Schedule
and Program
|
Date |
Morning |
Afternoon |
Evening |
|
17th
Tue. |
Global Business Council |
| |
|
18th
Wed. |
IAAC Spesial Session |
Awarding Ceremony/ |
Welcome Reception |
|
19th
Thu. |
Technical Sessions |
||
|
20th
Fri. |
Technical
Sessions |
| |
17
Tue. Room A 18
Wed. Japan: 3DIC Integration: A Foundry
Perspective
17th and 18th Advance Program
PDF
GBC Session : 2.5D and 3D-IC Packaging Technology
Chair: Rajen
Chanchani, IMAPS Past President and Yasumitsu Orii, ICEP-IAAC 2012 General
Chair
13:00-18:00
■Speeches
ASET Developments
for the movement after Wide IO DRAM
Mr. Hiroaki
Ikeda
(General Manager, 3D-Integration Technology Research
Department Association of Super-Advanced Electronics Technologies,
Japan)
3D Stacked System Technology and Application
Prospective
Dr. Wei-Chung Lo
(Director, Industrial
Technology Reserch Institute, Taiwan)
TSV Interposer .
Materials and Process for Mass Production
Dr. Gu-Sung
Kim
(Founder & CEO, EPworks Co, Ltd. Professor of Kangnam
University, Korea)
Design Considerations for 3D IC
Integration
Dr. Dim-Lee Kwong,
(Executive Director,
Institute of Microelectronics, Singapore)
Improved
Performance, Reliability and Cost through 3D Integration of “SIMPLE”
Components - Passives !
Dr. Frank Murray
(CEO, IPDiA,
France)
3D Integration and Packaging for
Systems
Dr. John Knickerbocker
(Distinguished Engineer,
IBM Watson Research Center, USA )
2.5D/3D -
Recent Developments in Integration Approaches, Process Capability &
Biz Models
Dr. Rajendra D. Pendse
(Vice President &
Chief Marketing Office, STATSChipPAC Inc, USA)
2.5D
and 3D IC: Product and Supply Chain Readiness
Mr. Rich
Rice
(Senior Vice President, Sales & Engineering, ASE US Inc,
USA)
■Panel
Discussion
17th
and 18th Advance Program PDF
Room A
IAAC Special Session : Packaging Technology
Trend, Business, and Issues in each region
10:00-12:25
Dr. Fumio Miyashiro (IMAPS
ALC President)
USA:
Ms. E. Jan Vardaman
(President at TechSearch International, Inc.)
Europe:
Dr. Giovanni Delrosso (IMAPS
Europe and ELC President)
China:
Prof.
Jusheng Ma (Tsinghua
University)
Korea:
Dr. Gu-Sung Kim
(Founder & CEO, EPworks Co, Ltd. Professor of Kangnam
University)
India:
Dr. Srinivas
Talabattula (Associate Professor, India Institute of
Science)
Malysia:
Howe Yin Loo (Intel
Microelectronics (M) Sdn. Bhd.)
Singapore:
Dr.
Dim-Lee Kwong (Executive Director, Institute of
Microelectronics)
Taiwan:
Prof. Shen-Li Fu
(I-Shou
University)
Room
A
13:25-13:50
Award
Ceremony
Room A
Keynote
Session
13:50-17:00
Future of
Packaging from No Value-add in the Past to High Value-add in the
Future
Prof. Rao R. Tummala (Georgia Institute of
Technology, USA)
Moore's Law is
alive and fueling the “Compute Continuum” revolution
Dr.
Tsuyoshi Abe (Intel K.K., Japan)
Dr. Shang Yun Hou(Taiwan Semiconductor Manufacturing Company
Limited,
Taiwan)
Welcome
Reception
18:30-21:30
Tokyo Bay Dinner
Cruse
19 Thu.
19th
Advance Program PDF
19th Technical
Session Program
20 Fri.
20th
Advance Program PDF
20th Technical
Session Program
Poster Session
Poster Session
Program