ADVANCE PROGRAM


Advance Program PDF Here


April 10

A

B

C

D

9:40-10:55
 WA1: 3DIC Packaging-1

WA1-1
Identification of Through Silicon Via (TSV) Failure Point using Time Domain Reflectometry (TDR) Method
Keiji Matsumoto1, Hiroaki Otsuka2, Osamu Horiuchi 3, Young Gun Han3, Woon Choi2, Hajime Tomokage2,3, 1Kitakyushu National College of Technology, 2Fukuoka University, 3Center of System Integration Platform Organization Standards / Japan

WA1-2
Advanced Through-Silicon Via Inspection for 3D Integration
Takashi Tsuto1, Yoshihiko Fujimori1, Hiroyuki Tsukamoto 1, Kyoichi Suwa1, Kazuya Okamoto2, 1 Nikon, 2Osaka University / Japan

WA1-3
Electrical Test Method of Open Defects at Bi-directional Interconnects in 3D ICs
M. Hashizume1, M. Akutagawa1, Shyue-Kung Lu2, H. Yotsuyanagi1, 1The University of Tokushima / Japan, 2National Taiwan University of Science and Technology / Taiwan		 WB1: Interconnection-1

WB1-1 <Session Invited>(50min.)
2013 iNEMI Technology Roadmap Overview
Bill Bader, Chuck Richardson, International Electronics Manufacturing Initiative / USA

WB1-2
Development of Advanced Interconnection Technology for High Density Mounting using Solder Sheet with Flux Adhesive Film
K. Kawasaki, M. Hirai, S. Komatsu, J. Kusunoki, T. Yamaji, T. Kagimoto, Sumitomo Bakelite / Japan		 WC1: N-MEMS-1

WC1-1 <Session Invited>
VUV-Assisted Hybrid Bonding of Organic/Inorganic Substrates at Atmospheric Pressure
Akitsu Shigetou1, Mano Ajayan1, Jun Mizuno2, 1National Institute for Materials Science, 2Waseda University / Japan

WC1-2
A Study of the Effect of Indium Filler Metal on the Bonding Strength of Copper and Tin
Seng Keat Ting, S. Koyama, Y. Aoki, N. Hagiwara, I. Shohji, Gunma University / Japan

WC1-3
Surface Activated Bonding of Laser Diode Chips Using N2 Atmospheric-Pressure Plasma
Michitaka Yamamoto1, Eiji Higurashi1, Tadatomo Suga1, Renshi Sawada2, 1The University of Tokyo, 2Kyushu University / Japan		 WD1: Thermal Management-1

WD1-1
New Method for Evaluating Heat Transfer Material
Yasuhiro Saito, Yuuki Tuji, Hiroyuki Emoto, Takanori Komuro, Kanagawa Institute of Technology / Japan

WD1-2
Establishment of Design Methods for High Thermal Conductive UF for FCPKG
Toshiaki Enomoto, Hiroshi Yamaguchi, Toshiyuki Sato, Namics / Japan

WD1-3
A Possible Method to Assess the Accuracy of a TIM Tester
Andras Vass-Varnai, Zoltan Sarkany, Csaba Barna, Sandor Laky, Marta Rencz, Mentor Graphics / Hungary
10:55-11:05

Break

11:05-12:20
 WA2: 3DIC Packaging-2

WA2-1 <Session Invited>
Advanced TSV Fabrication Processes for Future Packaging
Koukou Suu, Yasuhiro Morikawa, ULVAC / Japan

WA2-2
Nonlinear FEA for a 3D SIC Package Improved by the Digital Image Correlation with SEM
T. Ikeda1, M. Oka2, N. Miyazaki2, K. Matsumoto3, S. Kohara3, Y. Orii3, F. Yamada3, M. Kada3, 1Kagoshima University, 2Kyoto University, 3ASET / Japan

WA2-3
Finite Element Analysis for 3D IC Packaging Structural Design During Thermal Cycling
You-Cheng Luo, Mei-Ling Wu, National Sun Yat-Sen University / Taiwan		 WB2: Interconnection-2

WB2-1
Flip-chip Bonding with Variable Direction of Ultrasonic Vibration on a Pad
Mutsumi Masumoto1, Yoshiyuki Arai1,2, Hajime Tomokage1, 1Fukuoka University, 2Toray Engineering / Japan

WB2-2
Power Cycling Simulation of Flip Chip BGA Package during Stress Relaxation
Yu-Sheng Lai, Mei-Ling Wu, National Sun Yat-Sen University / Taiwan

WB2-3
Microstructural Design in Ultrafine Interconnects under Current Stressing
Hua Xiong1, Zhiheng Huang1, Paul Conway2, Yong Zhang1, Qingfeng Zeng3, 1Sun Yat-sen University / China, 2Loughborough University / UK, 3Northwestern Polytechnical University / China Cancelled
WC2: Materials and Processes-1

WC2-1 <Session Invited>
Chip Thinning Technologies for Chip Stacking Packages
S. Takyu, T. Kurosawa, Toshiba / Japan

WC2-2
Development of the Au(Ag) Les Process Method in Solder Mounting of Si Device
Yu Nakamuta, Tuo Qu, Isao Kimura, Yasushi Higuchi, Koukou Suu, ULVAC / Japan

WC2-3
Room Temperature Bonding of Polymer/Polymer and Polymer/Glass using modified Surface Activation Bonding Method
Takashi Matsumae1, Masahisa Fujino1, Akitsu Shigetou3, Yoshiie Matsumoto2, Tadatomo Suga1, 1The University of Tokyo, 2Lantechnical Service, 3National Institute for Materials Science / Japan
WD2: Thermal Management-2

WD2-1
Analysis of Heat Generation from Power Si MOSFET
R. Kibushi, T. Hatakeyama, M. Ishizuka, Toyama Prefectural University / Japan

WD2-2
Transient Heat Transfer of The Microprocessor System Investigation regarding Natural Convection with Slate Style Chassis
K. Nishi1, T. Hatakeyama2, M. Ishizuka2, 1AMD Japan, 2Toyama Prefectural University / Japan

WD2-3
Experimental Evaluation of the Cooling Performance of Compact Heat Sink for LSI Packages
M. Ishizuka, T. Hatakeyama, R. Kibushi, Toyama Prefectural University / Japan
 

Lunch

13:10-13:35

Ceremony

 

Poster Session / Break

14:00-17:00

Keynote Speeches

From Deep Trenches to Skyscrapers - Orthogonal Scaling
Subramanian S. Iyer, IBM Fellow, International Business Machine

R&D Strategy to Become No.1 Green Inovation Company
Takeshi Uenoyama, Executive Officer, Panasonic

Architecture Trends in Mobile Industry and Impact on Packaging and Integration
Urmi Ray, Program Manager, Qualcomm 
17:00-19:30

Excursion to  the tower of Osaka Castle

19:30-

Welcome Reception




April 11

A

B

C

D

E

9:10-10:50
 TA1: ASET-1

TA1-1
High Precision Bonding for Fine-pitch Interconnection
Kuniaki Sueoka, Fumiaki Yamada, Akihiro Horibe, Hidekazu Kikuchi, Kenichi Takeda, Yasumitsu Orii, ASET / Japan

