Organization

General Chair
Jun Mizuno, Waseda University

General Vice Chairs
Yoshio Nogami, Toray Engineering
Syoji Uegaki, ASE Group
Kishio Yokouchi, Fujitsu Interconnect Technologies

Finance Chair
Tomoyuki Hatakeyama, Toyama Prefectural University

Operation Committee Chair
Yoshio Nogami, Toray Engineering

OPC Vice Chair
Miki Mori, Toshiba
Hajime Hirata, Toray Engineering
Mitsuyo Miyauchi, Alpha Design

OPC Members
Yoshitaka Adachi, Omron
Toyohiro Aoki, IBM Japan
Atsunori Hattori, Noda Screen
Yoshikazu Hirayama, Toray Engineering
Maki Ito, Hitachi
Osamu Kamogawa, Air Water Materials
Yoshiteru Kono, Omron
Yutaka Mizutani, Fuji Machine MFG.
Katsumi Miyama, Hokkaido Institute of Technology
Koichiro Nagai, Sanyu Rec
Masatsugu Nimura, Toray Engineering
Taiji Sakai, Fujitsu Laboratories
Yuichi Sano, KOA
Yasunari Ukita, Toshiba
Daisuke Wakuda, Panasonic
Akira Yamauchi, Bondtech

Publication Committee Chair
Eiji Higurashi, The university of Tokyo

Publication Committee Members
Shintaro Yamamichi, IBM Japan
Hitoshi Sakamoto, NEC
Shigenori Aoki, Fujitsu Laboratories

Technical Program Committee Chair
Syoji Uegaki, ASE Group

TPC Vice Chairs
Hitoshi Sakamoto, NEC
Masahiro Inoue, Gunma University
Kazushige Toriyama, Kyocera Circuit Solutions
Osamu Suzuki, Namics
Yoichi Taira

TPC Members
Tomoyuki Abe, Fujitsu Laboratories
Yasuhiro Ando, Fujikura
Masahiro Aoyagi, National Institute of AIST
Noriyuki Fujimori, Olympus
Koichi Hasegawa, JSR
Tomoyuki Hatakeyama, Toyama Prefectural University
Sumito Hayashida, ASE Group
Eiji Higurashi, The University of Tokyo
Koichi Hirano, Panasonic
Shigeru Hiura, Toshiba
Hiroshi Hozoji, Hitachi
Kinya Ichikawa, Intel
Yu Kondo, Olympus
Shinichi Nishi, Konica Minolta
Hiroshi Nishikawa, Osaka University
Toshihisa Nonaka, Hitachi Chemical
Masaaki Oda, Japan Advanced Printed Electronics Technology
Takayuki Ohba, Tokyo Institute of Technology
Hideo Ohkuma, HTO
Tetsuya Ohnishi, Grand Joint Technology
Kazuya Okamoto, Osaka University
Yasumitsu Orii, IBM Japan
Hiroshi Ozaki, Sony
Minoru Sakata, STMicroelectronics
Shuji Sagara, Dai Nippon Printing
Koichi Shibayama, SEKISUI CHEMICAL
Akitsu Shigetou, National Institute for Materials Science
Itsuro Shishido, KYOCERA Circuit Solutions
Toshio Sudo, Power Integrity Laboratory
Fumio Uchikoba, Nihon University
Hiroshi Yamada, Toshiba
Shintaro Yamamichi, IBM Japan
Kiyokazu Yasuda, Osaka University
Yusuke Yasuda, Hitachi

International Technical Committee Members 
Charles E. Bauer, TechLead Corporation 
Shen-Li Fu, I-Shou University
Taek-Soo Kim, KAIST
Shi-Wei Ricky Lee, Hong Kong University of Sci & Tech
Wei-Chung Lo, Industrial Technology Research Institute
Guo-Quan Lu, Virginia Tech
Tae-Sung Oh, Hongik University
Yinghui Wang, The University Tokyo
Kazuaki Yazawa, Purdue University
Wenhui Zhu, Central South University

Advisory
Hironori Asai, Toshiba
Masaru Ishizuka, Toyama Prefectural University
Keisuke Uenishi, Osaka University
Kanji Otsuka, Meisei University
Atsushi Okuno, Green Planets
Ryohei Sato, Osaka University
Osamu Shimada, Dai Nippon Printing
Yuzo Shimada, Namics
Tadatomo Suga, The University of Tokyo
Katsuaki Suganuma, Osaka University
Haruo Tabata, Osaka University
Yutaka Tsukada, Ritsumeikan University
Hajime Tomokage, Fukuoka University
Hideyuki Nishida, NEP Tech. S&S
Takashi Nukii, Kyoto Research Park
Kenzo Hatada, Atomnics Laboratory
Yoshitaka Fukuoka, WEISTI
Kouzo Fujimoto, Osaka University
Fumio Miyashiro, Yokohama Jisso Consortium  
Shinichi Wakabayashi, Nagano Techno Foundation
Itsuo Watanabe, Hitachi Chemical
Kaoru Hashimoto, Meisei University