Georgia Institute of Technology / USA |
| 2. |
Development of a New Interposer Including Embedded Film Passive Components
K. Nakamura, T. Mori, K. Nakayama, M. Yamaguchi, M. Akazawa,
S. Kuramochi, A. Takano, Dai Nippon Printing, Y. Fukuoka, Weisti / Japan |
| 3. |
FCBGA Type High Speed SIP using Ultra Fine Pitch Interposer
H. Matsuki, T. Okamoto, M. Ikumo, S. Tiba, N. Saito, A. Miyota,
E. Watanabe, Fujitsu / Japan |
| 4. |
Polymeric Carbon Embedded Resistors in Multilayer Printed Wiring Boards
K. Perala, T. Rapala-Virtanen, Aspocomp Group, T. Uusluoto,
A. Tuominen, Tampere University of Technology / Finland |
| 5. |
An Alternative Method for Organic Substrate for Use in High Density Miniaturized Electronic Assembly
P. Jalonen, Satakunta Polytechnic / Finland |
| 6. |
New Approaches to 3-D Interconnection Systems in Package Applications
C. Val, 3D Plus / France |
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FB3: Lead Free |
Chairperson: G. Gray (Tessera)
K. Tsunoi (Fujitsu) |
| 1. |
Development of New Fluxless Reflow Soldering Process by Hydrogen Radical
T. Nakamori, Kumamoto University / Japan |
| 2. |
Effect of Aging on the Interfacial Reaction of BGA Sn-Ag-Cu and Sn-Ag Solders with Ni(P)/Au Surface Finish on Pad
A. Sharif, Y.C. Chan, City University of Hong Kong / Hong Kong |
| 3. |
Comparative Study of Lead Free Solder with Electrolytic Ni and Electroless NiP Layer during Long Time Reflow on BGA Packages
M.N. Islam, Y.C. Chan, City University of Hong Kong / Hong Kong |
| 4. |
Analysis on the Surface Oxide Film and the Reliability of Bumps Used for Flip Chip Bonding
Y. Liu, J. Ma, G. Chen, Q. Li, Tsinghua University / China |
| 5. |
Comparison of Wire Bondability on Rigid and Flexible Substrates
Y.H.Chan, J.-K. Kim, Hong Kong University of Science & Technology, D. Liu, P.C.K. Liu, Y.M. Cheung, M.W. Ng, ASM Assembly Automation / Hong Kong |
| (16:55) |
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17:20 |
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