TA1-2
3D Package Assembly Development with the Use of the Dicing Tape Having NCF Layer
K. Kitaichi1, H. Shimamoto1, F. Yamada2, K. Sueoka2, 1Association of Super-Advanced Electronics Technologies, Renesas Electronics, 2Association of Super-Advanced Electronics Technologies, IBM Japan / Japan

TA1-3
3D Integration Technology using Hybrid Wafer Bonding and its Electrical Characteristics
Kazuyuki Hozawa, Mayu Aoki, Futoshi Furuta, Kenichi Takeda,  Azusa Yanagisawa, Hidekazu Kikuchi, Toshio Mitsuhashi, Harufumi Kobayashi, Association of Super-Advanced Electronics Technology / Japan

TA1-4
RF MEMS Devices and 3D Heterogeneous Integration
Fumihiko Nakazawa, Hiroaki Inoue, Takashi Katsuki, Tadashi Nakatani, Takashi Yamagajo, Xiaoyu Mi, Association of Super-Advanced Electronics Technology, FUJITSU LABORATORIES / Japan		 TB1: Printed Electronics-1

TB1-1 <Session Invited>(50min.)
Trend and Development of Advanced Printed Electronics Technologies for New Flexible Electronics Fields
Toshihide Kamata, Nationa Institute of Advanced Industrial Science and Technology / Japan

TB1-2 <Session Invited>
Pattern Formation Technology of NanoPaste for Printed Electronics
Makoto Nakatani, Hiroshi Saito, Masayuki Ueda, Hideyuki Goto, Harima Chemicals / Japan

TB1-3 <Session Invited>
Development of Low Temperature Sintered Clustered Nano Silver Pastes for Die Attach Application using Resin Reinforcing Technology
Koji Sasaki, Noritsuka Mizumura, Osamu Suzuki, NAMICS / Japan		 TC1: Advanced Packaging-1

TC1-1 <Session Invited>
Meterials, Structures, and Processes Eliminate Lead in Electronic Manufacturing
Charles E. Bauer, Herbert J. Neuhaus, TechLead / USA

TC1-2
Novel GPS SiP Module with Miniaturized Substrate by using RF Sub-Circuit Embedding Technology
Yasuhiko Katsuhara1, Masaya Tanaka1, Desmond Wong2, 1Dai Nippon Printing / Japan, 2Telit Wireless Solutions / USA

TC1-3
High Performance 3D Package for Wide IO Memory
Ilyas Mohammed, Hiroaki Sato, Yukio Hashimoto, Invensas / USA

TC1-4
DIMM-in-a-PACKAGE Memory Module Devices for Ultra-Thin Client Computing
Richard Crisp, Kevin Chen, Zhouwen Sun, Wael Zohni, Invensas / USA		 TD1: N-MEMS-2

TD1-1 <Session Invited>
iNEMI MEMS Collaboration Projects and Opportunities
Bill Bader, Chuck Richardson, International Electronics Manufacturing Initianive / USA

TD1-2
Development of Reel to Reel Chip Mounting System for LED Lighting
Seiichi Takamatsu, Takahiko Imai, Takahiro Yamashita, Toshihiro Itoh, National Institute of Advanced Industrial Science and Technology, BEANS Laboratory / Japan

TD1-3
A 0.18-μm Standard CMOS Process Utilizing CMOS MEMS Switches in RF Power Amplifier Exchanges Dual-Band (2.4-GHz / 5.2-GHz)
Jung-Tang Huang, Chia-Jung Yeh, Jian-Ming Lin, Kuo-Hsuan Tai, Chun Lo, National Taipei University of Technology / Taiwan

TD1-4
SU-8 Microfluidic Chip Integrated with Indium Tin Oxide (ITO) Electrodes for Organic Light Emitting Device Applications
Takashi Kasahara1, Shigeyuki Matsunami2, Tomohiko Edura2, Miho Tsuwaki1, Juro Oshima2,3, Chihaya Adachi2, Shuichi Shoji1, Jun Mizuno1, 1Waseda University, 2Kyushu University, 3Nissan Chemical / Japan		 TE1: DMR-Electrical-1

TE1-1
Cool System: An Energy-Efficient and Scalable 3D Heterogeneous Multi-Chip System Consists of Cool Interconnect, Cool Chip, and Cool Software
Yukoh Matsumoto1, M. Hagimoto1, S. Torii1, M. Izumida1, F. Imura2, S. Nemoto2, N. Watanabe2, F. Kato2, K. Kikuchi2, H. Nakagawa2, M. Aoyagi 2, 1TOPS Systems, 2National Institute of Advanced Industrial Science and Technology/ Japan

TE1-2
Power Supply Noise Minimization by Designing Variable On-die Resistance and Capacitance
Sho Kiyoshige, Wataru Ichimura, Ryota Kobayashi, Genki Kubo, Hiroki Otsuka, Toshio Sudo, Shibaura Institute of Technology / Japan

TE1-3
A Multi-stage Broadband Impedance Matching Circuit Built into FC-BGA Substrate Package for over 12Gbps SerDes Application
Shuuichi Kariyazaki, Ryuichi Oikawa, Yasuhiko Suzuki, Hideki Sasaki Renesas Electronics / Japan

TE1-4
An Electrical Study of Differential Clock Die-to-Die Interconnection in Multi-chip Packages
Min Keen,Tang, Wei Jern,Tan, Intel / Malaysia
 

Break

11:00-12:40
 TA2: ASET-2

TA2-1
Cooling Strategy and Structure of 3D Integrated Image Sensor for Auto-mobile Application
F. Yamada1, K. Matsumoto1, T. Hatakeyama2, M. Ishizuka2, K. Otsuka3, K. Kondo4, H. Kobayashi1, K. Sueoka1, A. Horibe1, S. Kohara1, H. Mori1, Y. Orii1, 1Association of Super-Advanced Electronics Technology, 2Toyama Prefectural University, 3Meisei University, 4Denso / Japan

TA2-2
DRAM & CMOS Device Characteristics Affected by Ultra Thin Wafer Thinning
H. Shimamoto1, S. Saito1, K. Kitaichi1, S. Yasunaga2, K. W. Lee3, T. Tanaka3, M. Koyanagi3, 1Association of Super-Advanced Electronics Technology, Renesas Electronics, 2Association of Super-Advanced Electronics Technology, Rohm, 3Tohoku University / Japan

TA2-3
Scalable IO Circuits for 3D TSV Stacked Layers
F. Furuta1,2, K. Osada1,2, K. Takeda1,2, 1Association of Super-Advanced Electronics Technology, 2Hitachi / Japan

TA2-4
Measurement and Simulation of SSO Noise Reduction of 3D-SiP with 4K-IO Widebus Structure
Masaomi Sato1, Shohei Kawaguchi1, Haruya Fujita1, Hiroki Takatani1, Yosuke Tanaka1, Toshio Sudo1, Atsushi Sakai2, Shiro Uchiyama2, Hiroaki Ikeda2, 1Shibaura-Institute of Technology, 2Association of Super-Advanced Electronics Technologies / Japan		 TB2: Printed Electronics-2

