From deep Trenches to Skyscrapers - Orthogonal Scaling

 Subramanian S. Iyer
 IBM Fellow, International Business Machines Corp.

The absence of cost effective lithography and patterning schemes is predicted to make the historical expectations of the cost -performance benefits of scaling (popularly known as Moore's Law) difficult to sustain. In this talk we introduce the concept of orthogonal scaling. Orthogonal scaling refers to features that can be added to the technology which significantly enhance the technology and which are sustainable over several generations of technology. We will examine three such orthogonal features that have either been implemented or being actively worked on. The first is embedded memory, where the integration of logic based embedded DRAMs can effectively yield up to a generational jump in effective density. The second case we consider is the use of deep trench decoupling that can reduce mid-frequency power supply noise in processor and general purpose ASICs effectively adding up to10% in chip performance above the scaling entitlement and finally, three dimensional integration which depending on its implementation can address die size, performance, process simplicity and cost beyond the expectation of semiconductor scaling. We summarize this talk with where the fundamental limits are and what our long-term options are for the evolution of a systems' based scaling methodology.

 R&D Strategy to become No.1 Green Innovation Company

 Takeshi Uenoyama
 Executive Officer, Panasonic Corp.

Looking towards 2018, the 100th anniversary of our founding, Panasonic is working under a grand vision of becoming No.1 Green Innovation Company with the concept of "Eco & Smart" solutions; aiming to integrate our business growth into environmental contribution . We are considering 4 categories to serve our customer needs: "residential space," "non-residential space," including offices, factories, and stores/facilities, "mobility space," including cars and airplanes, and "personal space." In order to achieve our goal, we established 4 companies deeply linked to 4 categories above on April 1st 2013: "Appliances Company", "Eco Solutions Company", "AVC Networks Company" and "Automotive & Industrial Company". Today I would like to describe briefly about our new mid-term business plan and our R&D strategy. I would like to explain our Cloud/ Energy/ Device solutions, the 3 important fields we consider in our R&D.

 Architecture Trends in Mobile Industry and Impact on Packaging and Integration

 Urmi Ray
 Program Manager, Qualcomm Inc.

  The last decade has seen an exponential growth in the mobile phone and computing industry. The emergence of smartphones and the ever growing demand of packing more and more features and functionality by the consumers has rapidly driven innovations in advanced packaging and integration. Smart integration at reasonable cost is a key to driving advanced functionality to mass market quickly.
  This talk will provide an overview of the latest trends in the mobile and wireless industries, with examples of architectural platforms, several disruptive technology platforms as well as evolutionary trends towards integration and miniaturization. Key focus of this presentation will be on emerging technologies, such as 2.5D TSV interposers and 3D IC integration. The applications of 3D IC integration include CMOS image sensor, MEMS, LED, memory + logic, logic + logic, memory + microprocessor. For 2.5D, active and passive interposers using Si and glass will be covered.
  Technology development challenges include tools, materials, infrastructure, reliability and many more. Several key challenges must be overcome before these integrations can be realized. In addition to lowering cost, increasingly complex tradeoffs, such as architectural partitioning, cost-performance-thermal, Chip-Package Interaction (CPI) must be managed. Electrical noise coupling, thermal interaction, and mechanical stress effects require multiphysics simulation and an infrastructure to support design for X across multiple domains. Tools, models, methodologies, materials, structural constructs, and experimental results are needed to ensure quality, yield and reliability.
  Current R&D and industry status will be presented, including technical, cost, business, standards and other factors important for rapid technology adoption.