About ICEP 2022

ICEP 2022 will be held as a hybrid conference, combining on-site and online presentations, from May 11 to 14, 2022 in Sapporo, Hokkaido, Japan.

ICEP is the largest international conference on electronic packaging in Japan, attracting more than 360 attendees and hosting about 35 technical sessions. ICEP provides a strong platform to demonstrate your technologies and products as well as expand your customer network. It is jointly sponsored by JIEP, IEEE EPS Japan Chapter, and iMAPS. The conference has technical sessions covering a wide range of topics including advanced packaging, design, modeling and reliability, emerging technologies, high-speed, wireless & components, interconnections, materials and processes, optoelectronics, power electronics integration, thermal management.

Since its inauguration in 2001, ICEP has developed into a highly reputed electronics packaging conference in Japan, attended by world-renowned experts in all aspects related to packaging technologies from all over the world.

Organization

General Chair
Katsumi Miyama, Hokkaido University of Science

General Vice Chairs
Tomoyuki Hatakeyama, Toyama Prefectural University
Eiji Higurashi, National Institute of Advanced Industrial Science and Technology
Akira Yamauchi, National Institute of Technology, Gunma College

Technical Program Committee Chair
Tomoyuki Hatakeyama, Toyama Prefectural University

Technical Program Committee Vice Chairs
Toyohiro Aoki, IBM Japan
Akitsu Shigetou, National Institute for Materials Science
Shinya Takyu, LINTEC

Technical Program Committee Members
Masahiro Aoyagi, National Institute of Advanced Industrial Science and Technology
Noriyuki Fujimori, Olympus Medical Systems
Koichi Hasegawa, JSR
Nobuaki Hashimoto, Suwa University of Science
Sumito Hayashida, ASE Group
Koichi Hirano, Panasonic
Hiroshi Hozoji, National Institute of Advanced Industrial Science and Technology
Yuki Inaba, DENSO
Masahiro Inoue, Gunma University
Yukihiro Kanechika, Tokuyama
Takashi Kasahara, Hosei University
Yu Kondou, Fujidenolo
Tadao Matsunaga, Tottori University
Jun Mizuno, Waseda University
Yasuhiro Morikawa, ULVAC
Masaaki Oda, Printed Electronics Network
Hideo Ohkuma, HTO
Kazuya Okamoto, Yamaguchi University
Tetsuya Onishi, Grand Joint Technology
Hitoshi Sakamoto, Huawei Technologies Japan
Yoichiro Sato, AGC
Koichi Shibayama, Sekisui Chemical
Osamu Suzuki, NAMICS
Naotaka Tanaka, Showa Denko Materials
Yoshihiro Tomita, Intel
Fumio Uchikoba, Nihon University
Shoji Uegaki, Amkor Technology Japan
Kiyokazu Yasuda, Osaka University

Operation Committee Chair
Akira Yamauchi, National Institute of Technology, Gunma College

Operation Committee Vice Chairs
Koichi Hirata, Namics
Mitsuyo Miyauchi, ALPHA-DESIGN

Operation Committee Members
Hidenobu Deguchi, Sekisui Chemical
Ryo Endoh, Toray Research Center
Jin Fujimura, ePRONICS
Hajime Hirata, Toray Engineering
Yoshihito Iizawa, Mitsubishi Chemical
Minami Kaneko, Nihon University
Hidetoshi Kitaura, Panasonic
Masakazu Kobayashi, NAGASE
Yoshiteru Kono, OMRON
Mitsuyo Miyauchi, ALPHA-DESGIN
Miki Mori, Toshiba
Yoshio Nogami, Nogami Interconnect
Keishi Okamoto, Huawei Technologies Japan
Taiji Sakai, FICT
Jun Shirakami, DIC
Takaaki Watanabe, Mitsubishi Chemical
Takahito Watanabe, IBM Japan
Noriyasu "Notch" YAMANE, Mitsubishi Chemical
Futoshi Yoshimura, Toray Precision

Publication Chair
Kiyokazu Yasuda, Osaka University

Publication Member
Hitoshi Sakamoto, Huawei Technologies Japan

Finance Chair
Taiji Sakai, FICT

Finance Vice Chair
Shoichi Ishikawa

Advisory
Yasuhiro Ando, ABI Giken
Yoshitaka Fukuoka, Worldwide Electronic Integrated Substrate Technology
Kaoru Hashimoto, Meisei University
Kenzo Hatada, Atomnics Laboratory
Hideyuki Nishida, NEP Tech. S & S
Takashi Nukii, Kyoko University
Kanji Otsuka, Meisei University
Osamu Shimada, Dai Nippon Printings
Yuzo Shimada, Japan Jisso Technology Transfer Association
Shinichi Wakabayashi, Nagano Techno Foundation
Kishio Yokouchi, Japan Interconnect-Solution Laboratory