TB2-1 <Session Invited>
Transparent Conductive Oxide Patterning on GaN Substrate by Screen Printing with Nanoparticle Pastes
Y. Kashiwagi1, A. Koizumi2, Y. Takemura3, S. Furuta4, M. Yamamoto1, M. Saitoh1, M. Takahashi1, T. Ohno1, Y. Fujiwara2, K. Murahashi3, K. Ohtsuka3, M. Nakamoto1, 1Osaka Municipal Technical Research Institute, 2Osaka University, 3OKUNO CHEMICAL INDUSTRIES, 4Tomoe Works / Japan

TB2-2 <Session Invited>
Latest Printing Materials for Printed Electronics
Kaori Eguchi, Masako Hinatsu, Hiroyuki Satou, JNC Petrochemical / Japan

TB2-3
Reacting Thick-Film Copper Conductive Inks with Photonic Curing
V. Akhavan, K. Schroder, D. Pope, I. Rawson, A. Edd, S. Farnsworth, NovaCentrix / USA

TB2-4 <Session Invited>
Theoretical Consideration of Micro Droplet Formation in a Piezo Inkjet
Shinri Sakai, The University of Tokyo / Japan		 TC2:Advanced Packaging-2

TC2-1
Memory On Reversed Package (MOrP): A Novel Packaging Solution
Howe Yin Loo, Intel Microelectronics / Malaysia

TC2-2
Fabrication and Evaluation of Thin Embedded LSI Chip Package for the Package-on-Package Structure by Using LSI and Package Co-design Methodology
Daisuke Ohshima, Kentaro Mori, Yoshiki Nakashima, Katsumi Kikuchi, Shintaro Yamamichi, NEC / Japan

TC2-3
The Predictions of Wire Sag for Semiconductor Packaging of 3-dimensional and Multi-chip Modules
H.K. Kung1, J.C. Hsiung1, J.N. Lee1, H.S. Chen1, Jan-Yee Kung2, 1Cheng Shiu University, 2National Kaohsiun University of Applied Sciences / Taiwan

TC2-4
Study of Microstructure Evolution in Nanoscale-thickness in Cu-Sn/Zn-Cu Sandwich Structure For 3D Packaging
Qingqian Li, Y. C. Chan, City University of Hong Kong, Honk Kong

Implementation of a Silicon-based LED Packaging Module with Temperature Sensor
Chingfu Tsou, Shengwei Chang, Chenghan Huang, Feng Chia University / Taiwan Cancelled

TD2: Optoelectronics-1

TD2-1
Simultaneous Optical and Electrical Connection for Optical Interconnect
Y. Taira, H. Numata, IBM Research - Tokyo / Japan

TD2-2
High Bandwidth Density and Low Power Optical MCM
M. Tokunari, Y. Tsukada, K. Toriyama, H. Noma, S. Nakagawa, IBM Research - Tokyo / Japan

TD2-3
Fabrication of Cavity-resonator-integrated Guided-mode Resonance Filter with Channel Waveguide
Junichi Inoue1, Tomonori Ogura1, Koji Hatanaka1, Kenji Kintaka2, Kenzo Nishio1, Yasuhiro Awatsuji1,
Shogo Ura1, 1Kyoto Institute of Technology, 2National Institute of Advanced Industrial Science and Technology / Japan

TD2-4
Development of Subassemblies for Active Optical Cable using 14Gbps VCSELs
Takuya Oda, Takayuki Tanaka, Teijiro Ori, Fujikura / Japan

TE2: DMR-Electrical-2

TE2-1
Electrical Design Optimization for High-bandwidth Die-to-die Interconnection in MCP Package
Jackson Kong, Bok Eng Cheah, Thim Khuen Wong, Intel Microelectronics (M) / Malaysia

TE2-2
High Speed DDR3 System Level On-Die Power Grid Design for System-On-Chip (SoC) Power Integrity
Heng Chuan Shu, Li Chuang Quek, Intel / Malaysia

TE2-3
Impact of Package Power Referencing to Multi-Gbps Serial I/O Channel Margin
Jackson Kong, Jiun Kai Beh, Darren Tan, Intel Microelectronics (M) / Malaysia

TE2-4
PDN Impedance Estimation Techniques Based on Transmission Matrix Method for Design Optimization of Wire Bonding BGA Packages
M. Toyama, M.S. Tanaka, M. Suwa, A. Nakamura, Renesas Electronics / Japan
 

Lunch

13:30-15:10
 TA3: Taiwan Session-1

TA3-1 <Session Invited>
Systemic Integration of Interconnections – from OSAT perspective
Mike Ma, Siliconware Precision Industries / Taiwan

TA3-2 <Session Invited>
IC Substrate Challenges
D.C. Hu, Unimicron / Taiwan

TA3-3 <Session Invited>
Advanced IC Substrate and Package Material
T.M. Lee, ITRI / Taiwan

TA3-4 <Session Invited>
Advanced 3D SiP/3D Integration
W.C. Lo, ITRI / Taiwan		 TB3: Printed Electronics-3

TB3-1 <Session Invited>
The Development of the High Conductive Ink with Fine Copper Particle Suitable for Low Temperature Sintering
Mitsuru Watanabe, Kiyonobu Ida, Kaoru Isobe, Ishihara Sangyo Kaisya / Japan

TB3-2
Repair for Circuit Wiring Pattern Defects Using Needle-type Dispenser System
Y. Kato, S. Takahashi, Applied Micro Systems / Japan

TB3-3 <Session Invited>
Development of a Super Precision Gravure Offset/Flexography Printing
K. Senda, T. kuwano, T. Koshibae, K. Ito, Y. Iwasaki, K. Kobayashi, Micro-Engineering / Japan

TB3-4 <Session Invited>
Joint Strength of Cu-to-Cu Joint Using Cu Nanoparticle Paste
H. Nishikawa1,T. Hirano1, N. Terada2, 1Osaka University, 2Harima Chemicals / Japan		 TC3: Interconnection-3

TC3-1
Transferring Carbon Nanotube Bumps on Polyimide as Flexible Multilayer Substrate
Masahisa Fujino1, Hidenori Terasaka1, Tadatomo Suga1, Ikuo Soga2, Daiyu Kondo2, Yoshikatsu Ishizuki2, Taisuke Iwai2, 1The University of Tokyo, 2Fujitsu & Fujitsu Laboratories / Japan

TC3-2
Carbon Nanostructures Interconnects Dedicated to RF Nanopackaging
Christophe Brun1,2, Chin Chong Yap1,3, Dominique Baillargeat1, Beng Kang Tay1,3, 1Research Techno Plaza / Singapore, 2Universite de Limoges / France, 3Nanyang Technological University / Singapore Cancelled

TC3-3
New High-Temperature-Resistant Packaging for SiC Power Devices Using Connections Formed by Nickel Electroplating
Kohei Tatsumi, Noriyuki Kato, Waseda University / Japan

TC3-4
Study of Low Temperature Cu Electrodes Bonding Based on Different Formic Acid in-situ Treatment Processes
Wenhua Yang, Masatake Akaike, Masahisa Fujino,
Tadatomo Suga, The University of Tokyo / Japan

