Sessions and Keywords: |
| 1. Advanced Packaging Wafer Level Packaging, System Integration, PoP, MCM, System on Package, Novel Assembly Technologies |
| 2. Substrate and Interposers Laminates, Interposers, Fine Pitch, Build-up Substrates, Flexible Printed Circuits, Embedded, Conductive Paste, Thin Core, Coreless, Low CTE |
| 3. Interconnection Bump Formation, Chip-Package Interaction, Low k, Leadframe, Test of First- and Second- Level Interconnections, Interconnections for 3D Integration, Interconnections in Substrates, PCBs and Systems |
| 4. 3DIC Packaging TSV, Via Formation and Filling, 2.5D, Wafer Thining, Silicon Stacking, Chip on Chip, Chip on Wafer, Wafer on Wafer, Wide Bus, Wireless Interconnection, Temporary Bonding/De-Bonding |
| 5. Design, Modeling, and Reliability Signal and Power Integrity, High Speed Board Design, Mechanical Design and Reliability, Failure Analysis, Fracture and Warpage in Packages, Testing, Evaluation, TCAD, 3DIC Design |
| 6. Thermal Management Advanced Cooling Modules, Heat Pipes, Heat Sinks, Fans and Blowers, Thermal Interface Materials, Thermal Measurements, Micro and Nano Scale Heat Transfer, Thermal Issues in Devices |
| 7. Materials and Process Novel Materials and Processing, Dielectrics, Emerging Materials and Processes for 3D, Thin Films, Underfills, Assembly Challenges and Solutions, Wefer Thinning, Plating, Equipment, Encapsulation |
| 8. Printed Electronics Inkjet, Screen Printing, Conductive Wiring, Insulation, Printed Organic TFTs, Device Applications |
| 9. N-MEMS NEMS-MEMS/Sensor Devices, MOEMS, Assembly and Packaging, Nano Technology, Nano Imprint Lithography, Organic Semiconductors, Wireless Sensor Networks |
| 10. Optoelectronics Active Optical Cable, Photonic Devices, Optical Fibers, Waveguides, Optical Interconnects, Transceivers, Connectors, LD/PD, LED, OE/EO, TOSA/ROSA, WDM, Optical Wiring Boards |
| 11. Self-Organization/Self-Assembly Biomimetic, Nature-Guided, Bottom-up Manufacturing, Smart Materials and Devices, Spontaneous Ordering/Patterning/Structuring, Self-Bonding/Debonding, Repairable, Self-Healing, Novel Micro/Nano Processing |
| 12. Power Devices Power Electronics, Power Devices, Automotive Electronics, ECUs, Sensors, Lead Free Solder, Wire Harness, Energy Harvesting |
| 13. RF RFID, High Frequency Devices, Packaging, Filters, EMI, EMC, Antennas, Wireless Power Transmission |
| 14. Others Market Trends, Environmentally Conscious Products and Processes, Cost Analyses |
