About ICEP-IAAC 2018

ICEP-IAAC 2018 will be held from April 17 to 21, 2018 in Kuwana, Mie, Japan.
ICEP is the largest international conference on electronic packaging in Japan, attracting more than 360 attendees and hosting about 35 technical sessions. ICEP provides a strong platform to demonstrate your technologies and products as well as expand your customer network. It is jointly sponsored by JIEP, IEEE CPMT (Components, Packaging, and Manufacturing Technology) Society Japan Chapter, and iMAPS. The conference has technical sessions covering a wide range of topics including advanced packaging, design, modeling and reliability, emerging technologies, high-speed, wireless & components, interconnections, materials and processes, optoelectronics, power electronics integration, thermal management.
Since its inauguration in 2001, ICEP has developed into a highly reputed electronics packaging conference in Japan, attended by world-renowned experts in all aspects related to packaging technologies from all over the world.

Organization

General Chair
Yoshio Nogami, Toray Engineering

General Vice Chair
Hajime Hirata, Toray Engineering
Osamu Suzuki, Namics
Yoichi Taira, Keio University

Finance Chair
Masahiro Inoue, Gunma University

Finance Vice Chair
Tomoyuki Hatakeyama, Toyama Prefectural University

Operation Committee Chair
Hajime Hirata, Toray Engineering

Operation Committee Vice Chair
Katsumi Miyama, Hokkaido University of Science
Mitsuyo Miyauchi, Alpha Design
Miki Mori, The University of Tokyo

Operation Committee Members
Yoshitaka Adachi, OMRON
Hidenobu Deguchi, Sekisui Chemical 
Ryo Endoh, Toray Research Center
Atsunori Hattori, NODA TECHNO
Koichi Hirata, NAMICS
Yoshikazu Hirayama, Toray Engineering
Maki Ito, Hitachi
Minami Kaneko, Nihon University
Osamu Kamogawa, AIR WATER MATERIALS
Yoshiteru Kono, OMRON
Takayuki Machida, Nagase
Keishi Okamoto, IBM Japan
Taiji Sakai, Fujitsu Laboratories
Kazuo Shimokawa, Toshiba
Jun Shirakami, DIC
Tsunehiko Terada, Tatsuta Electronics
Daisuke Wakuda, Panasinic
Shizuo Yamamoto, KOA
Akihiro Yanami, Daisho Denshi

Publication Chair
Tomoyuki Hatakeyama, Toyama Prefectural University

Publication Vice Chair
Eiji Higurashi, AIST

Publication Members
Shigenori Aoki, Fujitsu Labolatories
Hitoshi Sakamoto, Huawei Technologies Japan

Technical Program Committee Chair
Osamu Suzuki, Namics

Technical program Committee Vice Chair
Shigenori Aoki, Fujitsu Labolatories
Koichi Hasegawa, JSR
Eiji Higurashi, AIST
Toshihisa Nonaka, Hitachi Chemical
Akitsu Shigetou, NIMS

Technical Program Committee Members
Tomoyuki Abe, FUJITSU
Toyohiro Aoki, IBM Japan
Masahiro Aoyagi, AIST
Takahiro Arakawa, Tokyo Medical and Dental University
Noriyuki Fujimori, Olympus
Masahisa Fujino, AIST
Nobuaki Hashimoto, Tokyo University of Science, Suwa
Tomoyuki Hatakeyama, Toyama Prefectural University
Koichi Hirano, Panasonic
Shigeru Hiura, Toshiba
Hiroshi Hozoji, Hitachi Automotive Systems
Masahiro Inoue, Gunma University
Yu Kondo, OLYMPUS
Tadao Matsunaga, Tohoku University
Yasuhiro Morikawa, Ulvac
Jun Mizuno, Waseda University
Shinichi Nishi, JAPERA
Hiroshi Nishikawa, Osaka University
Masaaki Oda, Printed Electronics Network
Takayuki Ohba, Tokyo Institute of Technology
Hideo Ohkuma, HTO
Tetsuya Ohnishi, Grand Joint Technology
Kazuya Okamoto, Yamaguchi University
Yasumitsu Orii, NAGASE
Hiroshi Ozaki, Sony Semiconductor Solutions
Shuji Sagara, Dai Nippon Printing
Hitoshi Sakamoto, Huawei Technologies Japan
Yoichiro Sato, Asahi Glass 
Koichi Shibayama, SEKISUI CHEMICAL
Yoshihiro Tomita, Intel 
Kazushige Toriyama, KYOCERA
Fumio Uchikoba, Nihon University
Masahide Ueda, Tokuyama
Shoji Uegaki, ASE Group
Nobuyoshi Wakasugi, DENSO
Hiroshi Yamada, Toshiba
Kiyokazu Yasuda, Osaka University

International Technical Committee Members
Charles E. Bauer, TechLead
Shan-Li Fu, I-Shou University
C.Robert Kao, National Taiwan University
Taek-Soo Kim, KAIST
Jaeho Lee, Hongik University
Shi-Wei Ricky Lee, Hong Kong University of Sci & Tech
Shih-kang Lin, National Cheng Kung University
Wei-Chung Lo, Industrial Technology Research Institute
Guo-Quan Lu, Virginia Tech
Tae-Sung Oh, Hongik University
Jenn-Ming Song, National Chung Hsing University
Yinghui WANG, Institute of Microelectronics of Chinese Academy of Sciences
Yusuke Yasuda, Hitachi Europe

Advisory
Yasuhiro Ando
Yoshitaka Fukuoka, WEISTI
Kaoru Hashimoto, Meisei University
Kenzo Hatada, Atomnics Laboratory
Masaru Ishizuka, Toyama Prefectural University
Fumio Miyashiro, Yokohama Jisso Consortium
Hideyuki Nishida, NEP Tech. S&S
Takashi Nukii, Kyoto University
Atsushi Okuno, Green Planets Green Planets
Kanji Otsuka, Meisei University
Osamu Shimada, Dai Nippon Printing
Yuzo Shimada, Namics
Tadatomo Suga, The University of Tokyo
Katsuaki Suganuma, Osaka University
Haruo Tabata
Yutaka Tsukada, Ritsumeikan University
Shinichi Wakabayashi, Nagano Techno Foundation
Shintaro Yamamichi, IBM Japan
Kishio Yokouchi, J2IS