TD3: Optoelectronics-2

TD3-1
Optimum Core Structure and Size of Polymer Optical Waveguide for On-Board and Board-to-board Interconnects
Ryota Kinoshita, Keishiro Shitanda, Takaaki Ishigure, Keio University / Japan

TD3-2
Reliability and Polarization Characteristics of Optical Devices by using Silane Modified Highly Moisture-Resistant Optical Adhesives
Seiko Mitachi1, Kazushi Kimura2, 1Tokyo University of Technology, 2The Yokohama Rubber / Japan

TD3-3
Development of a 200-kHz Swept Light Source Using a KTN Deflector and a High-speed Optical Coherence Tomography System
Yuichi Okabe1,2, Masahiro Ueno1, Yuzo Sasaki1, Takashi Sakamoto1, Seiji Toyoda1, Junya Kobayashi1, Yoshihiko Sugawa2, Akihiro Fukuda2, Masato Ohmi2, 1NTT, 2Osaka University / Japan

TD3-4
Room-Temperature Direct Bonding of GaAs and SiC Wafers for Improved Heat Dissipation in High-Power Semiconductor Lasers
Eiji Higurashi, Kaori Nakasuji, Tadatomo Suga, The University of Tokyo / Japan

TE3: DMR-Mechanical-1

TE3-1
Unique Adhesion Testing and MSL Modeling
Kentaro Takao, Masazumi Amagai, Texas Instruments, Japan / Japan

TE3-2
Cantilever Beam Tests of Flip Chip Underfill Adhesion after Surface Treatment
K. Okamoto, A. Horibe, K. Toriyama, IBM Japan / Japan


TE3-3
Multiscale Multiphysics Electromigration
Simulator Based on Ultra-Accelerated Quantum Chemical Molecular Dynamics Method
A. Miyamoto1, R. Miura1, A. Suzuki1, N. Hatakeyama1, K. Shiokawa2, M. Yamashita2, 1Tohoku University, 2Fuji Electric / Japan

TE3-4
Reliability of Electroless Nickel Immersion Gold Finishes
John Roller, Bhanu Sood, Michael Pecht, University of Maryland / USA
 

Poster Session / Break

15:40-17:45
 TA4: Korea Session-1

TA4-1
Simulation and Measurement of the Warpage for the Package-on-Package with Variations of Epoxy Molding Compounds and Process Variables
Dong-Myung Jung1, Min-Young Kim1, Hyouk Lee2, Carlos Moraes3, Guilherme Vaccaro3, Tae-Sung Oh1, 1Hongik University, 2Hana Micron / Korea, 3Unisinos University / Brazil

TA4-2
Effects of Bath Conditions and Operating Parameters on Electroless Nickel-Iron Alloy Plating for UBM Applications
Myung-Won Jung1, Jae-Ho Lee1, Sung K. Kang2, 1Hongik University / Korea, 2IBM / USA

TA4-3
The Effect of Low Temperature Soldering using Sn-In Addition in Sn-Ag-Cu Solder on the Board Level Package
Jeewon Chung, Chanho Bu, Sunam Jang, Jee Hyung Ryu, Seokwoo Jeon, Kwangyu Byun, SK Hynix / Korea

TA4-4
Analysis of Electrical and Mechanical Characteristics of Screen-Printed Cu Circuit with Its Fracture Structure
Kwang-Seok Kim1, Wataru Takahara2, Seung-Boo Jung1, 1Sungkyunkwan University / Korea, 2Osaka University / Japan

TA4-5
Heat treatment Effects on Electroplated Nanocrystal
Y.B. Sun, Kyonggi University / Korea

Design and Fabrication of an Organic High Density Interconnection Substrate with Ultra Fine Pattern
Christian Romero, Dongwhan Lee, Seungwook Park, Mijin Park, Youngdo Kweon, Samsung Electromechanics / Korea Cancelled		 TB4: Printed Electronics-4

TB4-1 <Session Invited>
CAD to BMP Conversion Software for Inkjet Printing on Flexible Substrates
Masaaki Oda1, Kenya Uwaya2, 1ULVAC, 2Zuken / Japan

TB4-2
Development of Solution Processed Inorganic Flexible Thin-Film Transistor
T. Matsumoto, S. Komatsu, T. Ichiryu, T. Ogura, K. Hirano, T. Suzuki, Panasonic / Japan

TB4-3
Low Temperature Co-Fired High Current Multilayer Ferrite Inductor
Mean Jue Tung, W.S. Ko, Y.T. Haung, S.Y. Tong, M.D. Yang, ITRI / Taiwan

Influence of Semi-Additive Respective Subtractive Process on Etch Factor and Characteristic Impedance of PWB Trace
Arash Risseh, Rikard Qvarnstrom, Jerker Delsing, Lulea University of Technology / Sweden Cancelled


                           (16:55)		 TC4: Interconnection-4

TC4-1
iNEMI Cu Wire Bonding Project Update on Technology Investigation Reliability Test with Concerns
Masahiro Tsuriya1, Andy Tseng2, JoonSu Kim3, 1International Electronics Manufacturing Initiative, 2ASE / USA, 3Amkor Technology Korea / Korea

TC4-2
Cu Wire-bonding for 28 nm Wafer Technology
Bryan Lin1, Louie Huang1, Andy Tseng2, Shoji Uegaki3, 1ASEKH / Taiwan, 2ASEUS / USA, 3ASEJP / Japan,

TC4-3
A Comparison Study on Interconnection with Using Cooper and Silver Wires in Wedge Bonding for High Temperature Power Devices
Zhou Yu, Kohei Tastumi, Waseda University / Japan

TC4-4
VUV/O3 Treatment for Reduction of Au-Au Bonding Temperature
Akiko Okada1, Masatsugu Nimura1, Akitsu Shigetou2, Katsuyuki Sakuma3, Jun Mizuno1, Shuichi Shoji1, 1Waseda University, 2National Institute for Materials Science / Japan, 3IBM / USA

TC4-5
An Investigation on Nanoscale Tensile Mechanical Properties for Pd-coated Copper Wire
H.C. Hsu1, J.H. Chien1, L.M. Chu1, S.P. Ju2, Y.T. Feng2, S.L. Fu1, 1I-Shou University, 2National Sun Yat-Sen University / Taiwan		 TD4: Optoelectronics-3

TD4-1 <Session Invited>
LED & SSL Packaging Trends View by x-ray Imaging
Tetsuya Onishi, Grand Joint Technology / Hong Kong

TD4-2
LED Wafer Level Packaging with a Heimisphrical Waffle Pack Remote Phosphor Layer
Huihua Liu, Jeffery C.C.Lo, S.W. Ricky Lee, Huishan Zhao, Hong Kong University of Science & Technology / Hong Kong

TD4-3
High Bright White LED Packaging System Using Unique Vacuum Printing Technology (VPES)
Atsushi Okuno, Yoshiteru Miyawaki, Dongxu Wang, Osamu Tanaka, SANYU REC / Japan

TD4-4
Shape and Structure of Conductive Polymeric Electrospinning Nanofiber
Chih-Hao Hsu, Jheng-Jhih Pan, Cho-Liang Chung, Sheng-Min Hung, Sheng-Li Fu, I-Shou University / Taiwan

