With great honor and pleasure, we, the conference committee,
welcome you to the 13th International Symposium on Electronics Packaging
(ICEP2013) held in Osaka. ICEP is the premier international conference
covering wide ranges of "Jisso", such as advanced
semiconductor/electronics packaging, new materials, fabrication process,
modeling/simulation, and applications. Both academic and industry
professionals come together annually from all over the world. Since 1980,
started as IMC, the impact of this conference has significantly grown up
on electronics packaging field.
Following the successful meetings
in Sapporo(2010), Nara(2011), and Tokyo(2012), the ICEP is proudly held in
Osaka for the first time of its history from April 10 to 12, 2013, the
best season of cherry blossoms. Osaka is not just only the second largest
city in Japan, but also has successful history as the center for
international trade and cultural interactions. In the 7th century, the
oldest palace, Naniwa-no-miya" was built. During the 17th century, Osaka
became the center for trade, thanks to the city's resourceful and
enterprising merchants. In the Edo period of the 19th century, Osaka
drastically developed as the gourmet city, "Kitchen of the Nation".
Besides these, Osaka features the beautiful Osaka Castle, many traditional
Buddhist temples, convenient access to Kyoto, Nara, and Kobe, and of
course, friendly people with the best sense of humor in Japan.
Last year, ICEP2012 was jointly held with IMAPS All Asia
Conference(IAAC) for the first time, and had many discussions for three
and half days, including the Global Business Council, and IAAC special
session. This year, ICEP2013 will return to the usual program schedule as
three days with keynote speeches, technical sessions and reception. It is
great pleasures for us, the conference committee, to invite three keynote
speakers, Dr. Subramanian S. Iyer, IBM, Dr. Takeshi Uenoyama, Panasonic,
and Dr. Urmi Ray, Qualcomm. Each technology session may also invite a
special speaker, and more than 180 papers and over 20 posters will be
presented. Major topics are: Advanced Packaging, Substrate &
Interposer, 2.5D and 3DIC Packaging, Design/Modeling/Reliability, Thermal
Management, Materials and Process, Printed Electronics, N-MEMS,
Optoelectronics, Power Devices, RF, and Biomimetic. In addition, ASET
session, Taiwan session, and Korean session will specially be held for
intensive discussions. Also, Medical Device session will be organized for
the first time with panel discussion.
We also plan to have welcome
events to enjoy Osaka's friendly atmosphere and hospitality. We believe
ICEP2013 will provide excellent opportunities for fruitful discussions on
advanced technologies, and for developing global networks.
Finally, it is truly a great pleasure for me to serve as the
general chairperson of ICEP2013, and I would like to express my special
thanks to all the ICEP2013 Organizing Committee members for their
enthusiastic work and collaboration, to Japan Institute of Electronics
Packaging(JIEP) staff members for their continuous supports, and to many
international friends for supporting special sessions, in order to make
this conference successful.
I sincerely look forward to seeing you
in April, and wish you all a pleasant stay in Osaka.
Shintaro Yamamichi
General Chairperson ICEP2013
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