2017 International Conference on Electronics Packaging
General Information
2017 International Conference on Electronics Packaging
(ICEP2017)
Date: April 19-22, 2017
Venue: Takinoyu Hotel, Tendo, Yamagata
2017 International Conference on Electronics Packaging
(ICEP2017)
Photo Galley Opens
Award Ceremony
Welcome Reception
Others
Call for
Papers
The
submittion deadline is extended to October 10.
We are waiting for your abstract submission.
Information
of call for papers: english
ver.
Please
prepare an abstract using the attached template to help us better
evaluate your submission. The abstract should contain about 1
page of text and 1 page for supporting figures and tables, with a total
length of 2 pages at maximum.
Figures
and tables to support the point of the paper will receive positive
considerations. Your abstract will be used for review purpose
only and will not be included in the conference proceeding.
Thank
you very much for your contribution!
Yamagata MICE Navi
YAMAGATA Prefecture in Japan is famous for its hot springs, beautiful
frosted-covered trees as Great nature entertainment. Even among those,
7 cities and 7 towns are very attractive areas to enjoy sightseeing and
nature.
'Yamagata MICE Navi' is a support application for participating in a
convention and planning a business travel.
'MICE' is 'business travel' which now attracts worldwide attention, a
newly coined word to combine head-letters from following words;
Meeting, Incentive tour, Convention and Exhibition. What is the biggest
difference form a package tour is original and special planning and
service.
Yamagata Prefecture has ideal facilities and events for business travel
to hold convention such as international meetings or national
tournaments, nothing other than attractive sightseeing and nature!
'Yamagata MICE Navi' willingly offer information for organizers and
participants in Yamagata to feel comfortable and join conveniently.
Important Date
The abstract submission open: August 1, 2016
The abstract deadline: September 30, 2016
Notification of acceptance: the middle of November, 2016
Final manuscript dead line: January 31, 2017