TD4-5
Routine Thermal Eeasing Procedure and Annealing Effects on Photoelectronic Property of Conductive Polymers
Yu-hsuanLin, Yi-Shiang Chen, Cho-Liang Chung, Yi-Jiun Huang, Sheng-Li Fu, I-Shou University / Taiwan

TE4: DMR-Electrical-3

TE4-1
Multi Chip Package Power Integrity Design for High Speed High Power Density SoC Design
Quek Li Chuang, Ong, Paik Wen, Chew Hon Wah, Shu Heng Chuan, Intel Microelectronics (M) / Malaysia

TE4-2
Open Defect Detection in Assembled PCBs by Supply Current Testing with Electrodes Embedded inside ICs
Akira Ono1, Hiroyuki Yotsuyanagi2, Masao Takagi1, Masaki Hashizume2, 1Kagawa National College of Technology, 2The University of Tokushima / Japan

TE4-3
Fine Pitch Multilayer Board with CPW Structure
Ki Jae Song, Il Won Park, Hyuk Kwon, Samsung Electronics / Korea

TE4-4
EMC Mitigation Impacts on USB 3.0 Signaling
Florence Phun1, Dong-Ho Han2, Ho Kah Wai1, Jon Schenk2, Howard Heck2, 1Intel Microelectronics (M) / Malaysia, 2Intel / USA

TE4-5
Electromagnetic Band Gap Structure in 3-D Stacked Printed Circuit Board
Tadahiro Sasaki, Hiroshi Yamada, Tooru Kijima, Mitsuru Otani, Kazuhisa Imura, Toshiba / Japan

*DMR: Design, Modeling and Reliability


April 12

A

B

C

D

E

9:10-10:50
 FA1: 3DIC Packaging-3

FA1-1 <Session Invited>
3DIC Architectures for Next Generation High Performance/Low-Power Computing
Koji Inoue, Kyusyu University / Japan

FA1-2
Investigation of Program-Voltage Generator Integration for ReRAM and NAND Flash Memory Hybrid Three-Dimensional Solid-State Drive
Teruyoshi Hatanaka1,2, Koh Johguchi1, Ken Takeuchi1, 1Chuo University, 2The University of Tokyo / Japan

FA1-3
System Design Method of 3D System LSI from System Definition Model with Automatic SDSI-Cubic
Yoshiharu Iwata, Hidenori Murata, Ryouhei Satoh, Koichiro Atsumi, Kazuya Okamoto, Osaka University / Japan

FA1-4
Testing Method of Wide Bus Chip-to-Chip Interconnection for 3D LSI Chip Stacking System
Masahiro Aoyagi1, Fumito Imura1, Shunsuke Nemoto1, Naoya Watanabe1, Fumiko Kato1, Katsuya Kikuchi1, Hiroshi Nakagawa1, Michiya Hagimoto2, Hiroyuki Uchida2, Yukoh Matsumoto2, 1National Institute of Advanced Science and Technology, 2TOPS Systems / Japan		 FB1: Substrates and Interposers-1

FB1-1 <Session Invited>
Si Interposers with Integrated Passives for Power Integrity Applications
Koichi Takemura, NEC / Japan

FB1-2
TSV Interposer Fabrication with 300 mm Wafer for 3D Packaging
Seiichi Yoshimi1,2, Koji Fujimoto1,2, Miyuki Akazawa1,2, Hidenobu Matsumoto1, Hiroshi Mawatari1, Kousuke Suzuki1, Hideki Takagi2,3, Ryutaro Maeda2,3, 1Dai Nippon Printing, 2Advanced Industrial Science and Technology / Japan

FB1-3
Integrated Meander Resistor in Printed Circuit Board Manufacturing
Rikard Qvarnstrom, Lulea University of Technology / Sweden  Cancelled

FB1-4
Via Formation Process to Form the Smooth Copper Wiring Using Adhesion Layer
S. Sasaki, M. Tani, Fujitsu Laboratories / Japan		 FC1: Materials and Processes-2
（9：35）

FC1-1
Maskless Electroplating of Copper on Diamond-like Carbon Films Modified by
Scanning Probe Method
Shigehiro Hayashi, Woon Choi, Hajime Tomokage, Fukuoka University / Japan

FC1-2
The MB-3000 High-speed Microbump Height Measurement System using High-precision Stereoscopy
Kazuyoshi Suzuki, Toray Engineering / Japan

FC1-3
Electrically Conductive and Insulative Inks for Additive Printing Process in Smart Textile Applications
Masahiro Inoue1, Yasunori Tada1, Tomohiro Tokumaru2, 1Gunma University, 2Bio Signal / Japan		 FD1: RF-1

FD1-1
A 36 W Wireless Power Transfer System with an 82% Efficiency for LED Lighting Applications
W. Chen1, R. A. Chinga2, S. Yoshida3, J. Lin2, C. Hsu1, 1Industrial Technology Research Institute / Taiwan, 2University of Florida / USA, 3NEC / Japan

FD1-2
Novel System Design for both Wireless Power Supply and Communication through Two-dimensional Wave-guiding Sheet
Keishi Kosaka, Hiroshi Fukuda, Koichiro Nakase, Naoki Kobayashi, Akira Miyata, Toshinobu Ogatsu, NEC / Japan

FD1-3
Radiation Noise Reduction Technique from Power Supply Layers in PCB Using Resistors
Hitoshi Takakura, Shinichi Sasaki, Saga university / Japan

FD1-4
Reduction Technique for Power Supply Noise of Analog-Digital Mixed Circuit Boards -Adjustment of Attached Resistor Method-
Shunsuke Baba, Shinichi Sasaki, Hiroaki Matsumoto, Saga University / Japan		 FE1: DMR-Mechanical-2
（9：35）

FE1-1
Evolution of Bulk and Interfacial Microstructure of SAC305 Solders on ENIG/Cu Pads under Isothermal Aging
Preeti Chauhan, Mei-Ling Wu, Michael Osterman, Michael Pecht, University of Maryland / USA

FE1-2
Ultra-Accelerated Quantum Chemical Molecular Dynamics Simulation of Atomic Level Stability of Solder Materials
N. Hatakeyama1, R. Miura1, A. Suzuki1, K. Shiokawa2, M. Yamashita2, A. Miyamoto1, 1Tohoku University, 2Fuji Electric / Japan

FE1-3
A New Reference Area for Indentation Creep Tests to Obtain Real Steady Creep Strain of Solder Alloy
Atsuko Takita1, Katsuhiko Sasaki1, Ken-ichi Ohguchi2, 1Hokkaido University, 2Akita University / Japan
 

Break

11:00-12:40
 FA2: 3DIC Packaging-4

FA2-1
Study of Low Load and Temperature Solid-Phase Sn-Ag Bonding with Formation of High Heat-Resistant Ag3Sn Intermetallic Compound Via Nanoscale Thin Film Control for Wafer-Level 3D-Stacking for 3D LSI
Kiyoto Yoneta, Ryohei Sato, Yoshiharu Iwata, Koichiro Atsumi, Kazuya Okamoto, Yukihiro Sato, Osaka University / Japan

