ICEP-IAAC2015 OUTSTANDING TECHNICAL PAPER AWARDS

“Development of a Curable Conductive Copper Paste in Air”
Masashi Kajita, Tomoyuki Takahashi, Toshiyuki Sato, Namics / Japan

“Evaluation of Through-Silicon -Via Process using Scanning Laser Beam Induced Current (SLBIC) System”
Woon Choi, Takahiro Ishimoto, Hajime Tomokage, Fukuoka University / Japan

“Ultra-thin Line Embedded Substrate Manufacturing for 2.1D/2.5D SiP Application”
Yu-Hua Chen, Shyh-Lian Cheng, Dyi-Chung Hu, Tzvy-Jang Tseng, Unimicron Technology / Taiwan



ICEP2015 IEEE CPMT JAPAN CHAPTER YOUNG AWARDS


“Relationship between transient thermal impedance and shear strength of pressureless sintered silver as die attachment for power devices”
Yunhui Mei Tianjin University / China

“The Study of Suppression Method for Power Radiation between GND Planes from Signal Via in MultiLayer Board” Hiroshi Itakura Mitsubishi Electric Corporation / Japan

“Thermal Properties of Power Si MOSFET by Considering Electron-Phonon Scattering using Monte Carlo Simulation” Risako Kibushi Toyama Prefectural University / Japan



ICEP-IAAC 2015 JIEP POSTER AWARD


“In Situ Observations of Micromechanical Behaviours of Intermetallic Compounds for Structural Applications in 3D IC Micro Joints”
Jen-Jui Yu National Taiwan University / Taiwan



ICEP-IAAC 2015 Intel STUDENT AWARD


“Efficacy Evaluation of Candle-Like Micro-Needle Electrode for EEG Measurement on Hairy Scalp"”
Miyako Arai Keio University / Japan