FA2-2
Optimization of High Thermal Conductive ICF for 3D-IC through Pre-applied Process
Y. Kawase1, M. Ikemoto1, M. Yamazaki2, H. Kiritani1, F. Mizutani1, K. Matsumoto3, A. Horibe3, H. Mori3, Y. Orii3, 1Mitsubishi Chemical, 2Mitsubishi Chemical Group Science and Technology Research Center, 3IBM Japan / Japan

FA2-3
Assembly of 3D-Stacked Chip Architecture with 30μm Pitch Micro Bump Interconnections Using Paste-type and Sheet-type Adhesive Materials
Yu-Wei Huang, Jing-Ye Juang, Chau-Jie Zhan, Yu-Min Lin, Shin-Yi Huang, Chia-Wen Fan, Su-Ching Chung, Jon-Shiou Peng, Su-Mei Chen, Yu-Lan Lu, Pai-Cheng Chang, Mei-Lun Wu, Tao-Chih Chang, ITRI / Taiwan

FA2-4
Chip-to-Wafer 3D Stacking Using Self-Assembly and Electrostatic Temporary Bonding/Debonding
H. Hashiguchi, T. Fukushima, J. Bea, H. Kino, K.-W. Lee, T. Tanaka, M. Koyanagi, Tohoku University / Japan		 FB2: Biomimetics

FB2-1 <Session Invited>
Mechanisms and Models for Bio-Mimicry Design of Grip-and-release Devices
K. Takahashi, S. Saito, P. Hemthavy, Y. Sekiguchi, Tokyo Institute of Technology / Japan

FB2-2
Reversible Interconnection Learning from Beetles
Naoe Hosoda, National Institute for Material Science / Japan

FB2-3
Continuous Roll Imprinting of Moth-Eye Antireflection Surface Using Anodic Porous Alumina
Y. Uozu, Mitsubishi Rayon / Japan

FB2-4
Development of the Sirocco Fan Featuring the Dragonfly Wing Characteristics
Yui Kumon, Masaki Otsuka, SHARP / Japan		 FC2: Materials and Processes-3

FC2-1
Direct EP/EPAG - A Revolutionary Surface Finish for Electronic Packaging
Mustafa Oezkoek, Guenter Heinz, Atotech Deutschland / Germany

FC2-2
Ag Nanoparticle Catalyst for Electroless Plating: Its Adsorption and Activation at Polymer Substrates
Yutaka Fujiwara, Yasuyuki Kobayashi, Shingo Ikeda, Osaka Municipal Technical Research Institute / Japan

FC2-3
Latest Additive of Acid Copper Plating for PWB, Designed for Higher Current Density
Toshimitsu Nagao, Yuuhei Kitahara, Shingo Nishiki, Okuno Chemical Industries / Japan

FC2-4
Adsorption and Desorption Kinetic Study of Organic Additives during Copper Electrodeposition by Microfluidic Reactor
Takeyasu Saito, Yuichi Tsujimoto, Yutaka Miyamoto, Naoki Okamoto, Kazuo Kondo, Osaka Prefecture University / Japan

FD2: RF-2

FD2-1
A UWB Antenna Built into 3G Smart Phone
Yusuke Akiyama1, Fukuro Koshiji1,2, Kohji Koshiji2, 1Kokushikan University, 2Tokyo University of Science / Japan

FD2-2
A Study on EM Radiation from Shielded-Flexible Flat Cable for Interconnection
Yoshiki Kayano, Ryo Uesugi, Hiroshi Inoue, Akita University / Japan

FD2-3
Electromagnetic Simulation of Printed Circuit Board Adjacent to Conductor Using Equivalent Model Focusing on Common-mode
Y. Wakaduki1, Y. Toyota1, K. Iokibe1, R. Koga1, T. Watanabe2, 1Okayama University, 2Industrial Technology Center of Okayama Prefecture / Japan

FD2-4
Mold-based Compartment Shielding Investigation for SiP Modules
Liao Kuo-Hsien, Alex,Chi-Hong,Chan, Shen Chia Hsien, Lin,I-Chia, Huang Hsin Wen, Advanced Semiconductor Engineering / Taiwan

FE2: DMR-Mechanical-3

FE2-1
Multiscale Modeling of Anisotropic Creep Response of Heterogeneous Single Crystal SnAgCu Solder
S.Mukherjee, A.Dasgupta, University of Maryland / USA

FE2-2
Board Level Reliability and Assembly Process of Advanced Fine Pitch QFN Packages
Li Li1, Brian Smith2, Joe Smetana3, David Geiger4, Chris Katzko5, Jeffrey ChangBing Lee6, Richard Coyle3, Alex Chan3, 1Cisco Systems, 2HDP User Group International, 3Alcatel-Lucent, 4Flextronics / USA, 5TTM Technologies / China, 6IST-Integrated Service Technology / Taiwan

FE2-3
Bonding Properties between Cu Wire and Al Pad in Microelectronics Packaging after Stress Test
Y. Ishida, A. Shinomiya, T. Akaboshi, N. Ota, S. Yamashita, Yaskawa Electric / Japan

FE2-4
Accelerated Failure of Microjoints Caused by the Thermal Expansion of Underfill Material within a Chip Stacking Architecture
Shin-Yi Huang, Jing-Yao Chang, Ren-Shin Cheng Tao-Chih Chang, Industrial Technology Research Institute / Taiwan
 

Lunch

13:30-15:45
 FA3: Korea Session-2

FA3-1
Development of SDRAM Package Module for Satellite
Hyouk Lee1, Jinwook Jeong1, Jangsoo Chae2, Miyoung Park2, 1HanaMicron, 2SaTRec (Satellite Technology Research Center) / Korea

FA3-2
Epoxy Copper Paste as an Isotropic Conductive Adhesive
Yong-Sung EOM, Hyun-Cheol Bae, Kwang-Seong CHOI, Electronics and Telecommunications Research Institute / Korea

FA3-3
Low-Temperature Flip Chip Process for Stretchable Electronic Packaging
Jung-Yeol Choi1, Jae-Hwan Kim1, Kwan-Jae Shin1, Yong-Ki Sohn2, Tae-Sung Oh1, 1Hongik University, 2Electronics and Telecommunications Research Institute / Korea

FA3-4
Study of Mechanical Properties in Package Substrate According to Base Materials
Han-Sung Lee, Young-Joo Ko, Yong-Bin Lee, Youn-Kyung Jung, Daeduck Electronics / Korea

FA3-5
Electrical Properties of Organic Solar Cells with LiF Buffer Layers
Kun Ho Kim1, Seung Ho Kim1, Young Chul Chang2, Ho Jung Chang1,1Dankook University, 2Korea University of Technology and Education / Korea		 FB3: Medical Devices
<with Panel Session>

FB3-1
A Characteristic Evaluation of a Conductive Ink Wire Suited for Measuring the Biological Signal
Y. Tada1, M. Inoue1, T. Tokumaru2, 1Gunma University, 2Osaka Medical College/ Japan

FB3-2
Soft Contact-lens Type Sensing Device for Tear Glucose Monitoring
K. Mitsubayashi, Tokyo Medical and Dental University / Japan

FB3-3
Implantable CMOS Devices for Biomedical Applications
Jun Ohta, Nara Institue of Science and Technology / Japan

FB3-4
2D-realtime Analysis of Neuro-functions and Degenerations by an Ion Image Sensor-based Chemical Microscopy
Takashi Sakurai, Kazuaki Sawada, Toyohashi University of Technology / Japan

FB3-5
Investigation of a Wireless Body Area Communication Using Electromagnetic Resonance Coupling
Fukuro Koshiji1,2, Nanako Yuyama1, Kohji Koshiji2, 1Kokushikan University, 2Tokyo University of Science / Japan

FB3-6
Development and Study of Electrical Property on Phantom for Human Body Communication Considering Tissue Structure of Human Arm
D. Muramatsu1, F. Koshiji2, K. Koshiji3, K. Sasaki1, 1The University of Tokyo, 2Kokushikan University, 3Tokyo University of Science / Japan

Panel discussion (approx. 50 min.)
There will be a break during the panel session.         (17:00)

Development of Medical Devices for Minimally Invasive Diagnosis and Therapy Using Micro/Nano Fabrication Technology
Yoichi Haga, Tohoku University / Japan Cancelled

 FC3: Materials and Processes-4

FC3-1
Warpage Behavior of Multi-tier Stacking in 2.5D/3D Package under Different Joining Process Conditions
Takashi Hisada, Kazushige Toriyama, Toyohiro Aoki, Yasuharu Yamada, IBM Japan / Japan

Development of Epoxy/Mica Nanocomposites Formed Through Exfoliation of Mica Layer Treated by Different Types of Long-Chain Alkylamine
Nobutake Tsuyuno1,2, Shogo Nakai1, Akira Irifune1, Mitsukazu Ochi1, 1Kansai University, 2Hitachi / Japan Cancelled

FC3-2
Development of Encapsulated Resin Materials for Power Semiconductor Devices
Y. Ishikawa, K. Dohi, K. Ueno, T. Takao, Sanyu Rec / Japan

FC3-3
Adhesion Improvement of Epoxy Underfill to Polyimide Passivation Layers
Toshiyuki Sato1, Pawel Czubarow2, David Son3, 1NAMICS / Japan, 2eM-TECH, 3Southern Methodist University / USA

FC3-4
A Novel Halogen-free and Reworkable Capillary Flow Underfill for Lead-free Fine Pitch Area Array Package Applications
Hongbin Shi1, Cuihua Tian1, Michael Petch2, Toshitsugu Ueda1, 1Waseda University / Japan, 2University of Maryland / USA

FC3-5
Alkaline Developable Film Type Photoresist Material for Solder Paste Printing and Reflow Process
Daisuke Kanamori1, Takuro Oda1, Michiko Yamaguchi1, Kazuyuki Matsumura1, Toshihisa Nonaka1, Yoshinori Miyamoto2, Hajime Hirata2, 1Toray Industries, 2Toray Engineering / Japan

FD3: Thermal Management-3

FD3-1
Direct Liquid Immersion Cooling of Power LEDs by an Injection Molded Substrate with Fluidic Features
T. Leneke, S. Hirsch, B. Schmidt, Otto-von-Guericke-University / Germany

FD3-2
Thin Heat-Management Solutions for Advanced Packaging
R. Singh, M.S. Ahamed, M. Mochizuki, Y. Saito, K. Mashiko, Fujikura / Japan

FD3-3
Single-phase and Two-phase Flow Heat Transfer Performances of Minichannel Finned Heat Sink under High Heat Flux Conditions
K. Yuki, S. Kiuchi, K. Suzuki, Tokyo University of Science, Yamaguchi / Japan

FD3-4
Thermal Management of Dust-Proof ICT Systems
H. Sakamoto, A. Shojiguchi, M. Chiba, M. Yoshikawa, NEC / Japan

FD3-5
Energy-Efficient Technology for Data Centers Using Phase Change Cooling Units
Arihiro Matsunaga, Kenichi Inaba, Minoru Yoshikawa, NEC / Japan

FE3: Power Devices

FE3-1
Electrical Characteristics and Reliability Performance of IGBT Power Module by Chip Embedding Technology
Yin-Po Hung, Sheng-Che Hung, Ren-Shin Cheng, Fang-Jun Leu, Jing-Ye Juang, Shang-Wei Chen, Chao-Kai Hsu, Tao-Chih Chang, Industrial Technology Research Institute / Taiwan

FE3-2
Interfacial Properties of IGBT Module with IBP Bonding in Electronic Vehicles
A Young Kim1, Won Sik Hong1, Sung Min Park2, Young Pyong Kim2, Dong-Keun Jang2, Yong-Mo Kim3, 1Korea Electronics Technology Institute,2LS Industrial Systems, 3Korea Instrument / Korea

FE3-3
The Solder Creep Behavior of Power Module Subject to Temperature Cycling Test with Different Temperature Profiles
H.C. Huang1,2, T. Y. Hung1,2, C.C. Wang3, K.C. Lu3, K.N. Chiang1,2, 1Advanced Microsystem Packaging and Nano-Mechanics Research Lab, 2National Tsing Hua University, 3DELTA Electronics / Taiwan

FE3-4
Transfer Molding Compounds for Power Electronic Applications - A Qualification Methodology for HT Capable Materials
T. Braun1, K.-F. Becker1, M. Koch1, T. Thomas2, T. Amende1, T. Schreier-Alt1, V. Bader1, J. Bauer1, R. Aschenbrenner1, M. Schneider-Ramelow1, K.-D. Lang2, 1Fraunhofer Institute for Reliability and Microintegration, 2Technical University Berlin / Germany

FE3-5
Failure Mode Analysis of Electrical Double Layer Capacitors Subjected to Electrical and Thermal Stresses
Masaki Moriyama1,2, Anto S. Peter1, Michael H. Azarian1, Michael Pecht1, 1University of Maryland / USA, 2Kyoto University / Japan
 

Break

Break

15:45-17:25
 FA4: Taiwan Session-2

FA4-1
Board Level Drop Impact Assessment of 3D Chip-on-Chip Packages
Hsien-Chie Cheng1, Hsin-Kai Cheng2, Wen-Hwa Chen2, Tzu-Hsuan Cheng2, Su-Tsai Lu3, Jing-Ye Jung3, 1Feng Chia University, 2National Tsing Hua University, 3Industrial Technology Research Institute / Taiwan

FA4-2
Nanoscale Interfacial Frictional Behavior on Copper-Aluminum Intermetallic Compound
H.C. Hsu, L.M. Chu, J.H. Chien, C.Y. Wang, S.L Fu, M.S. Bair, I-Shou University / Taiwan

FA4-3
Characterization of Hot-spot Effect on a Chip Embedded with TSVs
Ra-Min Tain, Ming-Ji Dai, Li-Ling Liao, Chih-Sheng Lin, Yu-Chien Hung, Shyh-Shyuan Sheu, Wei-Chung Lo, ITRI / Taiwan

FA4-4
Thermal Management for 3D-WLCSP Package
Jia-Shen Lan, Mei-Ling Wu, National Sun Yat-Sen University / Taiwan		 FC4: Interconnection-5

FC4-1
IMC Growth of Solder Capped Cu Pillar Bump Interconnection during Electromigration Test
H. Noma, K. Toriyama, S. Kohara, Y. Orii, IBM Japan / Japan

FC4-2
Interfacial Reaction between Solder Filled TSV and Ti/Cu UBM
Young-Ki Ko1,3, Myong-Suk Kang1,2, Hiroyuki Kokawa3, Yutaka S. Sato3, Sehoon Yoo1, Chang-Woo Lee1, 1Korea Institute of Industrial Technology, 2University of Science and Technology / Korea, 3Tohoku University / Japan

FC4-3
Crack Formation and Propagation Mechanisms in Interfacial Cu6Sn5
Kazuhiro Nogita1, Dekui Mu1, Stuart D. McDonald1, Jonathan Read1, Keith Sweatman1,2, 1The University of Queensland / Australia, 2Nihon Superior / Japan

FC4-4
Effects of the Properties of Ni-P Films on Black Pad Formation after the ENIG Process
K.D. Kim, Jin Yu, Korea Advanced Institute of Science and Technology / Korea		 FD4: Thermal Management-4

FD4-1
Thermal Conductivity and its Evaluation in Various Types of Polymer Composites with Fillers
Y. Agari, H. Hirano, J. Kadota, A. Okada, Osaka Municipal Technical Research Institute / Japan

FD4-2
Experimental Verification of the Relationship between Isothermal Surface and Structure Function
Yafei Luo1, Masaru Ishizuka2, Tomoyuki Hatakeyama2, 1Mentor Graphics Japan, 2Toyama Prefectural University / Japan

FD4-3
Flow and Thermal Resistance Network Analysis of Fan Cooled Thin Enclosure
T. Fukue1, T. Hatakeyama2, M. Ishizuka2, K. Horose1, K. Koizumi3, 1Iwate University, 2Toyama Prefectural University, 3Cosel / Japan

                           (17:00)

 

*DMR: Design, Modeling and Reliability


Poster Session


P01 Using Electromagnetic Band-gap Structure to Eliminate Frequency Multiplication Noise and Implement 3D Band-pass Filter on Testing Load Board
       Guan-Min Wang, Yu-Chi Kuo, Wen-Te Chien, Sung-Mao Wu, National University of Kaohsiung / Taiwan

P02 Halogen-Free Substrate Materials with High Thermal-Resistant and High Thermal Conductivity 
       Kuo-Chan Chiou, Feng-Po Tseng, Lu-Shih Liao, Kuei-yi Chuang, Industrial Technology Research Institute / Taiwan

P03 Analysis of the Temperature Effect on the Liquid Bridge Behavior Between Fixed Plates for the Heat Switch System
       Su-Heon Jeong1, Wataru Nakayama2, Sung-Ki Nam1, Sun-Kyu Lee1,
        1Gwangju Institute of Science and Technology, 2Thermtech International / Korea

P04 Surface Modification of Polyimide Films by the Remote Plasma for Enhance the Adhesion Strength with Epoxy Molding Compounds
       Chih-Feng Wang1, Jian-Yi Wu1, Yi-Shao Lai2, Ping-Feng Yang2, Chun-Liang Kuo2,
         1I-Shou University, 2Advanced Semiconductor Engineering /  Taiwan

P05 Developing a Lignin-based Resin for FCCL
       Wei-Ta Yang, Li-Ming Chang, Industrial Technology Research Institute / Taiwan

P06 The Study of Angular Color Temperature Variation for Various Package Structures of White LED Package
       S. F. Hu1, C. L. Chang Chien1,2, Z. H. Yang1, C. M. Chang1, C. P. Hsu1, Ming-Chuen Yip2, Weileun Fang2,
         1Advanced Optoelectronic Technology, 2National Tsing Hua University / Taiwan.

P07 Development of Space Free LED Module for Luminous Flux Improvement via Non-harden Type Encapsulant Material Filling
       Hao-Xiang Lin1, Ming-Ta Tsai1,2, Chien-Lin Chang Chien1, Min-Shun Yang1, Chung-Min Chang1, Chih-Peng Hsu1, Wei-I Lee2,  
       1Advanced Optoelectronic Technology, 2National Chiao Tung University / Taiwan

P08 A CMOS Inverter Detector for Package High-Speed Characteristics Testing
       Wei-Chi Chen, Yu-Yung Wu, Yuan-Ming Wu, Sung-Mao Wu, National University of Kaohsiung / Taiwan

P09 Simplified VRM Modeling Proposal for Signal and Power Integrity Analysis
       Mitsuharu Umekawa, Agilent Technologies Japan / Japan

P10 A Fault Detection Methodology for a Multipoint-Differential Cabling System
       T. Kuwahara1, T. Kobayashi1, H. Joba1, Y. Akeboshi1, S. Saito2, 1Mitsubishi Electric, 2Salesian Polytechnic / Japan

P11 Using for Three-dimensional Broadband Double-side Direct Thru Kit with Non-exchange Layer Design and Analysis
       Wen Yi Ruan, Ting-Han Chien, Lung-Shu Huang, Sung-Mao Wu, National University of Kaohsiung / Taiwan

P12 A Proposal of New Electrode Structure for Intra-Body Communication
       Takaaki Fujisawa1, Fukuro Koshiji1,2, Kohji Koshiji2, 1Kokushikan University, 2Tokyo University of Science / Japan

P13 Fabrication of PTFE Micro Fluidic Chip for Amino Acid Derivatization Process 
       Hideki Kido1, Ikuo Okada2, Hajime Mita3, A. Yamaguchi1, Yuichi Utsumi1, 
      1University of Hyogo, 2Nagoya University, 3Fukuoka Institute of Technology / Japan

P14 Microfluidic Devices with SERS Active Three-dimensional Gold Nanostructure 
       Ryo Takahashi, T.Fukuoka, Y.Utsumi, A.Yamaguchi, University of Hyogo / Japan

P15 Three-dimensional Silver Nanostructure for Surface Enhanced Raman Scattering 
       Ryohei Hara, R.Takahashi, T.Fukuoka, Y.Utsumi, University of Hyogo / Japan

P16 Proposal of a Novel Internally-Triggered Automatic Flow Sequencing on Centrifugal Microfluidics 
       M. Ishizawa1, H. Nose1, Y. Ukita2, Y. Utsumi1, 1University of Hyogo, 2Japan Advanced Institute of Science and Technology / Japan

P17 Needle-type Dispenser System
       Y. Kato, Applied Micro Systems / Japan



    Through Silicon Vias Design Using the Scattering Matrix
       You-Yi Chen, Mei-Ling Wu, National Sun Yat-Sen University / Taiwan Cancelled

     Thermo-Mechanical Stress of Underfilled 3D IC Packaging
       Ming-Han Wang, Mei-Ling Wu, National Sun Yat-Sen University / Taiwan  Cancelled

     Cu/Ni/SnAg Microbump Bonding Processes for 30μm Pitch Thin-Chip-on-Chip Package Using a Wafer-Level Underfill Film
       Chang-Chun Lee, Tzai-Liang Tzeng, Chung Yuan Christian University / Taiwan Cancelled

 

 

 

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